JP5294445B2 - 円盤状基板の検査装置及び検査方法 - Google Patents

円盤状基板の検査装置及び検査方法 Download PDF

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JP5294445B2
JP5294445B2 JP2007275836A JP2007275836A JP5294445B2 JP 5294445 B2 JP5294445 B2 JP 5294445B2 JP 2007275836 A JP2007275836 A JP 2007275836A JP 2007275836 A JP2007275836 A JP 2007275836A JP 5294445 B2 JP5294445 B2 JP 5294445B2
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JP2009105230A (ja
JP2009105230A5 (enExample
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義典 林
博之 若葉
洋子 小野
浩一 宮園
秀樹 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2007275836A 2007-10-23 2007-10-23 円盤状基板の検査装置及び検査方法 Expired - Fee Related JP5294445B2 (ja)

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JP2009105230A JP2009105230A (ja) 2009-05-14
JP2009105230A5 JP2009105230A5 (enExample) 2010-12-24
JP5294445B2 true JP5294445B2 (ja) 2013-09-18

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5243335B2 (ja) * 2009-04-21 2013-07-24 東京エレクトロン株式会社 欠陥検査方法、欠陥検査装置、欠陥検査プログラム、及びそのプログラムを記録した記録媒体
KR101642897B1 (ko) 2011-07-13 2016-07-26 주식회사 고영테크놀러지 검사방법
CN104952754B (zh) * 2015-05-05 2017-08-01 江苏大学 基于机器视觉的镀膜后硅片分选方法
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2664141B2 (ja) * 1986-10-30 1997-10-15 オムロン 株式会社 実装基板検査装置
JPH07107514B2 (ja) * 1988-09-14 1995-11-15 オムロン株式会社 基板検査装置における表示方法および表示装置
JP3189441B2 (ja) * 1992-11-16 2001-07-16 オムロン株式会社 実装部品検査装置における教示データ修正方法
JP3322801B2 (ja) * 1996-08-01 2002-09-09 三井金属鉱業株式会社 レジスト飛散検査装置および方法
JPH10311713A (ja) * 1997-05-13 1998-11-24 Canon Inc ボンディングワイヤ検査方法および装置
JP2000114329A (ja) * 1998-09-29 2000-04-21 Yuhi Denshi Kk 基板端部の研削面の検査方法とその装置
JP2000304704A (ja) * 1999-04-23 2000-11-02 Hitachi Chem Co Ltd 配線板の検査方法及びその方法に用いる検査装置
JP4678101B2 (ja) * 2001-06-29 2011-04-27 信越半導体株式会社 化合物半導体ウェーハの評価方法及び評価装置

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