JP5296978B2 - Solar cell panel manufacturing system and solar cell panel manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing system for solar cell panel free from film separation in manufacturing process, and provide the manufacturing method of the solar cell panel. <P>SOLUTION: A temperature difference among the average temperature of a substrate immediately before being supplied into a laser etching device for photoelectric conversion layer, cleaning water temperature in a substrate cleaner immediately before a laser etching device for transparent electrode layer and the cleaning water temperature of the substrate cleaner immediately before a laser etching device for a rear electrode layer is specified not to be larger than &plusmn;10&deg;C. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a solar cell panel manufacturing system and a solar cell panel manufacturing method.

  A solar cell panel manufacturing system for manufacturing a solar cell panel is known. By the solar cell panel manufacturing system, a solar cell film is laminated on a translucent substrate, patterned into a plurality of power generation cells, integrated so as to be electrically connected in series, and further backsheets and terminal boxes are installed. A solar cell panel is manufactured by attaching to a panel. Examples of such a solar cell panel manufacturing system include those described in Patent Document 1. Patent Document 1 discloses a solar cell panel manufacturing system in which each process device is connected in series.

  One of the requirements for the solar cell panel manufacturing system is that the solar cell film laminated on the substrate does not peel off during the manufacturing process.

  A cleaning process is also important for preventing film peeling. Solar cell panels are manufactured through many processes. In each processing step, if foreign matter adheres to the substrate to be processed, the portion may become a short-circuit defect or may enter into the base of film formation in a subsequent step and cause peeling. Therefore, in order to remove foreign matter on the surface of the substrate to be processed, the substrate to be processed is cleaned by a cleaning device during the manufacturing process.

  As a technique related to the cleaning apparatus and the cleaning method, one described in Patent Document 2 can be cited. Patent Document 2 describes that the substrate to be treated is immersed in cleaning water and that ultrasonic vibration is applied to the cleaning water.

  Further, in Patent Document 3, during transport cleaning, the conductive brush mechanism is slidably electrically connected to the positive electrode side and negative electrode side cells of the plurality of cells or cells close to them and the peripheral region. Is described.

  Patent Document 4 describes that a transparent conductive film is deposited on a substrate and the transparent conductive film is melted by laser scribing and then washed.

  However, when the above-described cleaning method is used, the solar cell film may be peeled off in the cleaning process itself.

  The solar cell film is formed by laminating a plurality of layers. At this time, etching is performed each time the layers are stacked. Here, if the etching position deviates from the planned position, the film laminated on the upper layer may be peeled off at that portion.

  In order to prevent misalignment, Patent Document 5 describes the substrate temperature in the process of scribing the transparent electrode, the substrate temperature in the process of scribing the semiconductor layer, and the process of scribing the back electrode from the occurrence of misalignment of the scribe position. It is described that the substrate temperature is adjusted to a range within a set value ± 10 ° C.

  Patent Document 6 describes a technique for setting the temperature during laser scribing to a desired temperature. In Patent Document 6, a hot air space is formed by a hot air space forming device on a substrate support table during laser scribing, and heat is supplied to the gas in the hot air space forming device so that the temperature of the substrate is regulated. Heating is described.

JP 2005-235916 A Japanese Patent Laid-Open No. 2001-44466 Japanese Patent Laid-Open No. 2001-44467 Japanese Patent Laid-Open No. 9-8337 JP 2000-353816 A JP 2005-203574 A

  An object of the present invention is to provide a solar cell panel manufacturing system and a solar cell panel manufacturing method in which film peeling during the manufacturing process is prevented.

  Means for solving the problem is expressed as follows. Technical matters appearing in the expression are appended with numbers, symbols, etc. in parentheses. The numbers, symbols, and the like are technical matters constituting at least one embodiment or a plurality of embodiments of the present invention or a plurality of embodiments, in particular, the embodiments or examples. This corresponds to the reference numbers, reference symbols, and the like attached to the technical matters expressed in the drawings corresponding to. Such reference numbers and reference symbols clarify the correspondence and bridging between the technical matters described in the claims and the technical matters of the embodiments or examples. Such correspondence or bridging does not mean that the technical matters described in the claims are interpreted as being limited to the technical matters of the embodiments or examples.

A solar cell panel manufacturing system (1) according to the present invention includes a translucent substrate (2) and a plurality of strip-shaped power generation cells formed on a main surface of the substrate (2) and separated by a cell dividing line (3). A solar cell panel manufacturing system for manufacturing a solar cell panel (5) having a solar cell film (4) divided into (7) and integrated so as to be electrically connected in series. The transparent conductive layer forming apparatus (6) for forming the transparent conductive layer (41) on the main surface of the substrate (2) and the transparent conductive layer (41) are laser-etched corresponding to the power generation cell (7). A laser etching device for transparent conductive layer (8), a photoelectric conversion layer forming device (9) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42) Laser etching device for photoelectric conversion layer (10) that performs laser etching corresponding to cell (7), and back electrode film forming device (11) for forming back electrode film (43) on photoelectric conversion layer (42) A back electrode laser etching device (12) for laser etching the back electrode film (43) in correspondence with the power generation cell (7), and a plurality of substrate cleaners (201) for spraying cleaning water to clean the substrate A substrate cleaning section (20) having: Comprising. The substrate cleaning section (20) includes a first substrate cleaner (21) disposed between the transparent conductive layer deposition apparatus (6) and the transparent conductive layer laser etching apparatus (8), and a back electrode film deposition process. The second substrate cleaning device (22) disposed between the device (11) and the back surface electrode laser etching device (12) and the photoelectric conversion layer are formed, and then the photoelectric conversion layer laser etching device (10) is formed. The cooling unit (33) for cooling the substrate until it is put in and the substrate (2) carried out from each substrate cleaner (201) until it is carried into the next downstream processing apparatus. A natural drying section (32) for naturally drying the substrate (2) , and the first substrate cleaning device and the second substrate cleaning device are formed by the transfer roller to form the cell division line. A direction that is substantially parallel to the direction is transported as a transport direction. With reference to the substrate temperature immediately before laser etching of the photoelectric conversion layer, the cleaning water temperature of the first substrate cleaner (21) and the cleaning water temperature of the second substrate cleaner (22) are managed to be substantially constant. To do.

According to such a configuration, the cleaning water temperatures of the first substrate cleaning device (21) and the second substrate cleaning device (22) are managed with reference to the substrate temperature immediately before laser-etching the photoelectric conversion layer. The substrate temperature unloaded from the photoelectric conversion layer deposition apparatus is cooled to about 100 ° C. or less so as not to damage the rollers of the external substrate transfer line, and approaches the room temperature due to natural cooling over time. Unless a sufficient cooling time is applied to the substrate, the substrate temperature immediately after laser etching of the photoelectric conversion layer via the substrate transport is about 30 ° C. to about 50 ° C., which is higher than room temperature.
When the substrate being manufactured is cleaned by the first substrate cleaner (21), the temperature becomes close to the temperature of the cleaning water whose temperature has been adjusted. The substrate having a temperature close to the cleaning water temperature is unloaded from the first substrate cleaner (21), and laser etching of the transparent conductive layer is performed. That is, by controlling the substrate temperature at the time of laser etching the transparent conductive layer with the washing water temperature so as to reduce the temperature difference with respect to the substrate temperature measured immediately before laser etching the photoelectric conversion layer, It is possible to reduce the temperature difference of the substrate temperature during laser etching. Similarly, since the substrate temperature is managed even when it passes through the second substrate cleaning device (21), the substrate temperature at the time of back electrode film laser etching can also reduce the substrate temperature difference from that at the time of photoelectric conversion layer laser etching. Thereby, the mutual temperature difference of the substrate temperature at the time of laser etching of the photoelectric conversion layer, at the time of laser etching of the transparent conductive layer, and at the time of laser etching of the back electrode film can be reduced.

When there is a large temperature difference between the substrate temperature at the time of laser etching of the transparent electrode layer, at the time of laser etching of the photoelectric conversion layer, and at the time of laser etching of the back electrode film, the sun laminated on the substrate at the time of each laser etching Between battery films, the actual laser etching position may be different from the planned position due to the difference in relative position caused by thermal expansion due to the substrate temperature difference. Such misalignment during laser etching may cause film peeling. According to the above-described configuration, the mutual temperature difference between the substrate temperatures at the time of each laser etching can be reduced, so that a positional shift at the time of laser etching can be prevented. Therefore, film peeling can be prevented.
In particular, when a large substrate having a side exceeding 1 m is used, a positional shift during each laser etching due to a substrate temperature difference becomes serious. That is, the length of one side of the substrate: L (m), the thermal expansion length: ΔL (m), the relative temperature difference: ΔT (° C.), the linear expansion coefficient of the substrate: α (= 8.5 × 10 ^{− 6} , (/ ° C))
L = α × ΔT × L
It becomes.
Here, L = 0.5 m (based on the center center in the case of a substrate of 1 m on one side), ΔL ≦ 40 μm (accuracy within about half when the etching groove width and groove position are set to about 100 μm) T ≤ (ΔL / α / L) = 9.4 (° C)
It becomes.
Therefore, it is necessary that the temperature is within ± 10 ° C. with respect to the design reference temperature.
Further, it is desirable to reduce the deviation of the laser etching groove position within 30 μm in a large substrate. At this time, it is preferable to further reduce this temperature difference (ΔT) to within ± 7 ° C. Furthermore, it is more preferable to set the laser etching groove position deviation within ± 5 ° C. if it is less than 20 μm.

In the solar cell panel manufacturing system (1), the cooling unit (33) that cools the substrate being manufactured before the photoelectric conversion layer is deposited and then introduced into the laser etching apparatus for photoelectric conversion layer (10). ).
After the photoelectric conversion layer is formed, it takes a very long time to cool the substrate being manufactured to near room temperature by natural cooling, which causes a problem with mass production with a dedicated cooling device and an extended tact time. For this reason, the cooling unit (33) can easily cool the substrate temperature during manufacture from a temperature of about 100 ° C. to about 25 ° C. to about 40 ° C., which is higher than room temperature. For example, forced cooling by an air cooling fan can be performed. Illustrated.
Since the substrate temperature of the substrate being manufactured gradually approaches the room temperature as time passes, the substrate cooling target temperature in the cooling unit (33) is higher than the room temperature and close to the room temperature. The temperature stabilizes. However, a large cooling device and cooling time are required to bring the temperature close to room temperature, which is not desirable. For this reason, approximately 30 ° C. to approximately 40 ° C. is suitable as a target after cooling.
The substrate cleaning section (20) includes a first substrate cleaner (21) disposed between the transparent conductive layer deposition apparatus (6) and the transparent conductive layer laser etching apparatus (8), and a back electrode film deposition process. A second substrate cleaner (22), a cleaning water temperature of the first substrate cleaner (21), and a second substrate cleaner disposed between the device (11) and the laser etching device (12) for the back electrode; Since the cleaning water temperature of (22) is managed, the cleaned substrate temperature is also substantially equal to the cleaning water temperature. That is, by controlling the cleaning water temperature so that the temperature difference is less than the substrate temperature measured immediately before laser etching of the photoelectric conversion layer, the temperature difference of the substrate temperature during each laser etching is reduced. can do.
According to the above-described configuration, the substrate temperature during manufacture put into the laser etching apparatus for photoelectric conversion layer (10) can be maintained at a substantially constant temperature during the mass production process, and the substrate temperature at the time of each laser etching can be maintained. Since the mutual temperature difference can be further reduced, it is possible to further prevent positional deviation during laser etching. Therefore, film peeling can be prevented.
Further, the substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching device (10) is measured, and the cooling device (33) uses the control device (14) so that the substrate temperature becomes a more constant value. Control is preferable because the substrate temperature during manufacture can be kept at a constant temperature.
According to the above-described configuration, the mutual temperature difference between the substrate temperatures at the time of each laser etching can be reduced, so that a positional shift at the time of laser etching can be prevented and film peeling can be prevented.

