JP5271671B2 - 微小電気機械式装置 - Google Patents

微小電気機械式装置 Download PDF

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Publication number
JP5271671B2
JP5271671B2 JP2008284983A JP2008284983A JP5271671B2 JP 5271671 B2 JP5271671 B2 JP 5271671B2 JP 2008284983 A JP2008284983 A JP 2008284983A JP 2008284983 A JP2008284983 A JP 2008284983A JP 5271671 B2 JP5271671 B2 JP 5271671B2
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Japan
Prior art keywords
layer
film
microstructure
electrode layer
material layer
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Expired - Fee Related
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JP2008284983A
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English (en)
Japanese (ja)
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JP2009131951A (ja
JP2009131951A5 (enExample
Inventor
薫 土屋
隆文 溝口
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2008284983A priority Critical patent/JP5271671B2/ja
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Publication of JP2009131951A5 publication Critical patent/JP2009131951A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y10S977/732—Nanocantilever
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y10S977/733—Nanodiaphragm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
JP2008284983A 2007-11-07 2008-11-06 微小電気機械式装置 Expired - Fee Related JP5271671B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008284983A JP5271671B2 (ja) 2007-11-07 2008-11-06 微小電気機械式装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007289224 2007-11-07
JP2007289224 2007-11-07
JP2008284983A JP5271671B2 (ja) 2007-11-07 2008-11-06 微小電気機械式装置

Publications (3)

Publication Number Publication Date
JP2009131951A JP2009131951A (ja) 2009-06-18
JP2009131951A5 JP2009131951A5 (enExample) 2011-11-24
JP5271671B2 true JP5271671B2 (ja) 2013-08-21

Family

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Family Applications (1)

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JP2008284983A Expired - Fee Related JP5271671B2 (ja) 2007-11-07 2008-11-06 微小電気機械式装置

Country Status (3)

Country Link
US (2) US7872320B2 (enExample)
JP (1) JP5271671B2 (enExample)
KR (1) KR101541906B1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010286471A (ja) * 2009-05-15 2010-12-24 Seiko Epson Corp Ｍｅｍｓセンサー、電子機器
JP5396335B2 (ja) 2009-05-28 2014-01-22 株式会社半導体エネルギー研究所 タッチパネル
JP5866089B2 (ja) * 2009-11-20 2016-02-17 株式会社半導体エネルギー研究所 電子機器
TWI507934B (zh) * 2009-11-20 2015-11-11 Semiconductor Energy Lab 顯示裝置
CN102713999B (zh) 2010-01-20 2016-01-20 株式会社半导体能源研究所 电子设备和电子系统
US8367459B2 (en) 2010-12-14 2013-02-05 Sharp Laboratories Of America, Inc. Organic semiconductor interface preparation
US9223618B2 (en) 2011-09-20 2015-12-29 Intel Corporation Multi-threaded queuing system for pattern matching
CN102980694B (zh) * 2012-11-29 2015-07-29 北京大学 无应变膜结构的mems压阻式压力传感器及其制作方法
US20150122531A1 (en) * 2013-11-01 2015-05-07 Carestream Health, Inc. Strain gauge
CN103730511B (zh) * 2013-12-26 2016-03-23 京东方科技集团股份有限公司 薄膜晶体管及其制造方法、阵列基板、显示装置
CN106044704B (zh) * 2016-06-27 2017-09-29 李岩 微电子机械系统结构形成方法
CN117548321A (zh) * 2022-08-05 2024-02-13 天津大学 具有双承载层的微机械超声换能器结构及其制造方法

Family Cites Families (25)

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JPH0278925A (ja) * 1988-09-16 1990-03-19 Yokohama Syst Kenkyusho:Kk 静電容量型圧力センサ
DE19536250A1 (de) * 1995-09-28 1997-04-03 Siemens Ag Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors
JP2000273236A (ja) 1999-03-25 2000-10-03 Jsr Corp 親水性多孔質膜
US6749733B1 (en) * 2000-04-10 2004-06-15 Intel Corporation Materials classifier, method of using, and method of making
JP2002170470A (ja) * 2000-11-28 2002-06-14 Matsushita Electric Works Ltd 半導体マイクロリレー及びその製造方法
US6465280B1 (en) * 2001-03-07 2002-10-15 Analog Devices, Inc. In-situ cap and method of fabricating same for an integrated circuit device
JP4773630B2 (ja) * 2001-05-15 2011-09-14 株式会社デンソー ダイアフラム型半導体装置とその製造方法
US6780786B2 (en) * 2001-11-26 2004-08-24 The Regents Of The University Of California Method for producing a porous silicon film
US7943412B2 (en) * 2001-12-10 2011-05-17 International Business Machines Corporation Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
TW576864B (en) 2001-12-28 2004-02-21 Toshiba Corp Method for manufacturing a light-emitting device
JP4077312B2 (ja) 2001-12-28 2008-04-16 株式会社東芝 発光素子の製造方法および発光素子
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
JP4076829B2 (ja) 2002-09-20 2008-04-16 株式会社東芝 マイクロスイッチ及びその製造方法
KR100470634B1 (ko) * 2002-10-02 2005-03-10 한국전자통신연구원 축전식 미세전자기계적 스위치 및 그 제조 방법
US6917459B2 (en) * 2003-06-03 2005-07-12 Hewlett-Packard Development Company, L.P. MEMS device and method of forming MEMS device
JP4269806B2 (ja) * 2003-06-30 2009-05-27 カシオ計算機株式会社 半導体装置およびその製造方法
US7560789B2 (en) * 2005-05-27 2009-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4519804B2 (ja) 2005-05-27 2010-08-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2007276089A (ja) * 2006-04-11 2007-10-25 Sony Corp 電気機械素子とその製造方法、並びに共振器とその製造方法
US7687833B2 (en) * 2006-05-31 2010-03-30 Stmicroelectronics S.A. Component containing a baw filter
JP2008132583A (ja) * 2006-10-24 2008-06-12 Seiko Epson Corp Ｍｅｍｓデバイス
JP5127210B2 (ja) * 2006-11-30 2013-01-23 株式会社日立製作所 Ｍｅｍｓセンサが混載された半導体装置
JP4337870B2 (ja) * 2006-12-15 2009-09-30 セイコーエプソン株式会社 Ｍｅｍｓレゾネータ及びｍｅｍｓレゾネータの製造方法
US7687297B2 (en) * 2007-06-29 2010-03-30 Intel Corporation Forming a cantilever assembly for vertical and lateral movement
JP5352975B2 (ja) 2007-08-31 2013-11-27 オムロン株式会社 素子集合体及びその製造方法

Also Published As

Publication number Publication date
KR101541906B1 (ko) 2015-08-03
JP2009131951A (ja) 2009-06-18
US7872320B2 (en) 2011-01-18
US20110159626A1 (en) 2011-06-30
KR20090047357A (ko) 2009-05-12
US20090117364A1 (en) 2009-05-07
US8168461B2 (en) 2012-05-01

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