JP5270821B2 - 基板成膜用真空クラスタ（変形） - Google Patents

基板成膜用真空クラスタ（変形） Download PDF

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Publication number
JP5270821B2
JP5270821B2 JP2006195704A JP2006195704A JP5270821B2 JP 5270821 B2 JP5270821 B2 JP 5270821B2 JP 2006195704 A JP2006195704 A JP 2006195704A JP 2006195704 A JP2006195704 A JP 2006195704A JP 5270821 B2 JP5270821 B2 JP 5270821B2
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Japan
Prior art keywords
processing
vacuum
substrate
vacuum chamber
compartment
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Expired - Fee Related
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JP2006195704A
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English (en)
Japanese (ja)
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JP2007023387A (ja
Inventor
ブラジミール ヤコブレヴィッチ シリポブ
アイラト ハミトビッチ ヒサモブ
セルゲイ パブロビッチ マリシェブ
ニコライ エヴゲニェヴィッチ レヴチュク
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MARYSHEV, SERGEY, PAVLOVICH
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MARYSHEV, SERGEY, PAVLOVICH
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  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2006195704A 2005-07-18 2006-07-18 基板成膜用真空クラスタ（変形） Expired - Fee Related JP5270821B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EA200501183 2005-07-18
EA200501183A EA007701B1 (ru) 2005-07-18 2005-07-18 Вакуумный кластер для нанесения покрытий на подложку (варианты)

Publications (2)

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JP2007023387A JP2007023387A (ja) 2007-02-01
JP5270821B2 true JP5270821B2 (ja) 2013-08-21

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JP2006195704A Expired - Fee Related JP5270821B2 (ja) 2005-07-18 2006-07-18 基板成膜用真空クラスタ（変形）

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JP (1) JP5270821B2 (ru)
CN (1) CN1900349B (ru)
EA (1) EA007701B1 (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5142796B2 (ja) * 2008-04-11 2013-02-13 キヤノン株式会社 画像処理システム、画像処理方法、プログラム
RU2767915C1 (ru) * 2020-12-14 2022-03-22 Общество с ограниченной ответственностью "Оксифилм" (ООО "Оксифилм") Система для проведения процесса химического осаждения из паров летучих прекурсоров

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62167874A (ja) * 1986-01-17 1987-07-24 Sumitomo Electric Ind Ltd 蒸着るつぼ交換装置
RU2030263C1 (ru) * 1990-12-12 1995-03-10 Геллер Сергей Владимирович Горелка для ручной сварки плавящимся электродом
JPH08325726A (ja) * 1995-05-29 1996-12-10 Hitachi Ltd カソード電極
JP2000077506A (ja) * 1998-08-28 2000-03-14 Fuji Electric Co Ltd スパッタリング装置
US6460369B2 (en) * 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
JP2001131739A (ja) * 1999-11-05 2001-05-15 Mitsubishi Heavy Ind Ltd シャッタ付き同軸型スパッタ成膜装置
RU2158664C1 (ru) * 2000-03-06 2000-11-10 Закрытое акционерное общество "Авиационные технологии" Установка для электронно-лучевой сварки
EA003148B1 (ru) * 2000-07-05 2003-02-27 Владимир Яковлевич ШИРИПОВ Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку
RU2187576C2 (ru) * 2000-09-14 2002-08-20 Государственное предприятие Всероссийский научно-исследовательский институт авиационных материалов Установка для нанесения защитных покрытий
KR20040043046A (ko) * 2002-11-15 2004-05-22 삼성전자주식회사 마그네트론 스퍼터링 장치 및 스퍼터링 방법

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Publication number Publication date
JP2007023387A (ja) 2007-02-01
CN1900349A (zh) 2007-01-24
EA200501183A1 (ru) 2006-12-29
EA007701B1 (ru) 2006-12-29
CN1900349B (zh) 2010-08-25

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