In said solar cell panel manufacturing system (1), a board | substrate washing | cleaning part (20) is the 1st board | substrate arrange | positioned between the transparent conductive layer film forming apparatus (6) and the laser etching apparatus for transparent conductive layers (8). A cleaning device (21), a second substrate cleaning device (22) disposed between the back electrode film forming device (11) and the back electrode laser etching device (12), and a photoelectric conversion layer forming device ( 9) and a photoelectric conversion layer laser etching apparatus (10), and a third substrate cleaning device (36) is provided. It is preferable to manage the cleaning water temperatures of the first substrate cleaner (21), the second substrate cleaner (22), and the third substrate cleaner (36) so that the temperature difference is reduced.
The production substrate carried out from the photoelectric conversion layer deposition apparatus (9) may not be subjected to a cleaning step in order to maintain the electrical contact characteristics between the photoelectric conversion layer and the back electrode layer. However, if there is no problem in the solar cell power generation characteristics when the third substrate cleaning device (36) is installed, the generation of etching failure due to foreign matter adhering to the substrate in the laser etching apparatus for photoelectric conversion layer (10) is generated. This is preferable because the temperature of the substrate can be controlled by the cleaning water in the substrate cleaning section.
According to the above-described configuration, the mutual temperature difference between the substrate temperatures at the time of each laser etching can be further reduced, so that a positional shift at the time of laser etching can be prevented, and film peeling can be further prevented.

In the solar cell panel manufacturing system (1), a photoelectric conversion layer etching temperature sensor (13) for measuring a substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching device (10), and a control device (14). And. In the control device (14), the temperature of the cleaning water of the first substrate cleaner (21) and the second substrate cleaner (22) is small and the temperature difference between the measurement results of the photoelectric conversion layer etching temperature sensor (13) is small. It is preferable to control the operation of the first temperature controller (23) and the second temperature controller (24).
The substrate cleaning section (20) includes a first substrate cleaner (21) disposed between the transparent conductive layer deposition apparatus (6) and the transparent conductive layer laser etching apparatus (8), and a back electrode film deposition process. A first substrate controller (22) disposed between the device (11) and the back electrode laser etching device (12), and a first temperature controller for managing the cleaning water temperature of the first substrate cleaner (21) (23) and a second temperature controller (24) for managing the cleaning water temperature of the second substrate cleaner (22). The control device (14) controls the operations of the first temperature controller (23) and the second temperature controller (24) based on the measurement result of the photoelectric conversion layer etching temperature sensor (13).
According to the above-described configuration, the mutual temperature difference between the substrate temperatures at the time of each laser etching can be reduced more strictly, so that it is possible to prevent positional deviation at the time of laser etching and further prevent film peeling. it can.

In the solar cell panel manufacturing system (1), a photoelectric conversion layer etching temperature sensor (13) for measuring a substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching device (10), and a control device (14). And a third substrate cleaning device (36) disposed between the photoelectric conversion layer forming device (9) and the photoelectric conversion layer laser etching device (10).
A third temperature controller (37) for managing the cleaning water temperature of the third substrate cleaner (36) is provided. The controller (14) operates the first temperature controller (23), the second temperature controller (24), and the third temperature controller (37) based on the measurement result of the photoelectric conversion layer etching temperature sensor (13). Is preferably controlled.
According to the above-described configuration, the mutual temperature difference between the substrate temperatures at the time of each laser etching can be reduced more strictly, so that it is possible to prevent positional deviation at the time of laser etching and further prevent film peeling. it can.

  On the other hand, in the solar cell panel manufacturing system (1), at least a part of the periphery of the substrate on the main surface of the solar cell panel (5) is removed by removing the solar cell film (4) before the laminating process. Region (15). Each of the plurality of substrate cleaners (201) has a transport roller (25). A conveyance roller (25) conveys a board | substrate (2) by making a substantially parallel direction with the direction in which a cell division | segmentation line (3) is formed into a conveyance direction. The transport roller (25) contacts the opposite surface of the main surface when transporting the substrate (2), but the substrate and the transport roller are slippery inside the substrate cleaner (201), and the substrate is transported during the cleaning process. In order to suppress floating from the roller, it is preferable that the transport roller (25) is installed on both the main surface side of the substrate (2) and the opposite surface side of the main surface so as to sandwich the substrate (2). At this time, the transport roller (25) on the main surface side of the substrate is in contact with the removed region (15) from which the solar cell film (4) has been removed or the region to be removed, and the solar cell film is also processed after the lamination process. It is preferable that no contact is made in the region provided with (4).

  According to such a structure, since a conveyance roller (25) does not contact a solar cell film (4), film | membrane peeling is prevented. Further, by making the transport direction substantially parallel to the formation direction of the cell division line (3), the relative position of the transport roller (25) and the substrate being cleaned is shifted, and the roller is a solar cell film (4 ), The concavo-convex shape of each cell division line (3) exists in a direction substantially perpendicular to the substrate transport direction, so that the film is rolled up on the cell division line (3) portion, and the series connection is short-circuited. The inconvenience of deteriorating is suppressed.

In the solar cell panel manufacturing system (1), each of the substrate cleaners (201) includes a high-pressure shower unit (27) that performs cleaning with high-pressure water, and a direct water rinse unit (28) that performs cleaning with pure water. And an air knife part (29) for draining water. The high pressure shower section (27), the direct water rinse section (28), and the air knife section (29) are arranged in this order from the upstream side of the conveyance.
Further, the substrate cleaner (201) may have a roll brush part (26) for cleaning with a roll brush. A roll brush part (26) is arrange | positioned in the upstream of conveyance of a high pressure shower part (27). The roll brush can be installed in a substrate cleaner (201) disposed at a process position that does not cause physical damage to the constituent films of the solar cell film (4).

  In said solar cell panel manufacturing system (1), the high pressure shower part (27) has the nozzle (30) for high pressure showers. The high-pressure shower nozzle (30) is preferably provided so that high-pressure water is sprayed onto the substrate (2) at an angle inclined toward the upstream side of the conveyance, and the adhered foreign matter is easily washed away.

  In this way, by spraying high-pressure water at an angle inclined toward the upstream side of the conveyance, the flow rate of the cleaning water on the substrate surface is increased, and foreign substances adhering to the substrate are more effectively washed away and discharged from the substrate surface. be able to.

In the above solar cell panel manufacturing system (1), the high-pressure shower nozzle (30) has an angle formed by the high-pressure water jetting direction and a plane perpendicular to the transport direction in a range of 10 ° to 30 °. It is preferable to be provided.
If this angle is small, the flow velocity on the substrate surface cannot be increased effectively, the shearing force to the adhered foreign matter is reduced, and the foreign matter removal effect is reduced. On the contrary, if this angle is large, the washing water sprayed from the high pressure shower nozzle is attracted by gravity and the force of the washing water colliding with the attached foreign matter is lowered, and the foreign matter removing effect is lowered.

  In the solar cell panel manufacturing system (1), the control device (14) preferably swings the high pressure shower nozzle (30) in a direction substantially orthogonal to the substrate transport direction.

  In this way, by swinging the high pressure shower nozzle (30), the cleaning water can be sprayed evenly over the entire substrate, and the adhered foreign matter can be removed more uniformly.

  In said solar cell panel manufacturing system (1), each board | substrate washing | cleaning device (201) is further provided in the upstream of a roll brush part (26), and exposes a board | substrate (2) to the mist atmosphere of washing water. It is preferable to have a running part (31).

  In this way, since the substrate comes into contact with the mist of cleaning water carried over from the roll brush portion (26) by providing the running portion (31), in the step of arranging the substrate cleaner (201), The film constituting the solar cell film (4) formed on the main surface of the substrate is covered with a water film. In the roll brush part (26), cleaning with a roll brush is performed in a state of being covered with a water film. The physical damage that the roll brush gives to the solar cell constituent film is reduced by the water film covering the solar cell constituent film.

In the above solar cell panel manufacturing system (1), it is preferable that the run-up section (31) has a space for ½ to two substrates.
This is because, in order for the constituent film of the solar cell to be covered with the water film without significantly increasing the installation area of the substrate cleaner, it is necessary to have a suitable time for contact with the mist.

  The solar cell panel manufacturing system (1) preferably further includes a natural drying section (32). The natural drying section (32) is a section for naturally drying the substrate until the substrate (2) unloaded from each substrate cleaner (201) is loaded into the next downstream apparatus. .

In particular, the groove of the cell dividing line is sufficiently removed because water is sucked by surface tension due to capillary action even after draining with the air knife part (29) of the substrate cleaner (201). It is difficult. If a film forming process or the like is performed while the moisture is accumulated, the moisture is taken into the components in the film at the time of processing to deteriorate the film quality, or the moisture is rapidly evaporated, and the film is peeled off due to the impact of the evaporation. Sometimes. As described above, if the natural drying section is provided, the water accumulated in the groove of the cell dividing line is evaporated before the next process, so that it is possible to prevent film degradation due to deterioration of the film quality or rapid evaporation. .
Since the groove of the cell dividing line is narrow, the amount of water accumulated in the groove is small, and it is estimated that it evaporates within a few minutes when converted from the evaporation rate of water (about 0.2 kg / m ² · hr). The time required for natural drying is set to the same time as the tact time of each device, so that the water accumulated in the groove portion can be efficiently dried without extending the production time tube.

The solar cell panel manufacturing method concerning this invention is formed on the translucent board | substrate (2) and the main surface of a board | substrate (2), and is formed in several strip-shaped electric power generation cells (7) by the cell division line (3). A solar cell panel manufacturing method for manufacturing a solar cell panel (5) having a divided solar cell film (4). In the solar cell panel manufacturing method, a transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2), and the transparent conductive layer (41) are converted into a power generation cell ( 7) a transparent conductive layer etching step (step S40) for laser etching corresponding to 7), a photoelectric conversion layer film forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), A photoelectric conversion layer etching step (step S70) in which the photoelectric conversion layer (42) is laser-etched in correspondence with the power generation cell (7), and a back surface on which the back electrode film (43) is formed on the photoelectric conversion layer (42). Electrode film forming step (step S80) and back electrode film etching step (step S100) in which the back electrode film (43) is laser-etched corresponding to the power generation cell (7). When, comprising a plurality of cleaning steps for cleaning a substrate (2) by spraying washing water between each step (step S10,30,90,130), the.
A cleaning step (step S55) may be provided after the photoelectric conversion layer is formed. The temperature of the cleaning water sprayed in the substrate temperature measuring step (step S60) for measuring the substrate temperature immediately before the photoelectric conversion layer etching step (S70) and the substrate cleaning step (S10, 30, (55), 90, 130) is determined. And a temperature management step (step S61) to be managed. The plurality of cleaning steps (S10, 30, (55), 90, 130) is a first cleaning step for cleaning the substrate between the transparent conductive layer forming step (S20) and the transparent conductive layer etching step (S40). (Step S30) and a second cleaning step (S90) for cleaning the substrate between the back electrode film forming step (S80) and the back electrode film etching step (S100). In the temperature management step (S61), the temperature of the cleaning water sprayed in the first cleaning step (S20) and the second cleaning step (S90) is managed based on the substrate temperature measured in the substrate temperature measurement step (S60). Is done. There may be a third cleaning step (S55) for cleaning the substrate between the photoelectric conversion layer forming step (S50) and the photoelectric conversion layer etching step (S70). At this time, in addition to the above, it is preferable that the temperature of the cleaning water sprayed in the third cleaning step (S55) is additionally managed.

  In the solar cell panel manufacturing method, in the temperature management step (S61), the temperature of the cleaning water sprayed in the first cleaning step (S30) and the second cleaning step (S90) is measured in the substrate temperature measuring step (S60). It is preferable to manage the temperature so as to reduce the temperature difference.

