JP5264750B2 - 銅/ルテニウム/タンタル基板のcmp - Google Patents
銅/ルテニウム/タンタル基板のcmp Download PDFInfo
- Publication number
- JP5264750B2 JP5264750B2 JP2009535365A JP2009535365A JP5264750B2 JP 5264750 B2 JP5264750 B2 JP 5264750B2 JP 2009535365 A JP2009535365 A JP 2009535365A JP 2009535365 A JP2009535365 A JP 2009535365A JP 5264750 B2 JP5264750 B2 JP 5264750B2
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- JP
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- Prior art keywords
- polishing composition
- polishing
- copper
- acid
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
この例は、本発明の方法によって達成可能な、銅、ルテニウム、タンタル、及びテトラエチルオルソシリケートから作り出す酸化ケイ素誘電体材料にみられる除去速度についてカルシウムイオンの効果を立証する。本例では、酸化ケイ素誘電体材料を「TEOS」という。
この例は、銅、ルテニウム、タンタル、及びTEOSの除去速度について、α−アルミナを含む研磨組成物へのシリカ砥材の添加効果を立証する。
この例は、銅、ルテニウム、タンタル、及びTEOSの除去速度についての両親媒性界面活性剤の効果を立証する。
この例は、バリア研磨において銅のディッシングを減らす本発明の研磨組成物中の両親媒性非イオン性界面活性剤の存在を立証する。
Claims (16)
- (a)0.01wt%〜10wt%の砥材であって、ポリ(2−アクリルアミド−2−メチルプロパンスルホン酸)及びポリスチレンスルホン酸からなる群から選択される負に帯電したポリマーまたは共重合体で処理されたαアルミナを含む砥材、
(b)0.01wt%〜10wt%の酸化剤、
(c)1ppm〜5000ppmの、頭部基及び末端基を含む両親媒性非イオン性界面活性剤であって、10000〜16000g/molの分子量を有する、両親媒性非イオン性界面活性剤、
(d)1ppm〜500ppmのカルシウムイオンまたはマグネシウムイオン、
(e)0.001wt%〜0.5wt%の銅の腐食防止剤、及び
(f)水、
を含む、pHが6〜12の化学機械研磨組成物。 - 該研磨組成物がさらにシリカを含む、請求項1に記載の研磨組成物。
- 該酸化剤が過酸化水素であり、そして該研磨組成物が0.1wt%〜5wt%の過酸化水素を含む、請求項1に記載の研磨組成物。
- 該研磨組成物が、マロン酸、コハク酸、アジピン酸、乳酸、リンゴ酸、クエン酸、グリシン、アスパラギン酸、グルコン酸、イミノ二酢酸、フマル酸、及びそれらの組み合わせからなる群から選択される有機酸をさらに含む、請求項1に記載の研磨組成物。
- 該研磨組成物が酒石酸をさらに含む、請求項1に記載の研磨組成物。
- 該両親媒性非イオン性界面活性剤が、ポリオキシエチレン及びポリエチレンを含むブロックまたはグラフト共重合体である、請求項1に記載の研磨組成物。
- 該両親媒性非イオン性界面活性剤が8以上のHLBを有する、請求項6に記載の研磨組成物。
- 該銅の腐食防止剤が、ベンゾトリアゾール、4−メチルベンゾトリアゾール、5−メチルベンゾトリアゾール、5−クロロベンゾトリアゾール、及びそれらの組み合わせからなる群から選択される少なくとも1種の複素環式化合物である、請求項1に記載の研磨組成物。
- 該銅の腐食防止剤がベンゾトリアゾールであり、そして該研磨組成物が0.005wt%〜0.1wt%のベンゾトリアゾールを含む、請求項8に記載の研磨組成物。
- 該研磨組成物が5ppm〜250ppmのカルシウムイオンを含む、請求項1に記載の研磨組成物。
- 該研磨組成物が水酸化アンモニウムをさらに含む、請求項1に記載の研磨組成物。
- 該研磨組成物のpHが7〜9である、請求項1に記載の研磨組成物。
- 基板を化学的機械的に研磨する方法であって、
(i)基板を準備すること;
(ii)請求項1〜12のいずれか一項に記載の研磨組成物を準備すること;
(iii)該基板を研磨パッドに、それらの間に該研磨組成物を伴って接触させること;
(iv)該研磨パッド及び該研磨組成物を該基板に対して相対的に動かすこと;並びに
(v)該基板を研磨するために該基板の少なくとも一部を磨り減らすこと、
を含む、化学機械研磨方法。 - 該基板が、銅の少なくとも1層、ルテニウムの少なくとも1層、及びタンタルの少なくとも1層を含み、且つ少なくとも1のルテニウム層が少なくとも1の銅層及び少なくとも1のタンタル層の間に堆積される、請求項13に記載の方法。
- ルテニウムの少なくとも1層及び銅の少なくとも1層が電気的に接触しており、そして該研磨組成物中の銅の開路電位とルテニウムの回路電位との差が50mV以下である、請求項14に記載の方法。
- 少なくとも1つのタンタル層の少なくとも一部が基板を研磨するために磨り減らされる、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/591,730 US20080105652A1 (en) | 2006-11-02 | 2006-11-02 | CMP of copper/ruthenium/tantalum substrates |
US11/591,730 | 2006-11-02 | ||
PCT/US2007/023576 WO2008057593A1 (en) | 2006-11-02 | 2007-11-01 | Cmp of copper/ruthenium/tantalum substrates |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010509755A JP2010509755A (ja) | 2010-03-25 |
JP2010509755A5 JP2010509755A5 (ja) | 2010-12-16 |
JP5264750B2 true JP5264750B2 (ja) | 2013-08-14 |
Family
ID=39358870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009535365A Expired - Fee Related JP5264750B2 (ja) | 2006-11-02 | 2007-11-01 | 銅/ルテニウム/タンタル基板のcmp |
Country Status (10)
Country | Link |
---|---|
US (1) | US20080105652A1 (ja) |
EP (1) | EP2087061B1 (ja) |
JP (1) | JP5264750B2 (ja) |
KR (1) | KR101250568B1 (ja) |
CN (1) | CN101535442B (ja) |
IL (1) | IL198373A (ja) |
MY (1) | MY149382A (ja) |
SG (1) | SG176441A1 (ja) |
TW (1) | TWI358451B (ja) |
WO (1) | WO2008057593A1 (ja) |
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-
2006
- 2006-11-02 US US11/591,730 patent/US20080105652A1/en not_active Abandoned
-
2007
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Also Published As
Publication number | Publication date |
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TWI358451B (en) | 2012-02-21 |
IL198373A0 (en) | 2010-02-17 |
EP2087061A4 (en) | 2011-02-09 |
EP2087061A1 (en) | 2009-08-12 |
WO2008057593A1 (en) | 2008-05-15 |
KR101250568B1 (ko) | 2013-04-03 |
IL198373A (en) | 2014-03-31 |
MY149382A (en) | 2013-08-30 |
TW200833826A (en) | 2008-08-16 |
US20080105652A1 (en) | 2008-05-08 |
CN101535442A (zh) | 2009-09-16 |
SG176441A1 (en) | 2011-12-29 |
CN101535442B (zh) | 2013-07-03 |
JP2010509755A (ja) | 2010-03-25 |
KR20090086421A (ko) | 2009-08-12 |
EP2087061B1 (en) | 2012-08-22 |
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