JP5307468B2 - 液滴塗布方法及び装置 - Google Patents

液滴塗布方法及び装置 Download PDF

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Publication number
JP5307468B2
JP5307468B2 JP2008198704A JP2008198704A JP5307468B2 JP 5307468 B2 JP5307468 B2 JP 5307468B2 JP 2008198704 A JP2008198704 A JP 2008198704A JP 2008198704 A JP2008198704 A JP 2008198704A JP 5307468 B2 JP5307468 B2 JP 5307468B2
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droplet
nozzle
contact angle
landing area
nozzles
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JP2010036065A5 (enExample
JP2010036065A (ja
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梓 平野
保次 鶴岡
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2008198704A 2008-07-31 2008-07-31 液滴塗布方法及び装置 Expired - Fee Related JP5307468B2 (ja)

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JP2008198704A JP5307468B2 (ja) 2008-07-31 2008-07-31 液滴塗布方法及び装置

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JP2008198704A JP5307468B2 (ja) 2008-07-31 2008-07-31 液滴塗布方法及び装置

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JP2010036065A JP2010036065A (ja) 2010-02-18
JP2010036065A5 JP2010036065A5 (enExample) 2011-09-22
JP5307468B2 true JP5307468B2 (ja) 2013-10-02

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JP2008198704A Expired - Fee Related JP5307468B2 (ja) 2008-07-31 2008-07-31 液滴塗布方法及び装置

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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146796A (ja) * 2002-09-30 2004-05-20 Seiko Epson Corp 膜パターンの形成方法、薄膜製造装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP4659345B2 (ja) * 2003-07-25 2011-03-30 芝浦メカトロニクス株式会社 塗布装置および塗布方法
JP2005119139A (ja) * 2003-10-16 2005-05-12 Seiko Epson Corp 機能液滴吐出ヘッドの吐出量測定方法およびその装置、機能液滴吐出ヘッドの駆動制御方法、液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器
JP4325483B2 (ja) * 2004-05-18 2009-09-02 セイコーエプソン株式会社 ワーク処理装置、液滴吐出装置、並びに電気光学装置の製造方法
JP4325868B2 (ja) * 2005-06-06 2009-09-02 株式会社フューチャービジョン 配線パターン形成方法および表示装置の製造装置
JP4788340B2 (ja) * 2005-12-28 2011-10-05 大日本印刷株式会社 カラーフィルタの製造方法

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