  On the other hand, in the solar cell panel manufacturing method, at least a part of the peripheral portion of the substrate end on the main surface of the solar cell panel (5) is the removed region (15) from which the solar cell film (4) has been removed before the laminating process. ). In each of the plurality of cleaning steps (S10, 30, (55), 90, 130), the substrate is moved by the transfer roller (25) with the direction substantially parallel to the direction in which the cell division line (3) is formed as the transfer direction. Wash while transporting. When transporting the substrate (2) in each cleaning step (S10, 30, (55), 90, 130), the transport roller (25) is placed on the removal region (15) or the region to be removed and the opposite surface of the main surface. It is preferable to carry so that it contacts and does not contact in the area | region in which the solar cell film (4) was provided.

  In the above solar cell panel manufacturing method, the transport roller (25) may be arranged on both the main surface side of the substrate (2) and the opposite surface side of the main surface so as to sandwich the substrate (2). preferable.

  In the solar cell panel manufacturing method, each cleaning step (S10, 30, (55), 90, 130) includes a high-pressure shower step (step S3) for cleaning with high-pressure water and direct water for cleaning with pure water. A rinsing step (step S4) and an air knife step (step S5) for draining water are provided. The high pressure shower step (S3), the direct water rinse step (S4), and the air knife step (S5) are executed in this order. In the cleaning step, a roll brush step (step S2) for cleaning with a roll brush may be executed before the high pressure shower step (S3).

  In the solar cell panel manufacturing method described above, in the high pressure shower step (S3), it is preferable to spray high pressure water on the substrate at an angle inclined toward the upstream side of conveyance.

  In the solar cell panel manufacturing method, in the high pressure shower step (S3), the high pressure water is supplied so that the angle formed between the jet direction of the high pressure water and the plane perpendicular to the transport direction is 10 ° or more and 30 ° or less. It is preferable to spray.

  In the above solar cell panel manufacturing method, in the high pressure shower step (S3), the high pressure water is preferably sprayed while being swung in a direction substantially orthogonal to the substrate transport direction.

  In the solar cell panel manufacturing method, each cleaning step (S10, 30, (55), 90, 130) is further performed before the roll brush step (S2), and the substrate is exposed to a mist atmosphere of cleaning water. It is preferable to have a running step (step S1).

  The method for manufacturing a solar cell panel further includes a natural drying step (step S6) for naturally drying the substrate cleaned in each cleaning step (S10, 30, (55), 90, 130). Is preferred.

  The manufacturing method of the solar cell panel concerning this invention is formed on the main surface of a translucent board | substrate (2) and a board | substrate (2), and several strip-shaped electric power generation cell (7) by a cell division line (3). It is a solar cell panel manufacturing method which manufactures the solar cell panel (5) which has a solar cell film (4) divided | segmented into (4). A transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2) and laser etching the transparent conductive layer (41) in correspondence with the power generation cell (7). A transparent conductive layer etching step (step S40), a photoelectric conversion layer forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42), Photoelectric conversion layer etching step (step S70) for laser etching corresponding to the power generation cell (7), and back electrode film formation step (step S80) for forming the back electrode film (43) on the photoelectric conversion layer (42). ) And the back electrode film (43) corresponding to the power generation cell (7), the back electrode film etching step (step S100), and cleaning water is sprayed between the steps to clean the substrate. Several washing steps (step S10,30,90,130), comprises a. The plurality of cleaning steps (steps S10, 30, 90, and 130) include a first cleaning step (in which the substrate is cleaned between the transparent conductive layer forming step (step S20) and the transparent conductive layer etching step (step S40)). Step S30) and a second cleaning step (S90) for cleaning the substrate between the back electrode film forming step (S80) and the back electrode film etching step (S100). With reference to the substrate temperature before the photoelectric conversion layer etching step (step S70), the cleaning water temperature in the first cleaning step and the cleaning water temperature in the second cleaning step are managed. The average substrate temperature before the photoelectric conversion layer etching step (step S70), the cleaning water temperature in the first cleaning step, and the cleaning water temperature in the second cleaning step are preferably within ± 10 ° C.

  The manufacturing method of the solar cell panel is formed on the main surface of the translucent substrate (2) and the substrate (2), and is divided into a plurality of strip-shaped power generation cells (7) by the cell dividing line (3). A solar cell panel manufacturing method of manufacturing a solar cell panel (5) having a solar cell film (4). A transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2) and laser etching the transparent conductive layer (41) in correspondence with the power generation cell (7). A transparent conductive layer etching step (step S40), a photoelectric conversion layer forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42), Photoelectric conversion layer etching step (step S70) for laser etching corresponding to the power generation cell (7), and back electrode film formation step (step S80) for forming the back electrode film (43) on the photoelectric conversion layer (42). ) And the back electrode film (43) corresponding to the power generation cell (7), the back electrode film etching step (step S100), and cleaning water is sprayed between the steps to clean the substrate. And several washing steps (step S10,30,90,130), comprising a cooling step of cooling before the substrate is introduced into the photoelectric conversion layer for laser etching device. The plurality of cleaning steps (steps S10, 30, 90, and 130) include a first cleaning step (in which the substrate is cleaned between the transparent conductive layer forming step (step S20) and the transparent conductive layer etching step (step S40)). Step S30) and a second cleaning step (S90) for cleaning the substrate between the back electrode film forming step (S80) and the back electrode film etching step (S100). The cleaning water temperature in the first cleaning step and the cleaning water temperature in the second cleaning step are managed with reference to the substrate temperature after the cooling step.

  In the solar cell panel manufacturing method, in the cooling step, the cleaning water temperature in the first cleaning step (S30) and the second cleaning step (S90) is the substrate average temperature immediately before being introduced into the laser etching apparatus for photoelectric conversion layer. It is preferable to control the cooling operation so that the temperature is within ± 10 ° C.

  The manufacturing method of the solar cell panel is formed on the main surface of the translucent substrate (2) and the substrate (2), and is divided into a plurality of strip-shaped power generation cells (7) by the cell dividing line (3). A solar cell panel manufacturing method of manufacturing a solar cell panel (5) having a solar cell film (4). A transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2) and laser etching the transparent conductive layer (41) in correspondence with the power generation cell (7). A transparent conductive layer etching step (step S40), a photoelectric conversion layer forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42), Photoelectric conversion layer etching step (step S70) for laser etching corresponding to the power generation cell (7), and back electrode film formation step (step S80) for forming the back electrode film (43) on the photoelectric conversion layer (42). ) And the back electrode film (43) corresponding to the power generation cell (7), the back electrode film etching step (step S100), and cleaning water is sprayed between the steps to clean the substrate. Several washing steps (step S10,30,55,90,130), comprises a. The plurality of cleaning steps (steps S10, 30, 55, 90, and 130) is a first cleaning that cleans the substrate between the transparent conductive layer forming step (step S20) and the transparent conductive layer etching step (step S40). A second cleaning step (S90) for cleaning the substrate between the step (step S30), the back electrode film forming step (S80) and the back electrode film etching step (S100), and the photoelectric conversion layer forming step (S50) ) And the photoelectric conversion layer etching step (S70), and a third cleaning step (S55) for cleaning the substrate. The cleaning water temperature of the first cleaning step, the cleaning water temperature of the second cleaning step, and the cleaning water temperature of the third cleaning step are managed.

  The manufacturing method of the solar cell panel is formed on the main surface of the translucent substrate (2) and the substrate (2), and is divided into a plurality of strip-shaped power generation cells (7) by the cell dividing line (3). A solar cell panel manufacturing method of manufacturing a solar cell panel (5) having a solar cell film (4). A transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2) and laser etching the transparent conductive layer (41) in correspondence with the power generation cell (7). A transparent conductive layer etching step (step S40), a photoelectric conversion layer forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42), Photoelectric conversion layer etching step (step S70) for laser etching corresponding to the power generation cell (7), and back electrode film formation step (step S80) for forming the back electrode film (43) on the photoelectric conversion layer (42). ) And the back electrode film (43) corresponding to the power generation cell (7), the back electrode film etching step (step S100), and cleaning water is sprayed between the steps to clean the substrate. And several washing steps (step S10,30,90,130), it includes a temperature measuring step of measuring the substrate temperature immediately before it is put into the photoelectric conversion layer for laser etching device (step S60), the. The plurality of cleaning steps (steps S10, 30, 90, and 130) include a first cleaning step (in which the substrate is cleaned between the transparent conductive layer forming step (step S20) and the transparent conductive layer etching step (step S40)). Step S30), a second cleaning step (S90) for cleaning the substrate between the back electrode film forming step (S80) and the back electrode film etching step (S100), and the cleaning water temperature in the first cleaning step is measured. A first temperature measuring step, and a second temperature measuring step for measuring a cleaning water temperature in the second cleaning step. Based on the substrate temperature in the temperature measurement step, the cleaning water temperature measured in the first temperature measurement step and the second temperature measurement step is controlled.

  The manufacturing method of the solar cell panel is formed on the main surface of the translucent substrate (2) and the substrate (2), and is divided into a plurality of strip-shaped power generation cells (7) by the cell dividing line (3). A solar cell panel manufacturing method of manufacturing a solar cell panel (5) having a solar cell film (4). A transparent conductive layer forming step (step S20) for forming a transparent conductive layer (41) on the main surface of the substrate (2) and laser etching the transparent conductive layer (41) in correspondence with the power generation cell (7). A transparent conductive layer etching step (step S40), a photoelectric conversion layer forming step (step S50) for forming a photoelectric conversion layer (42) on the transparent conductive layer (41), and a photoelectric conversion layer (42), Photoelectric conversion layer etching step (step S70) for laser etching corresponding to the power generation cell (7), and back electrode film formation step (step S80) for forming the back electrode film (43) on the photoelectric conversion layer (42). ) And the back electrode film (43) corresponding to the power generation cell (7), the back electrode film etching step (step S100), and cleaning water is sprayed between the steps to clean the substrate. Several washing steps (steps S10, 30, 55, 90, 130), a cooling step for cooling the substrate before being put into the laser etching apparatus for photoelectric conversion layer, and a laser etching apparatus for photoelectric conversion layer And a temperature measuring step (step S60) for measuring the substrate temperature immediately before starting. The plurality of cleaning steps (steps S10, 30, 55, 90, and 130) is a first cleaning that cleans the substrate between the transparent conductive layer forming step (step S20) and the transparent conductive layer etching step (step S40). A second cleaning step (S90) for cleaning the substrate between the step (step S30), the back electrode film forming step (S80) and the back electrode film etching step (S100), and the cleaning water temperature in the first cleaning step Between the first temperature measuring step for measuring the temperature, the second temperature measuring step for measuring the temperature of the washing water in the second cleaning step, the photoelectric conversion layer deposition step (S50) and the photoelectric conversion layer etching step (S70). And a third cleaning step (S55) for cleaning the substrate. Based on the temperature measurement step, the cleaning water temperature measured in the first temperature measurement step, the second temperature measurement step, and the third temperature measurement step is controlled.

A solar cell panel manufacturing system (1) according to the present invention is formed on a main surface of a translucent substrate (2) and a substrate (2), and a plurality of strip-shaped power generation cells (3) by a cell dividing line (3). A solar cell film (4) divided into 7) and a removal region (15) provided on at least a part of the main surface of the substrate (2) and from which the solar cell film (4) has been removed. It is a solar cell panel manufacturing system which manufactures a battery panel (5). The solar cell panel manufacturing system (1) includes a substrate cleaning device (201) for cleaning by spraying cleaning water onto a substrate being manufactured. The substrate cleaner (201) has a transport roller (25) for transporting the substrate. A conveyance roller (25) conveys a board | substrate by making a substantially parallel direction with the direction in which a cell division | segmentation line (3) is formed into a conveyance direction. The transport roller (25) is disposed on both the main surface side of the substrate (2) and the surface opposite to the main surface so as to sandwich the substrate (2) when transporting the substrate (2), and is removed on the main surface side. The contact is made in the region (15) or the region to be removed, but not in the region where the solar cell film (4) is provided.

