JP5258590B2 - 集積回路の試験装置 - Google Patents
集積回路の試験装置 Download PDFInfo
- Publication number
- JP5258590B2 JP5258590B2 JP2009008181A JP2009008181A JP5258590B2 JP 5258590 B2 JP5258590 B2 JP 5258590B2 JP 2009008181 A JP2009008181 A JP 2009008181A JP 2009008181 A JP2009008181 A JP 2009008181A JP 5258590 B2 JP5258590 B2 JP 5258590B2
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- Prior art keywords
- wiring
- wiring board
- disposed
- conductive
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 title claims description 109
- 239000000523 sample Substances 0.000 claims description 143
- 238000010438 heat treatment Methods 0.000 claims description 105
- 239000000758 substrate Substances 0.000 claims description 53
- 239000000919 ceramic Substances 0.000 claims description 30
- 230000003014 reinforcing effect Effects 0.000 claims description 19
- 239000000615 nonconductor Substances 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 description 47
- 235000012431 wafers Nutrition 0.000 description 30
- 238000007689 inspection Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 8
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 239000012777 electrically insulating material Substances 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
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- 229920005989 resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009008181A JP5258590B2 (ja) | 2009-01-16 | 2009-01-16 | 集積回路の試験装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009008181A JP5258590B2 (ja) | 2009-01-16 | 2009-01-16 | 集積回路の試験装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010164490A JP2010164490A (ja) | 2010-07-29 |
JP2010164490A5 JP2010164490A5 (enrdf_load_stackoverflow) | 2012-01-26 |
JP5258590B2 true JP5258590B2 (ja) | 2013-08-07 |
Family
ID=42580768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009008181A Active JP5258590B2 (ja) | 2009-01-16 | 2009-01-16 | 集積回路の試験装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5258590B2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11585833B2 (en) | 2021-04-23 | 2023-02-21 | Samsung Electronics Co., Ltd. | Probe card having power converter and test system including the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5928203B2 (ja) | 2012-07-10 | 2016-06-01 | 三菱電機株式会社 | 検査装置 |
CN103795340A (zh) * | 2014-02-14 | 2014-05-14 | 苏州众显电子科技有限公司 | 一种聚光型便携光源的功率表测试高倍聚光电池片装置 |
CN105353253B (zh) * | 2015-11-28 | 2018-04-10 | 南通华夏飞机工程技术股份有限公司 | 航空风扇测试电路 |
JP7157410B2 (ja) * | 2018-02-21 | 2022-10-20 | 国立大学法人大阪大学 | 半導体検査装置及び半導体検査方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1243302B (it) * | 1990-06-19 | 1994-05-26 | St Microelectronics Srl | Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore. |
JP4794777B2 (ja) * | 2001-09-13 | 2011-10-19 | オリンパス株式会社 | 内視鏡用光源装置の回転フィルタ |
JP4439360B2 (ja) * | 2004-09-14 | 2010-03-24 | 株式会社日本マイクロニクス | 電気的接続装置 |
WO2007142204A1 (ja) * | 2006-06-08 | 2007-12-13 | Nhk Spring Co., Ltd. | プローブカード |
JP2008128838A (ja) * | 2006-11-21 | 2008-06-05 | Shinko Electric Ind Co Ltd | プローブ装置 |
JP4981525B2 (ja) * | 2007-06-04 | 2012-07-25 | 日本電子材料株式会社 | 半導体検査装置 |
-
2009
- 2009-01-16 JP JP2009008181A patent/JP5258590B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11585833B2 (en) | 2021-04-23 | 2023-02-21 | Samsung Electronics Co., Ltd. | Probe card having power converter and test system including the same |
Also Published As
Publication number | Publication date |
---|---|
JP2010164490A (ja) | 2010-07-29 |
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