JP5302139B2 - 置換めっき層の剥離方法 - Google Patents
置換めっき層の剥離方法 Download PDFInfo
- Publication number
- JP5302139B2 JP5302139B2 JP2009201261A JP2009201261A JP5302139B2 JP 5302139 B2 JP5302139 B2 JP 5302139B2 JP 2009201261 A JP2009201261 A JP 2009201261A JP 2009201261 A JP2009201261 A JP 2009201261A JP 5302139 B2 JP5302139 B2 JP 5302139B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- electrode
- electrolytic
- jig
- gold plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 title claims description 114
- 238000006073 displacement reaction Methods 0.000 title claims description 30
- 238000000034 method Methods 0.000 title claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 77
- 229910052737 gold Inorganic materials 0.000 claims description 77
- 239000010931 gold Substances 0.000 claims description 77
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 25
- 238000009713 electroplating Methods 0.000 claims description 22
- 239000003792 electrolyte Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 52
- 206010040844 Skin exfoliation Diseases 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 4
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- ing And Chemical Polishing (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009201261A JP5302139B2 (ja) | 2009-09-01 | 2009-09-01 | 置換めっき層の剥離方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009201261A JP5302139B2 (ja) | 2009-09-01 | 2009-09-01 | 置換めっき層の剥離方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011052258A JP2011052258A (ja) | 2011-03-17 |
| JP2011052258A5 JP2011052258A5 (enrdf_load_stackoverflow) | 2012-07-19 |
| JP5302139B2 true JP5302139B2 (ja) | 2013-10-02 |
Family
ID=43941557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009201261A Active JP5302139B2 (ja) | 2009-09-01 | 2009-09-01 | 置換めっき層の剥離方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5302139B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5302140B2 (ja) * | 2009-09-01 | 2013-10-02 | 新光電気工業株式会社 | 置換めっき層の剥離方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956837A (enrdf_load_stackoverflow) * | 1972-10-04 | 1974-06-03 | ||
| JPS5278633A (en) * | 1975-12-12 | 1977-07-02 | Tokyo Shibaura Electric Co | Method of treating unplated portion of partially silver plated product |
| JPS5760093A (en) * | 1980-09-27 | 1982-04-10 | Electroplating Eng Of Japan Co | Stripping device for unnecessary plated part of ceramic package |
| JPH08988B2 (ja) * | 1987-04-18 | 1996-01-10 | 新光電気工業株式会社 | 金めつき剥離液 |
| JP3124735B2 (ja) * | 1997-03-25 | 2001-01-15 | メルテックス株式会社 | 金めっき剥離液 |
| JP4378220B2 (ja) * | 2004-05-27 | 2009-12-02 | 新光電気工業株式会社 | めっき用ラックおよびガラス端子のめっき方法 |
| JP4949994B2 (ja) * | 2007-10-24 | 2012-06-13 | 田中貴金属工業株式会社 | 複数の金属層を有する金属板から該金属層を剥離する方法 |
| JP5302140B2 (ja) * | 2009-09-01 | 2013-10-02 | 新光電気工業株式会社 | 置換めっき層の剥離方法 |
-
2009
- 2009-09-01 JP JP2009201261A patent/JP5302139B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011052258A (ja) | 2011-03-17 |
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