  In the solar cell panel manufacturing system (1), the substrate cleaner (201) has the transport rollers (25) arranged on both the main surface side of the substrate and the opposite surface side of the main surface so as to sandwich the substrate. It is preferable that

  In the solar cell panel manufacturing system (1), the substrate cleaner (201) includes a high-pressure shower unit (27) for cleaning with high-pressure water, a direct water rinse unit (28) for cleaning with pure water, And an air knife part (29) for performing The high-pressure shower part (27), the direct water rinse part (28), and the air knife part (29) are preferably arranged in this order from the upstream side of conveyance. In some cases, a roll brush part (26) for cleaning with a roll brush is installed on the upstream side of conveyance from the high pressure shower part (27).

  In said solar cell panel manufacturing system (1), the high pressure shower part (27) has the nozzle (30) for high pressure showers. The high-pressure shower nozzle (30) is preferably provided so that high-pressure water is sprayed onto the substrate at an angle inclined toward the upstream side of conveyance.

  In the above solar cell panel manufacturing system (1), the high-pressure shower nozzle (30) has an angle formed by the high-pressure water jetting direction and a plane perpendicular to the transport direction in a range of 10 ° to 30 °. It is preferable to be provided.

  In the solar cell panel manufacturing system (1), the high pressure shower nozzle (30) preferably swings in a direction substantially orthogonal to the substrate transport direction.

  In the solar cell panel manufacturing system (1), the substrate cleaner (201) is further provided on the upstream side of the roll brush unit (26), and the runner (31) exposes the substrate to a mist atmosphere of cleaning water. ).

  In the above solar cell panel manufacturing system (1), it is preferable that the run-up section (31) has a space for ½ to two substrates.

  In the solar cell panel manufacturing system (1), the substrate unloaded from each of the substrate cleaners (201) is naturally dried before being loaded into the next downstream apparatus. It is preferable to provide a natural drying section (32) which is a section for the purpose.

  According to the present invention, a solar cell panel manufacturing system and a solar cell panel manufacturing method in which film peeling is prevented in the manufacturing process are provided.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram showing a structure of a main part of a solar cell panel 5 manufactured by the solar cell panel manufacturing system according to the present embodiment. The solar cell panel 5 includes a translucent substrate 2 and a solar cell film 4 formed on the substrate 2. Note that an adhesive sheet, a back sheet, a terminal box, and the like are attached on the solar cell film 4 to form a solar cell panel 5. In FIG. 1, only the substrate 2 and the solar cell film 4, that is, only the module portion. Is drawn.

  As shown in FIG. 1A, the solar cell film 4 is provided on the center side of the substrate 2. The peripheral edge of the substrate 2 is a removal region 14 from which the solar cell film 4 has been removed. The removal region 14 is provided to ensure a healthy adhesive / seal surface with the adhesive sheet.

  The solar cell film 4 is divided into a plurality of power generation cells 7 by the cell dividing line 3. Each of the plurality of power generation cells 7 has a strip shape. The plurality of power generation cells 7 are arranged with their long sides adjacent to each other, and are electrically connected in series.

  FIG. 1B is a sectional view showing a longitudinal section (YY ′ section) of the power generation cell 7. As shown in FIG. 1B, the solar cell film 4 has a structure in which a transparent conductive layer 41, a photoelectric conversion layer 42, and a back electrode layer 43 are laminated in this order from the substrate 2 side. . Further, the solar cell film 4 is provided with an insulating groove 16 along a side parallel to the short side direction of each power generation cell 7. In the insulating groove 16 portion, the solar cell film 4 is removed, and the inner and outer solar cell films 4 are insulated.

  FIG. 1C is a view showing a cross section (XX ′ cross section) of the power generation cell 7 in the short side direction. The cell dividing line 3 that divides the power generation cells 7 is formed by three grooves. That is, the groove 3-1 for separating the transparent conductive film 41, the groove 3-2 for separating the photoelectric conversion layer 42, and the groove 3-3 for separating the back electrode film 43. The groove 3-1 is buried with the photoelectric conversion layer 42. The groove 3-2 is filled with the back electrode film 43. Adjacent power generation cells 7 are electrically connected in series by the back electrode film 43 embedded in the groove 3-2. In addition, among the plurality of power generation cells 7, the power generation cells 7 located at both ends are current collection cells. Although not shown in the figure, the current collection cell is connected to wiring for external extraction, and the electric power generated in each power generation cell is taken out to the outside.

  The solar cell panel 5 having such a structure is manufactured by a solar cell panel manufacturing system 1 as shown in FIG. FIG. 2 is a diagram showing a layout of the device configuration of the solar cell panel manufacturing system 1. The solar cell panel manufacturing system 1 includes a substrate carry-in device, a substrate cleaning device 201, a transparent electrode film forming device 6, a first substrate cleaning device 21, a transparent electrode laser etching device 8, and a substrate cleaning device 201 from the upstream side of processing. , Photoelectric conversion layer forming apparatus 9, photoelectric conversion layer laser etching apparatus 10, back electrode film forming apparatus 11, second substrate cleaning device 22, back electrode laser etching apparatus 12, power generation inspection apparatus, substrate buffer apparatus, film polishing The apparatus, the substrate cleaner 201, the lay-up apparatus, the laminator apparatus, the paneling apparatus, the terminal box mounting apparatus, the power generation inspection apparatus, and the performance-specific sorting storage are arranged in this order. The solar cell panel manufacturing system 1 is provided with a control device 14 that controls the operation of each device.

  When the interface characteristics between the photoelectric conversion layer 42 and the back electrode layer 43 are less affected by cleaning, a third substrate cleaner is provided between the photoelectric conversion layer forming apparatus 9 and the photoelectric conversion layer laser etching apparatus 10. 36 may be provided.

  FIG. 3 is a flowchart of the solar cell panel manufacturing method according to the present embodiment. The solar cell panel 5 is manufactured by steps S10 to 190 shown in FIG. FIG. 4 is a diagram showing a structure in the manufacturing process of the solar cell panel 5. Processing in each step will be described with reference to FIGS.

Step S10: Cleaning, FIG. 4A (1)
First, the board | substrate 2 is carried in in the solar cell panel manufacturing system 1 with a board | substrate carrying-in apparatus. As the substrate 2, a soda float glass substrate (1.4 m × 1.1 m × plate thickness: 4 mm) is used. The substrate 2 is preferably subjected to corner chamfering or R chamfering to prevent breakage. The loaded substrate 2 is cleaned by the substrate cleaner 201.

Step S20: Formation of transparent conductive layer, FIG. 4A (2)
A transparent conductive layer 41 is formed on the main surface of the substrate 2 by the transparent electrode film forming apparatus 6. A transparent electrode film mainly composed of a tin oxide film (SnO ₂ ) is formed as a transparent conductive layer 2 at a temperature of about 500 ° C. using a thermal CVD apparatus (transparent electrode film forming apparatus 6) at about 500 ° C. At this time, a texture with appropriate irregularities is formed on the surface of the transparent electrode film. As the transparent conductive layer 41, in addition to the transparent electrode film, an alkali barrier film (not shown) may be formed between the substrate 2 and the transparent electrode film. The alkali barrier film can be formed by forming a silicon oxide film (SiO ₂ ) at a temperature of about 500 ° C. using a thermal CVD apparatus at 50 to 150 nm.

Step S30: Cleaning The substrate to be processed after the processing by the transparent electrode film forming apparatus 6 is cleaned by the first substrate cleaner 21.

Step S40; laser etching, FIG. 4A (3)
Subsequently, the substrate to be processed is placed on an XY table. As shown in FIG. 4A (3), the first harmonic (1064 nm) of the YAG laser (transparent electrode laser etching apparatus 8) is applied to the film surface of the transparent electrode film as shown by the arrow in FIG. 4 (3). Incident from the side. Pulse oscillation: The laser power is adjusted to 5 to 20 kHz so as to be suitable for the processing speed. Laser etching is performed so that the transparent electrode film is divided into strips having a width of about 6 to 10 mm in a direction perpendicular to the series connection direction of the power generation cells 7. Thereby, the groove | channel 3-1 which divides | segments a transparent electrode film is formed. The substrate to be processed that has been processed by the laser etching apparatus 8 is cleaned by a substrate cleaner.

Step S50: Film formation of photoelectric conversion layer, FIG. 4A (4)
As shown in FIG. 4A (4), a plasma CVD apparatus (photoelectric conversion layer forming apparatus 9) is used to form a p-layer made of an amorphous silicon thin film as a photoelectric conversion layer 42 in a reduced pressure atmosphere: 30 to 150 Pa at about 200 ° C. A film / i-layer film / n-layer film is sequentially formed. The photoelectric conversion layer 42 is formed on the transparent conductive layer 41 using SiH ₄ gas and H ₂ gas as main raw materials. The p-layer, i-layer, and n-layer are stacked in this order from the sunlight incident side. In this embodiment, the photoelectric conversion layer 42 is a p-layer: B-doped amorphous SiC and a film thickness of 10 to 30 nm, an i-layer: amorphous Si and a film thickness of 250-350 nm, and an n-layer: p-doped microcrystalline Si. The film thickness is 30 to 50 nm. Further, a buffer layer may be provided between the p layer film and the i layer film in order to improve the interface characteristics.

  The substrate is unloaded from the photoelectric conversion layer deposition apparatus 9 at about 100 ° C., but the temperature drops due to natural cooling during the transfer, and the substrate temperature becomes close to room temperature if left for a long time. However, the substrate is transported to the photoelectric conversion layer laser etching apparatus when the substrate is cooled to some extent in order not to spend much production time in the mass production process.

Step S70; laser etching, FIG. 4A (5)
Subsequently, the substrate is placed on an XY table. As shown in FIG. 4A (5), the second harmonic (532 nm) of the laser diode-pumped YAG laser (photoelectric conversion layer laser etching apparatus 10) is photoelectrically converted as indicated by the arrow in FIG. 4A (5). The light is incident from the film surface side of the layer 42. Pulse oscillation: 10 to 20 kHz, the laser power is adjusted so as to be suitable for the processing speed, and the lateral side of about 100 μm to 150 μm of the laser etching line (groove 3-1) of the transparent conductive layer 41 is laser etched. Thereby, the groove | channel 3-2 which divides | segments the photoelectric converting layer 42 is formed.

Step S80: Back electrode layer deposition, FIG. 4A (6)
As shown in FIG. 4A (6), as the back electrode layer 43, an Ag film / Ti film is sequentially formed at about 150 ° C. in a reduced pressure atmosphere by a sputtering apparatus (back electrode film forming apparatus 11). In this embodiment, the back electrode layer 43 is formed by stacking an Ag film: 200 to 500 nm and a Ti film having a high anticorrosion effect: 10 to 20 nm in this order as a protective film. For the purpose of reducing the contact resistance between the n layer and the back electrode layer 43 and improving the light reflection, a GZO (Ga doped ZnO film) is formed between the photoelectric conversion layer 42 and the back electrode layer 43 with a film thickness of 50 to 100 nm by a sputtering apparatus. A film may be formed.

Step S90: Cleaning The substrate to be processed that has been processed by the back electrode film forming apparatus 11 is cleaned by the second substrate cleaner 22.

Step S100; laser etching, FIG. 4A (7), (8)
Subsequently, the substrate is placed on an XY table. As shown in FIG. 4 (7), the second harmonic (532 nm) of the laser diode-pumped YAG laser (back surface electrode laser etching apparatus 12) is on the substrate 2 side as shown by the arrow in FIG. 4A (7). , The laser light is absorbed by the photoelectric conversion layer 42, and the back electrode layer 43 is exploded and removed using the high gas vapor pressure generated at this time. The laser power is adjusted so that the pulse oscillation is 1 to 10 kHz and the processing speed is appropriate, and the lateral side of the laser etching line (groove 3-1) of the transparent conductive layer 41 from about 250 μm to 400 μm is laser etched. Thereby, the groove | channel 3-3 which divides | segments the back surface electrode layer 43 is formed.

  Further, as shown in FIG. 4A (8), the insulating groove 16 is formed by laser etching at a position of 5 to 15 mm from the end of the substrate to be processed. At this time, the insulating groove 16 is formed along two opposing sides of the four sides of the substrate to be processed. Insulating grooves are not provided for the other two sides. Specifically, first, the substrate to be processed is placed on an XY table. Then, the second harmonic (532 nm) of the laser diode pumped YAG laser (laser etching apparatus 12) is incident from the substrate 2 side. The laser power is adjusted to a pulse oscillation of 1 to 10 kHz so as to be appropriate for the processing speed. As a result, the laser light is absorbed by the transparent conductive layer 41 and the photoelectric conversion layer 42. Due to the high gas vapor pressure generated at this time, the back electrode layer 43 is exploded and removed.

  As described above, a solar cell module in which a plurality of strip-shaped power generation cells 7 are formed on the substrate 2 is formed.

Step S110: photoelectric inspection, FIG. 4B (1)
Subsequently, as shown in FIG. 4B (1), a power generation inspection of the solar cell module is performed. The solar cell module is irradiated with direct light by a solar simulator. The solar cell module generates power in response to light irradiation. The power generation characteristics (current, voltage, output, etc.) at this time are measured. Here, the solar cell module whose power generation characteristics are within the standard is conveyed to the next step. On the other hand, the solar cell module that was out of specification is not sent to the next step and is processed as a defective product. Alternatively, a reproduction process is performed.

Step S120; film polishing, FIG. 4B (2)
As shown in FIG. 4B (2), the solar cell film in the portion that becomes the outer peripheral portion of the solar cell panel is removed by the film polishing apparatus. This is to ensure a healthy adhesion / seal surface when the back sheet is pasted via EVA (ethylene vinyl acetate copolymer) or the like in a later step. The solar cell film 4 at 5 to 15 mm from the end of the substrate to be processed and closer to the substrate to be processed than the insulating groove 16 is polished and removed by blasting, grinding stone polishing, or the like.

Step S130: Cleaning The substrate to be processed that has been processed by the film polishing apparatus is cleaned by the substrate cleaning device 201. Thereby, polishing scraps and abrasive grains are removed.

Steps S140, 150, 160; layup, lamination, panelization, FIG. 4B (3)
As shown in FIG. 4B (3), the EVA sheet and the cover sheet are placed on the substrate to be processed by the layup device, the laminating device, and the paneling device. Further, the cover sheet placed on the substrate to be processed is bonded via the EVA sheet by the laminator device. Furthermore, it is panelized.

Step S170: Terminal block installation, FIG. 4B (4), (5)
As shown in FIG. 4B (4), the terminal block is mounted by the terminal block mounting device. Further, as shown in FIG. 4B (5), a sealant is injected into the terminal box. Thereby, the solar cell panel 5 is obtained.

Step S180: photoelectric inspection, FIG. 4B (6)
Subsequently, as shown in FIG. 4B (6), the power generation characteristics of the solar cell panel 5 are inspected by the photoelectric inspection device. The inspection in this step is the same as the process of the power generation inspection (S110) of the solar cell module. That is, the characteristics of power generation are inspected by the solar simulator.

Step S190: Sorting The solar cell panel 5 for which the power generation inspection (S180) has been completed is transported to the performance sorting storage. Sorting is performed in the performance sorting storage 26.

  The solar cell panel 5 is manufactured by the processing of steps S10 to 190 described above. Here, among the above steps, the cleaning water temperature in the cleaning process (S30) immediately before etching the transparent electrode film and the cleaning water temperature in the cleaning process (S90) immediately before etching the back electrode film are photoelectric conversions. The layer is devised to be within ± 10 ° C. with respect to the substrate average temperature immediately before the etching step (S70).

  Further, the substrate temperature immediately before the photoelectric conversion layer is laser-etched is higher than room temperature because heat is applied to about 200 ° C. during the formation of the photoelectric conversion layer, and is carried out of the photoelectric conversion device 9 to be output from the photoelectric conversion layer. The substrate temperature immediately before laser etching is, for example, about 30 ° C. to 60 ° C. On the other hand, since the cleaning water used for the substrate cleaning device is usually pressurized to a constant pressure of about 2 MPa for high-pressure cleaning, the water temperature also rises. Since the pressure of the increased pressure is managed to maintain the cleaning performance, the cleaning water temperature can be easily maintained at a constant temperature of 30 ° C. or more without being subject to seasonal fluctuations. Even when the substrate temperature immediately before the photoelectric conversion layer is laser-etched is higher than 30 ° C., it is easy to raise the cleaning water temperature using an auxiliary heater or the like. Since the substrate temperature is close to the cleaning water temperature of each substrate cleaner, it is possible to easily reduce the temperature difference between the substrates in each laser etching step. Here, aligning the substrate temperature to the room temperature level before all laser etching steps requires that the substrate temperature (for example, about 30 ° C. to 40 ° C.) immediately before the photoelectric conversion layer is laser etched be further cooled to the room temperature level. For this cooling, it is necessary to provide a substrate cooling means having a high cooling capacity that can cope with the cooling time allowed for the manufacturing tact. Therefore, maintaining the cleaning water temperature at a constant temperature of 30 ° C. or more when the substrate temperature immediately before laser etching of the photoelectric conversion layer is about 30 ° C. to about 40 ° C. is a very simple and efficient means. It is valid.

  Further, when the third substrate cleaner 36 is provided between the photoelectric conversion layer deposition apparatus 9 and the laser etching apparatus 10, the first substrate cleaner, the second substrate cleaner, and the third substrate cleaner 36. The washing water temperature is preferably within ± 5 ° C. In this way, all the substrate temperatures in each laser etching step are close to the cleaning water temperature, and the temperature difference between the substrates can be reduced more reliably. The substrate temperature is close to the cleaning water temperature of each substrate cleaner, but there may be a temperature difference within several degrees Celsius, so that the temperature difference between the substrates before each laser etching process is within ± 10 ° C. The temperature of the washing water is preferably within ± 5 ° C.

  Next, the reason why film peeling can be prevented by preventing misalignment will be described with reference to FIG.

  FIG. 5 shows (a) when etching is performed as planned, (b) when the transparent conductive layer is etched (S40) when the substrate temperature is higher than planned, and (c) when the photoelectric conversion layer is etched (S70). FIG. 4 is a diagram showing a cross-sectional structure of the solar cell film 4 portion when the substrate temperature is higher than the plan at (d) when the substrate temperature is higher than the plan at the time of etching the back electrode layer (S100). is there.

  As shown in FIG. 5A, when the etching is performed as planned, the grooves 3-1, 3-2, and 3-3 are provided so as not to overlap each other. A groove 3-2 is provided between the groove 3-1 and the groove 3-3. The width of each groove is 20 μm to 50 μm for the groove 3-1, 100 μm to 150 μm for the groove 3-2, and 50 μm to 100 μm for the groove 3-3. A distance of 100 μm to 150 μm is provided from the groove 3-1 to the groove 3-2. A distance of 250 μm to 400 μm is provided from the groove 3-1 to the groove 3-3.

  On the other hand, as shown in FIG. 5B, when the substrate temperature is higher than planned when the transparent conductive layer is etched, the transparent conductive layer 41 is divided because the substrate 2 is large due to thermal expansion. The position of the groove 3-1 is shifted to the groove 3-2 side. As described above, when the groove 3-1 is displaced toward the groove 3-2, the groove 3-1 and the groove 3-2 may overlap each other. In the overlapping part of the groove 3-1 and the groove 3-2, the back electrode layer 43 is buried in an insufficient state. That is, the back electrode layer 43 is embedded in a slight gap while partially creating a gap. In such a gap portion, the adhesive force of the back electrode layer 43 becomes unstable and easily peels off.

  On the other hand, as shown in FIG. 5C, when the substrate temperature is higher than the plan during etching of the photoelectric conversion layer 42, the position of the groove 3-2 dividing the photoelectric conversion layer 42 is on the groove 3-3 side. Shift. In such a case, since the photoelectric conversion layer 42 and the back electrode layer 43 are removed in the groove 3-3, the portion embedded in the back electrode layer 43 is in the groove 3-3 in the groove 3-2. Only the parts that do not overlap. Originally, as shown in FIG. 5A, the back electrode layer 43 must be connected to the transparent conductive layer 41 with a width of 50 μm to 100 μm in the groove 3-2, but in the case of FIG. The width of the back electrode layer 43 embedded in the groove 3-2 is remarkably reduced. In some cases, the connection state between the back electrode layer 43 and the transparent conductive layer 41 becomes insufficient. In this way, the width of the back electrode layer 43 that remains without being etched when the groove 3-2 is formed is reduced, so that the adhesive strength at this portion is reduced and peeling is likely to occur. Moreover, the output of the solar cell panel tends to decrease due to an increase in electrical resistance.

  Further, as shown in FIG. 5D, when the substrate temperature is higher than planned when the back electrode layer 43 is etched, the position of the groove 3-3 dividing the back electrode layer 43 is the groove 3-2. It will shift to the opposite side. In such a case, the adhesive strength of each layer does not decrease, but the area where power generation can be performed decreases, so the output as a solar cell decreases.

  As described above, according to the present embodiment, the step of laser-etching the transparent conductive layer 41 (S40), the step of laser-etching the photoelectric conversion layer 42 (S70), and the step of laser-etching the back electrode layer 43 In (S100), since the laser etching can be performed by reducing the temperature difference between the substrates carried into the respective laser etching apparatuses, it is possible to prevent the displacement of the etching. Etching displacement can be prevented, so that film peeling can be prevented.

(Second Embodiment)
A second embodiment will be described. FIG. 6 is a diagram showing a layout of the solar cell panel manufacturing system 1 according to the present embodiment. In the solar cell panel manufacturing system 1 of the present embodiment, a substrate cooling unit 33 is further added between the photoelectric conversion layer forming apparatus 9 and the photoelectric conversion layer laser etching apparatus 10 as compared to the first embodiment. Have been devised. In addition, since it is the same as that of 1st Embodiment about structures other than the cooling part 33, description is abbreviate | omitted.

  An example of the cooling unit 33 is a fan.

  FIG. 7 shows a flowchart of the solar cell panel manufacturing method according to the present embodiment. Compared with the first embodiment, a cooling process (step S65) is added.

  In the cooling step (S65), the cooling unit 33 sets the average temperature of the substrate immediately before being introduced into the photoelectric conversion layer laser etching apparatus 10 to the cleaning water temperature of the substrate cleaning device 21 and the cleaning water of the substrate cleaning device 22. The temperature is controlled to be ± 10 ° C. or lower.

  Since heat is applied to about 200 ° C. during the formation of the photoelectric conversion layer, the temperature is higher than room temperature, and the air is cooled from the photoelectric conversion device 9 at about 100 ° C. until the photoelectric conversion layer is laser-etched. The substrate average temperature is cooled from about 30 ° C. to about 40 ° C. with a forced cooling device using A few minutes is enough to forcibly cool the room air of about 25 ° C. with a fan and cool the average substrate temperature from 30 ° C. to about 40 ° C., and there is no influence on the tact time of mass production processing.

  In addition, since the substrate temperature approaches room temperature (about 25 ° C.) and the temperature difference from the cooling medium decreases, it takes a considerable time for the substrate temperature to change from about 30 ° C. to room temperature by natural cooling. For this reason, the substrate temperature cooled to about 30 ° C. is stable with little temperature change over a relatively long period of time longer than the laser etching processing time.

  On the other hand, since the cleaning water used for the substrate cleaning device is usually pressurized to a certain controlled pressure of about 2 MPa for high-pressure cleaning, the water temperature also rises, and the cleaning water temperature is not subject to seasonal fluctuations, and is about 30 A constant temperature of ° C can be maintained. When the average substrate temperature immediately before the photoelectric conversion layer is laser-etched is higher than 30 ° C. and close to 40 ° C., the cleaning water temperature is raised using an auxiliary heater or the like. For this reason, it is possible to stably reduce the temperature difference of the substrate in each laser etching step.

  As described above, according to the present embodiment, the step of laser etching the transparent conductive layer 41 (S40), the step of laser etching the photoelectric conversion layer 42 (S70), and the step of laser etching the back electrode layer 43 ( In S100), the temperature difference between the substrates carried into the respective laser etching apparatuses can be further reduced to perform the laser etching, so that the etching misalignment can be prevented. Etching displacement can be prevented, so that film peeling can be prevented.

(Third embodiment)
A third embodiment will be described. FIG. 8 is a layout diagram of the solar cell panel manufacturing system 1 according to this embodiment. The solar cell panel manufacturing system 1 of the present embodiment is further provided with a temperature sensor 13 immediately upstream of the photoelectric conversion layer laser etching apparatus 10 with respect to the first embodiment, and the cleaning water temperature of the substrate cleaner A control device 14 is provided and devised. Further, a first temperature controller 23 for managing the cleaning water temperature of the first substrate cleaner and a second temperature controller 24 for managing the cleaning water temperature of the second substrate cleaner are added. In FIG. 8, the first temperature controller 23 and the second temperature controller 24 are not shown.

  The temperature sensor 13 measures the substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching apparatus. The control device 14 is, for example, a computer having a CPU, a memory, and the like, and realizes its function by a program installed in advance. In addition, since it is the same as that of 1st Embodiment about structures other than the above-mentioned point, description is abbreviate | omitted.

  FIG. 9 is a flowchart of the solar cell panel manufacturing method according to the present embodiment. Compared to the first embodiment, a step of performing temperature measurement (step S60) and a step of performing temperature management (step S61) are added. The other steps are the same as those in the first embodiment.

Steps S60, 61; Temperature measurement, temperature management As shown in FIG. 4A (4), by the plasma CVD apparatus (photoelectric conversion layer film forming apparatus 9), following the film formation of the photoelectric conversion layer 42, by the temperature sensor 13. The substrate temperature is measured. The substrate temperature is measured immediately before the next laser etching process. The temperature sensor 13 notifies the control device 14 of the measurement result of a representative point near the center or a plurality of points in the substrate. The control device 14 controls the cleaning water temperature of the first substrate cleaner 21 and the second substrate cleaner 22 with respect to the average substrate temperature calculated based on the measurement result, and the value of the temperature sensor 13 and the first The temperature difference between the cleaning water temperatures of the substrate cleaner 21 and the second substrate cleaner 22 is reduced. Specifically, the temperature difference between the substrate average temperature and each cleaning water temperature is controlled to be within ± 10 ° C.

  FIG. 10 is a block diagram showing a configuration of a main part of the solar cell panel manufacturing system 1. As shown in FIG. 10, a first temperature controller 23 that manages the temperature of the cleaning water is connected to the first substrate cleaner 21. A second temperature controller 24 that manages the temperature of the cleaning water is also connected to the second plate cleaner 22. A temperature sensor 13 for measuring the temperature of the substrate is provided on the upstream side of the photoelectric conversion layer laser etching apparatus 10. The substrate temperature immediately before being carried into the photoelectric conversion layer laser etching apparatus 10 is measured by the temperature sensor 13. The measurement can be performed by a non-contact type measurement based on radiant heat or by directly contacting a thermocouple against a substrate region that does not interfere with power generation characteristics. The measured result is notified to the control device 14.

  The control device 14 gives an instruction to the first temperature controller 23 and the second temperature controller 24 based on the substrate temperature notified from the temperature sensor 13. Then, the cleaning water temperature of the first substrate cleaner 21 and the second substrate cleaner 22 is controlled so as to reduce the temperature difference from the notified substrate temperature, that is, the substrate temperature just before the photoelectric conversion layer is laser-etched. .

  As described above, the cleaning water temperature of the first substrate cleaning device 21 and the second substrate cleaning device 22 is set close to the substrate temperature just before laser etching the photoelectric conversion layer, thereby performing three laser etching steps (step S40, The substrate temperatures in S70 and S100) can be made substantially the same. By making the substrate temperature substantially the same in each laser etching step, the planned position can be laser etched. Since the displacement is prevented, the solar cell film is also prevented from peeling off.

  Further, in the present embodiment, the substrate to be processed is compared with the case where the substrate temperature is adjusted on the XY table after the substrate to be processed is carried into each laser etching apparatus (8, 10, 12). Since the temperature adjustment is performed at the stage when the substrate is unloaded from the substrate cleaner, the time required for temperature adjustment is shortened, which is preferable.

In addition, when the 3rd board | substrate washing | cleaning device 36 is provided between the laser etching apparatus 10 for photoelectric conversion layers, and the photoelectric converting layer film forming apparatus 9, it carries in to the laser etching apparatus 10 for photoelectric conversion layers. The temperature of the substrate to be processed approaches the cleaning water temperature of the third substrate cleaner 36, and the difference between the temperatures of the substrates to be processed that are carried into each laser etching is further reduced and stabilized. If a third temperature controller (not shown) connected to the third substrate cleaner 36 is added, the cleaning water temperature of the third substrate cleaner 36 can be managed in the same manner as the first and second substrate cleaners. good. Even if there is no third temperature controller, if at least the cleaning water temperatures of the first / second / third substrate cleaners are substantially the same, the temperature of the substrate to be processed carried into each laser etching apparatus will be substantially the same. The mutual temperature difference can be reduced.
It is also possible to set each cleaning water temperature appropriately by heating or cooling each temperature controller so that the temperature becomes more suitable for the substrate temperature. For example, the substrate temperature can be controlled near room temperature. In this case, the difference in substrate temperature before laser etching can be reduced in both the substrate that is continuously processed in the process and the substrate that is temporarily stored in the substrate stocker and is near room temperature. There is an advantage that it is possible to suppress a slight change in temperature due to cooling, and this method is suitable when high-precision processing is required.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. In the present embodiment, a cooling unit 33 is added as compared with the first embodiment. Further, the first temperature controller 23 and the second temperature controller 24 as shown in the third embodiment are not particularly necessary. Further, the contents processed by the control device 14 are different. Since points other than these are the same as those in the first embodiment, description thereof will be omitted.

  FIG. 11 is a configuration diagram showing a main part of the solar cell panel manufacturing system 1 according to the present embodiment. In addition, illustration is abbreviate | omitted about the same part as 1st Embodiment. In the solar cell panel manufacturing system 1, a cooling unit 33 is disposed between the photoelectric conversion layer deposition apparatus 9 and the photoelectric conversion layer laser etching apparatus 10. Further, a temperature sensor 34 for measuring the cleaning water temperature of the first substrate cleaner 21 and a temperature sensor 35 for measuring the cleaning water temperature of the second substrate cleaner 22 are provided.

  The cooling unit 33 is exemplified by forced cooling by an air cooling fan or the like. The substrate to be processed carried out from the photoelectric conversion layer deposition apparatus 9 is cooled to a predetermined temperature by the cooling unit 33 and is carried into the photoelectric conversion layer laser etching apparatus 9.

  When the temperature sensor 34 measures the cleaning water temperature of the first substrate cleaner 21, the temperature sensor 34 notifies the control device 14 of the measurement result. When the temperature sensor 35 also measures the cleaning water temperature of the second substrate cleaner 22, the temperature sensor 35 notifies the control device 14 of the measurement result.

  Based on the temperature measurement result data notified from the temperature sensors 34 and 35, the control device 14 controls the operation of the cooling unit 33 so that the substrate to be processed is cooled to a predetermined temperature. For example, the control of the operation is performed by controlling the rotational speed and operating time of the air cooling fan, and the control device 14 causes the cooling unit 33 to determine whether the average temperature of the substrate to be processed or the representative point temperature near the center of the substrate is the temperature sensor 34. The temperature is controlled to be cooled to the average value notified from the temperature sensor 35. For example, a temperature sensor (not shown) is provided between the photoelectric conversion layer film device 9 and the photoelectric conversion layer laser etching device 10 to determine whether the substrate to be processed has been cooled to a predetermined temperature. Thus, it is possible to measure the temperature of the substrate to be processed and feed back the measurement result to the control device 14.

  Even in the configuration described above, the substrate temperatures during the processing by the transparent conductive layer laser etching apparatus 8, the photoelectric conversion layer laser etching apparatus 9, and the back electrode laser etching apparatus 12 are substantially the same as in the first embodiment. Thus, the temperature difference between the substrates can be reduced. Therefore, the displacement of the etching position can be prevented and film peeling can be prevented.

(Fifth embodiment)
A fifth embodiment will be described. In the solar cell panel manufacturing system 1 of the present embodiment, the configuration of the substrate cleaner 201 is devised. Since the configuration other than the substrate cleaner 201 is the same as that of the first embodiment, the description thereof is omitted.

  As shown in FIG. 2, the solar cell panel manufacturing system 1 according to the present embodiment has a plurality of substrate cleaners 201. The plurality of substrate cleaners 201 are provided between the substrate carry-in device and the transparent electrode film forming device 6, between the transparent electrode film forming device 6 and the transparent conductive layer laser etching device 8 (first substrate cleaner 21), laser Between the etching apparatus 8 and the photoelectric conversion layer film forming apparatus 9, between the back electrode film forming apparatus 11 and the back electrode laser etching apparatus 12 (second substrate cleaner 22), and between the film polishing apparatus and the layup apparatus, Is arranged. When the interface property between the photoelectric conversion layer 42 and the back electrode layer 43 is less affected by the cleaning, the third substrate cleaner 36 is provided between the photoelectric conversion layer forming apparatus 9 and the photoelectric conversion layer laser etching apparatus 10. It may be provided.

  A device for the substrate cleaner 201 described below is applied to at least one of the plurality of substrate cleaners 201 (including the first substrate cleaner 21 and the second substrate cleaner 22). It is a thing.

  FIG. 12 is a schematic configuration diagram showing the configuration of the substrate cleaner 201. The substrate cleaner 201 includes a transport roller 25 that transports the substrate. Further, the substrate cleaner 201 is partitioned from the upstream side in the transport direction into a run-up section 31, a roll brush section 26, a high-pressure shower section 27, a direct water rinse section 28, and an air knife section 29. Not all the substrate cleaners 201 have the same cleaning process configuration, and the configuration of the cleaning process is made appropriate in accordance with the cleaning effect and the formation state of the solar cell constituent film. In particular, the roll brush portion 26 may not be used for protecting the solar cell film 4 in a process subsequent to the second substrate cleaner 22.

  FIG. 13 is an explanatory diagram illustrating a state in which the substrate to be processed is transported by the transport roller 25. The conveyance roller 25 is provided on the upper side and the lower side with respect to the substrate to be conveyed, and is in close contact with the substrate and the conveyance roller 25 so as not to slip or float. As a result, the transport roller 25 transports the substrate to be processed so as to sandwich the substrate to be processed. Since the lower side of the substrate to be processed is the opposite side of the main surface and no film forming process is performed, a plurality of transport rollers 25 are arranged in the width direction of the transport line, and warpage due to the gravity of the substrate is suppressed. ing. On the other hand, the upper side is a main surface on which a film forming process is performed, and the upper transport roller 25 is disposed only at positions corresponding to both ends in the width direction of the substrate to be processed.

  FIG. 12 will be referred to again. Only the conveyance roller 25 is provided in the run-up unit 31. However, the atmosphere of the run-up portion 31 is a mist atmosphere having a higher humidity than the surroundings and containing a mist of cleaning water. It is preferable that the run-up portion 31 has a length of at least two sheets from 1/2 the substrate to be processed.

  The roll brush unit 26 is provided with a roll brush. The roll brush is provided on both upper and lower sides with respect to the substrate to be processed. A roll brush is pressed against the substrate to be processed and the surface of the substrate to be processed is rubbed to clean the surface of the substrate to be processed.

  The high pressure shower unit 27 is provided with a nozzle for jetting high pressure water. From the nozzle, high-pressure water (for example, 0.2 MPa to 1.0 MPa) is sprayed onto the substrate to be processed. In the high-pressure shower unit 27, washing with water sprayed at a high pressure (high-pressure water) is thus performed.

  In the direct water rinse section 28, a nozzle for injecting pure water is provided. From this nozzle, pure water (specific resistance value of 10 MΩ · cm or more) is sprayed onto the substrate to be processed.

  In the air knife 29, air is blown against the substrate to be processed. Thereby, the water on a to-be-processed substrate is removed.

  The management of the cleaning water temperature by the temperature controller described in the first embodiment is preferably performed at least for the cleaning water on the direct water rinsing unit 28 side, and the direct water rinsing unit 28 and the high pressure shower unit 29 are used. More preferably, it is carried out for both of the cleaning waters (high pressure water, pure water).

  Next, processing operations performed on the substrate to be processed by the substrate cleaner 201 will be described.

  As shown in FIG. 13, the substrate to be processed conveyed by the conveyance roller 25 has the main surface side (surface on which the solar cell film is formed) facing upward, and the cell division line 3 is parallel to the conveyance direction. It is conveyed in the direction. Note that in the substrate cleaner disposed on the upstream side of the laser etching apparatus, the cell division line 3 is not yet formed on the substrate to be cleaned. In this case, the formation line of the cell division line 3 is transported in a state parallel to the transport direction.

  FIG. 14 is a flowchart showing processing performed on the substrate to be processed by the substrate cleaner 201. The substrate to be processed is subjected to the processing of S1 to S5 shown in FIG.

Step S1: Run-up First, in the run-up unit 31, the substrate to be processed is exposed to a mist atmosphere of cleaning water. Thereby, the surface of the film-formed film in the solar cell film 4 of the substrate to be processed is covered with a thin water film.

Step S2; Roll Brush Cleaning Subsequently, the roll brush unit 26 performs cleaning with a roll brush. Here, the roll brush comes into contact with the film-formed film of the solar cell film 4. When the roll brush comes into contact with the film-formed film of the solar cell film 4, an impact is applied to the film-formed film of the solar cell film 4. Since the film-formed film of the film 4 is covered with the water film, the possibility that the impact peels off the solar cell film 4 is low.

Step S3-5: High Pressure Shower Subsequently, high pressure water is washed by the high pressure shower unit 27 (Step S3), pure water is washed by the direct water rinse unit 29 (Step S4), and the air knife unit 29 is further washed. To drain water (step S5).

  Then, the effect of this embodiment is demonstrated.

  In the present embodiment, since the cell division line 3 is parallel to the transport direction, the influence of residual foreign matters during cleaning can be minimized. FIG. 15 is an explanatory diagram showing positions where foreign matters are likely to remain during cleaning. During drying in the air knife 29, foreign matter tends to remain at the upstream end of the substrate to be processed in the transport direction. This is because the cleaning water remaining on the substrate to be processed is transported upstream in the transport direction by the air knife. As a result, the foreign matter pushed away by the cleaning water tends to accumulate on the upstream side in the transport direction.

  Here, when the cell division line 3 is transported in a non-parallel manner with respect to the transport direction, the entire power generation cell 7 may be affected by foreign matter. That is, the output of the entire power generation cell 7 may decrease. In the solar cell module, since the plurality of power generation cells 7 are connected in series, if the output of one power generation cell 7 as a whole decreases, the output of the entire solar cell module also decreases.

  On the other hand, in the present embodiment, even if foreign matter remains during cleaning, only the end portion of each power generation cell 7 is affected by the foreign matter. Since the entire power generation cell 7 is not affected by the foreign matter, the influence of the foreign matter on the entire solar cell module can be reduced.

  In addition, as shown in FIG. 13, the position where the upper transport roller 25 contacts the substrate to be processed is only in the region where the solar cell film 4 has removed the film on the outer peripheral portion around the substrate or the film is scheduled to be removed. is there. Therefore, after the film around the substrate is removed, the possibility of film peeling due to the impact of the transport roller 25 is low. Further, even before the film around the substrate is removed, even if the film in the area to be removed is peeled off, it is removed by polishing in a subsequent process, so there is no influence on the power generation characteristics of the solar cell panel. Also, even if the upper transport roller 25 contacts the solar cell film 4, the cell dividing line 3 and the transport direction are substantially parallel, so the force that the upper transport roller 25 gives to the solar cell film 4 is the substrate. It becomes the longitudinal direction of the power generation cell 7 at the extreme end. Since the power generation cell 7 has a rectangular shape, it is easily peeled off when a force in the short side direction is applied, but has a relatively high resistance to film peeling against a force in the longitudinal direction. Moreover, the cell division | segmentation part has uneven | corrugated shape in the edge direction, and if it receives damage with the conveyance roller 25, a short circuit will arise in the serial connection part of this part, and the electric power generation characteristic of a solar cell panel will fall. That is, by setting the cell dividing line 3 and the transport direction to be substantially parallel, even if the transport roller 25 is in contact, the possibility of film peeling is extremely low.

(Sixth embodiment)
A solar cell panel manufacturing system according to the sixth embodiment will be described. In the solar cell panel manufacturing system according to this embodiment, the configuration of the high-pressure shower unit 27 is devised with respect to the fifth embodiment. Since the configuration and operation other than the high-pressure shower unit 27 are the same as those in the fifth embodiment, description thereof will be omitted.

  FIG. 16 is a side view showing the structure of the high-pressure shower unit 27. The high-pressure shower unit 27 is provided with a high-pressure shower nozzle 30. The high-pressure shower nozzle 30 injects high-pressure water toward the substrate to be processed. Here, the high pressure shower nozzle 30 is provided such that the injection direction is inclined to the upstream side in the transport direction.

  The flow rate of water flowing on the surface of the substrate to be processed is increased by injecting the high-pressure water while inclining the injection direction toward the upstream side in the transport direction. The effect of shearing force when cleaning water collides with foreign matter adhering to the substrate to be processed is increased, and foreign matter is easily removed. Further, since the flow rate of the cleaning water is high, the separated foreign matter is easily carried to the outside, and the possibility that it will adhere to the substrate to be processed again is low.

  The angle (θ) formed by the ejection direction and the plane orthogonal to the transport direction is preferably 10 ° or more and 30 ° or less. When θ is smaller than 10 °, the momentum (shearing force) of the jetted cleaning water is attenuated at the moment of collision with the substrate to be processed, and the flow velocity on the substrate surface may not be sufficiently high. When θ is larger than 30 °, the vertical downward force of the cleaning water becomes insufficient, and the cleaning water sprayed from the high pressure shower nozzle is attracted by gravity and the cleaning water collides with the adhered foreign matter. The force is reduced and the effect of removing foreign matter is reduced.

  Moreover, when injecting high-pressure water, it is preferable to swing the high-pressure shower nozzle 30 in a direction substantially orthogonal to the transport direction, that is, in the width direction of the transport line. By swinging the high-pressure shower nozzle 30, the width direction of the substrate to be processed can be uniformly cleaned.

  It is preferable that the above-described device for the high-pressure shower unit 27 is performed in a process that requires particularly strong cleaning power. Examples of such a process include a cleaning process after laser etching of the transparent conductive layer and a cleaning process after the outer peripheral film is removed. That is, in FIG. 2, about the substrate cleaning device 201 disposed between the laser etching device 8 and the photoelectric conversion layer deposition device 9, and the substrate cleaning device 201 disposed between the film polishing device and the layup device, It is preferable that the above-described device is applied.

(Seventh embodiment)
Subsequently, a seventh embodiment will be described. In the solar cell panel manufacturing system 1 according to this embodiment, a natural drying section 32 is further added to the fifth embodiment. Since the configuration other than the natural drying section 32 is the same as that of the fifth embodiment, the description thereof is omitted.

  FIG. 17 is a block diagram showing a configuration from the substrate cleaner 201 to the next process apparatus in the solar cell panel manufacturing system 1 according to the present embodiment. As shown in FIG. 17, a natural drying section 32 is provided between the substrate cleaner 201 and the processing device for the next process. The natural drying section 32 is provided in at least one of a plurality of substrate cleaners 201 (including the first substrate cleaner 21 and the second substrate cleaner 22).

  The natural drying section 32 is a section for removing water that could not be removed by the air knife 29 by natural drying. Since the moisture remaining on the substrate to be processed only needs to be naturally dried, no special apparatus is required. A conveyance line from the substrate cleaner 201 to the next process may be used as the natural drying section 32.

  In such a configuration, the substrate to be processed carried out from the substrate cleaner 201 is carried into the natural drying section 32. In the natural drying section 32, the water that has not been removed by the air knife 29 is removed by natural drying.

  Even if draining is performed by the air knife 29, moisture may remain on the substrate to be processed. In particular, in a groove portion (about 50 μm) formed by laser etching, a capillary force works due to surface tension, and moisture tends to aggregate and remain in the groove. When a film forming process or the like is performed in a state where moisture remains on the substrate to be processed, the moisture may be taken into the film component to deteriorate the film quality or the water may be rapidly evaporated. For example, when a photoelectric conversion layer is formed using a plasma CVD apparatus or the like, the pressure is reduced from atmospheric pressure to a vacuum state in the load lock chamber. At this time, the remaining water tends to evaporate rapidly. When such rapid evaporation occurs, film peeling is likely to occur due to this evaporation.

  According to the present embodiment, since the remaining moisture is removed in the natural drying section 32, it is possible to prevent film peeling or film quality degradation due to evaporation of moisture during film forming processing or the like. .

In addition, since the groove of the cell dividing line formed by laser etching is narrow, the amount of water accumulated in the groove is small, and when converted from the evaporation rate of water (about 0.2 kg / m ² · hr), it evaporates within a few minutes. It is inferred that The time during which the substrate to be processed is naturally dried is preferably 2 minutes to 3 minutes. If the time of natural drying is shorter than 2 minutes, drying may be insufficient. On the other hand, if it is longer than 3 minutes, it becomes longer than the tact time of each processing apparatus, which may reduce productivity.

  As mentioned above, although the solar cell panel manufacturing system concerning the 1st-7th embodiment was demonstrated, these embodiments can also be combined and used within a consistent range. Further, although the case where a single amorphous silicon layer is used as the photoelectric conversion layer has been described, it is not necessarily required to be a single amorphous silicon layer. For example, the present invention may be applied to a case where the photoelectric conversion layer is a microcrystalline silicon layer, a silicon germanium layer, or a tandem type in which a plurality of microcrystalline silicon layers, amorphous silicon layers, and silicon germanium layers are stacked. is there. Furthermore, it is obvious to those skilled in the art that the present invention can be applied to a tandem type in which a plurality of these silicon-based layers are laminated.

It is a top view of a solar cell module. It is a layout figure of the solar cell panel manufacturing system concerning a 1st embodiment. It is a flowchart of the solar cell panel manufacturing method concerning 1st Embodiment. It is panel sectional drawing in a solar cell panel manufacturing process. It is a panel schematic diagram in a solar cell panel manufacturing process. It is sectional drawing explaining the difference in the laser etching position by a substrate temperature difference. It is a layout figure of the solar cell panel manufacturing system concerning 2nd Embodiment. It is a flowchart of the solar cell panel manufacturing method concerning 2nd Embodiment. It is a layout figure of the solar cell panel manufacturing system concerning 3rd Embodiment. It is a flowchart of the solar cell panel manufacturing method concerning 3rd Embodiment. It is a block diagram which shows the principal part of the solar cell panel manufacturing system which concerns on 3rd Embodiment. It is a block diagram which shows the principal part of the solar cell panel manufacturing system which concerns on 4th Embodiment. It is a side view which shows the structure of a board | substrate washing | cleaning apparatus schematically. It is a perspective view for demonstrating the conveyance direction of a to-be-processed substrate. It is a flowchart in a washing process. It is a perspective view for demonstrating the area | region where a foreign material tends to remain. It is a side view which shows the structure of a high pressure shower part roughly. It is a figure which shows the structure from a board | substrate washing | cleaning device to the next apparatus in a block form.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solar cell panel manufacturing system 2 Board | substrate 3 Cell division line 4 Solar cell film 5 Solar cell panel 6 Transparent electrode film film-forming apparatus 7 Power generation cell 8 Laser etching apparatus for transparent electrodes 9 Photoelectric conversion layer film-forming apparatus 10 Laser for photoelectric conversion layers Etching device 11 Back electrode film deposition device 12 Laser etching device for back electrode 13 Temperature sensor 14 Control device 15 Removal region 16 Insulating groove 20 Substrate cleaning unit 21 First substrate cleaner 22 Second substrate cleaner 23 First temperature controller 24 Second temperature controller 25 Transport roller 26 Roll brush part 27 High pressure shower part 28 Direct water rinse part 29 Air knife part 30 High pressure shower nozzle 31 Run-up part 32 Natural drying zone 33 Cooling part 34 Temperature sensor 35 Temperature sensor 36 Third substrate cleaning 37 Third temperature controller 41 Transparent conductive layer 42 Photoelectric conversion layer 43 Back electrode layer 201 Substrate cleaner

Claims (14)

A solar cell panel manufacturing system for manufacturing a solar cell panel having a translucent substrate and a solar cell film formed on a main surface of the substrate and divided into a plurality of strip-shaped power generation cells by a cell dividing line There,
A transparent conductive layer forming apparatus for forming a transparent conductive layer on the main surface of the substrate;
A laser etching apparatus for a transparent conductive layer that performs laser etching of the transparent conductive layer in correspondence with the power generation cell;
A photoelectric conversion layer forming apparatus for forming a photoelectric conversion layer on the laser-etched substrate of the transparent conductive layer;
A laser etching device for a photoelectric conversion layer that performs laser etching of the photoelectric conversion layer in correspondence with the power generation cell;
A back electrode film forming apparatus for forming a back electrode film on the laser-etched substrate of the photoelectric conversion layer;
A laser etching device for a back electrode that performs laser etching of the back electrode film in correspondence with the power generation cell;
A substrate cleaning section having a plurality of substrate cleaners for cleaning the substrate by spraying cleaning water;
Comprising
The substrate cleaning unit
A first substrate cleaner disposed between the transparent conductive layer forming apparatus and the transparent conductive layer laser etching apparatus;
A second substrate cleaning device disposed between the back electrode film forming apparatus and the back electrode laser etching apparatus;
A cooling part for cooling the substrate after the photoelectric conversion layer is formed and before being introduced into the laser etching apparatus for photoelectric conversion layer;
A natural drying section for naturally drying the substrate before the substrate unloaded from each of the substrate cleaners is loaded into the next downstream processing apparatus;
Have
The first substrate cleaning device and the second substrate cleaning device transport a substrate by a transport roller, with a direction substantially parallel to a direction in which the cell division line is formed as a transport direction,
The temperature difference between the substrate average temperature immediately before being introduced into the photoelectric conversion layer laser etching apparatus, the cleaning water temperature of the first substrate cleaner, and the cleaning water temperature of the second substrate cleaner is ± 10 ° C. or less . And a solar cell panel manufacturing system that manages after the cooling unit so that the substrate average temperature immediately before being introduced into the photoelectric conversion layer laser etching apparatus becomes a target temperature . A solar cell panel manufacturing system according to claim 1 ,
A first substrate cleaning dexterity temperature sensor for measuring a pre-Symbol wash water temperature of the first substrate cleaning apparatus,
A temperature sensor for a second substrate cleaning device for measuring a cleaning water temperature of the second substrate cleaning device;
A control device;
Comprising
The control device is, after the cooling unit, immediately before being introduced into the photoelectric conversion layer laser etching device, the cleaning water temperature measured by the first substrate cleaning device temperature sensor, The solar cell panel manufacturing system which controls the said substrate temperature of the said cooling part so that the temperature difference with the washing | cleaning water temperature measured by the temperature sensor for 2nd board | substrate washing | cleaning devices may be +/- 10 degreeC or less. A solar cell panel manufacturing system according to claim 1,
Furthermore,
A photoelectric conversion layer etching temperature sensor for measuring the substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching device;
A control device;
Comprising
The substrate cleaning unit
A first temperature controller for managing a cleaning water temperature of the first substrate cleaner;
A second temperature controller for managing a cleaning water temperature of the second substrate cleaner;
Have
Based on the measurement result of the temperature sensor for photoelectric conversion layer etching, the control device is configured so that the cleaning water temperature of the first substrate cleaning device and the second substrate cleaning device is the measurement result of the temperature sensor for photoelectric conversion layer etching. The solar cell panel manufacturing system which controls operation | movement of the said 1st temperature controller and the said 2nd temperature controller so that it may become less than +/- 10 degreeC with the average temperature of. A solar cell panel manufacturing system according to claim 1,
The substrate cleaning unit further includes:
A third substrate cleaning device disposed between the photoelectric conversion layer deposition apparatus and the photoelectric conversion layer laser etching apparatus;
The solar cell panel in which the temperature difference between the cleaning water temperature of the third substrate cleaner, the cleaning water temperature of the first substrate cleaner, and the cleaning water temperature of the second substrate cleaner is ± 5 ° C. or less. Manufacturing system. A solar cell panel manufacturing system according to claim 4 ,
A photoelectric conversion layer etching temperature sensor for measuring the substrate temperature immediately before being introduced into the photoelectric conversion layer laser etching device;
A control device;
Comprising
The substrate cleaning unit
A first temperature controller for managing a cleaning water temperature of the first substrate cleaner;
A second temperature controller for managing a cleaning water temperature of the second substrate cleaner;
A third temperature controller for managing a cleaning water temperature of the third substrate cleaner;
Have
Based on the measurement result of the temperature sensor for photoelectric conversion layer etching, the control device is configured so that cleaning water temperatures of the first substrate cleaner, the second substrate cleaner, and the third substrate cleaner are A solar cell panel manufacturing system for controlling operations of the first temperature controller, the second temperature controller, and the third temperature controller so that the average temperature of the measurement results is within ± 10 ° C. A solar cell panel manufacturing system according to any one of claims 1 to 5 ,
In the solar cell panel, the solar cell film is formed on the main surface of the translucent substrate, and at least part of the periphery of the substrate near the substrate end on the main surface is the solar cell film before the laminating process. It is a removed area of
Each of the plurality of substrate cleaners has a transport roller,
The transport roller transports the substrate as a transport direction in a direction substantially parallel to the direction in which the cell division line is formed,
The transport rollers are arranged on both the main surface side of the substrate and the opposite surface side of the main surface so as to sandwich the substrate when transporting the substrate, and on the main surface side the removal region or the removal scheduled A solar cell panel manufacturing system that contacts in a region and does not contact in a region where the solar cell film is provided. The solar cell panel manufacturing system according to claim 6 ,
Each of the substrate cleaners is at least
A high-pressure shower section for cleaning with high-pressure water;
A direct water rinse section for cleaning with pure water;
An air knife for draining water,
Have
The high-pressure shower unit has a high-pressure shower nozzle,
The high-pressure shower nozzle is provided such that high-pressure water is sprayed onto the substrate at an angle inclined toward the upstream side of conveyance,
The high-pressure shower nozzle is a solar cell panel manufacturing system provided so that an angle formed by a high-pressure water jetting direction and a plane perpendicular to the transport direction is 10 ° or more and 30 ° or less. A solar cell panel manufacturing system according to claim 7 ,
The control device is a solar cell panel manufacturing system in which the high-pressure shower nozzle is swung in a direction substantially perpendicular to the substrate transport direction. A solar cell panel manufacturing system according to any one of claims 6 to 8 ,
Each of the substrate cleaners further includes
Before the high-pressure shower unit, a roll brush unit that performs cleaning with a roll brush, an upstream unit that is provided on the upstream side of the roll brush unit, and exposes the substrate to a mist atmosphere of cleaning water,
Have
The said run-up part is a solar cell panel manufacturing system which has the space for 2 sheets or less by 1/2 or more of the conveyance direction length of the said board | substrate. A solar cell panel manufacturing method for manufacturing a solar cell panel having a substrate and a solar cell film formed on a main surface of the substrate and divided into a plurality of strip-shaped power generation cells by a cell dividing line,
A transparent conductive layer forming step of forming a transparent conductive layer on the main surface of the substrate;
A transparent conductive layer etching step of laser etching the transparent conductive layer in correspondence with the power generation cell;
A photoelectric conversion layer forming step of forming a photoelectric conversion layer on the transparent conductive layer;
A photoelectric conversion layer etching step of performing laser etching on the photoelectric conversion layer in correspondence with the power generation cell;
A cooling step that is performed between the photoelectric conversion layer deposition step and the photoelectric conversion layer etching step, and cools the substrate;
A back electrode film forming step of forming a back electrode film on the photoelectric conversion layer;
A back electrode film etching step in which the back electrode film is laser-etched corresponding to the power generation cell;
A plurality of cleaning steps for cleaning the substrate by spraying cleaning water between each step;
A natural drying step of naturally drying the substrate before the substrate having undergone the cleaning step is subjected to the next downstream processing;
Comprising
The multiple washing steps include:
The substrate, the direction and a direction that is substantially parallel to the formation of the cell dividing line as the conveying direction, is carried out immediately before the transparent conductive layer etch step, a first cleaning step of cleaning the front Stories substrate,
The substrate, the direction and a direction that is substantially parallel to the formation of the cell dividing line as the conveying direction, is carried out just before the back electrode film etching step, a second cleaning step for cleaning the pre-Symbol substrate,
I have a,
In the cooling step, the substrate average temperature immediately before being introduced into the photoelectric conversion layer laser etching apparatus becomes a target temperature, the substrate average temperature, the cleaning water temperature in the first cleaning step, and the second A solar cell panel manufacturing method for cooling so that a temperature difference from a cleaning water temperature in a cleaning step is ± 10 ° C. or less . It is a solar cell panel manufacturing method described in Claim 10 ,
In the solar cell panel, the solar cell film is formed on the main surface of the translucent substrate, and at least part of the periphery of the substrate near the substrate end on the main surface is the solar cell film before the laminating process. It is a removed area of
In each of the plurality of cleaning steps, the substrate is cleaned while being transported by a transport roller, with the transport direction being a direction substantially parallel to the direction in which the cell division line is formed,
The transport rollers are arranged on both the main surface side of the substrate and the opposite surface side of the main surface so as to sandwich the substrate,
When transporting the substrate in each of the cleaning steps, the transport roller is in contact with the removal region or the surface opposite to the main surface and transports so as not to contact in the region where the solar cell film is provided. Method. It is a solar cell panel manufacturing method described in Claim 10,
At least each of the washing steps is
A high pressure shower step for washing with high pressure water;
A direct water rinse step for cleaning with pure water;
An air knife step to drain water,
Have
In spraying high-pressure water in the high-pressure shower step, the high-pressure water spray direction is inclined and sprayed to the upstream side of the conveyance so that the angle formed by the plane perpendicular to the conveyance direction is 10 ° or more and 30 ° or less,
A solar cell panel manufacturing method comprising: a temperature measuring step for a cleaning device that measures cleaning water temperatures of a plurality of substrate cleaning devices that spray a cleaning water to clean the substrate. It is a solar cell panel manufacturing method described in Claim 12 ,
The high-pressure shower step, the solar cell panel manufacturing method in which the nozzles for high pressure shower is swung in a direction substantially perpendicular to the substrate conveying direction. It is a solar cell panel manufacturing method according to claim 12 or 13 ,
Furthermore,
Before the high pressure shower step , a roll brush step for cleaning with a roll brush,
A run-up step performed upstream of the roll brush step to expose the substrate to a mist atmosphere of cleaning water;
Comprising
The said approach step is a solar cell panel manufacturing method performed in the space for 2 sheets or less by 1/2 or more of the conveyance direction length of the said board | substrate.

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