JP5233478B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5233478B2
JP5233478B2 JP2008195484A JP2008195484A JP5233478B2 JP 5233478 B2 JP5233478 B2 JP 5233478B2 JP 2008195484 A JP2008195484 A JP 2008195484A JP 2008195484 A JP2008195484 A JP 2008195484A JP 5233478 B2 JP5233478 B2 JP 5233478B2
Authority
JP
Japan
Prior art keywords
light emitting
package
opening
light
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008195484A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010034325A5 (enrdf_load_stackoverflow
JP2010034325A (ja
Inventor
守人 金田
英夫 朝川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2008195484A priority Critical patent/JP5233478B2/ja
Priority to TW098121659A priority patent/TWI456784B/zh
Priority to EP09802646.1A priority patent/EP2315263B1/en
Priority to BRPI0916438 priority patent/BRPI0916438B1/pt
Priority to KR1020117004530A priority patent/KR101602977B1/ko
Priority to US13/056,580 priority patent/US8525208B2/en
Priority to PCT/JP2009/003192 priority patent/WO2010013396A1/ja
Priority to CN200980129910.7A priority patent/CN102113139B/zh
Publication of JP2010034325A publication Critical patent/JP2010034325A/ja
Publication of JP2010034325A5 publication Critical patent/JP2010034325A5/ja
Application granted granted Critical
Publication of JP5233478B2 publication Critical patent/JP5233478B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)
JP2008195484A 2008-07-29 2008-07-29 発光装置 Active JP5233478B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2008195484A JP5233478B2 (ja) 2008-07-29 2008-07-29 発光装置
TW098121659A TWI456784B (zh) 2008-07-29 2009-06-26 發光裝置
BRPI0916438 BRPI0916438B1 (pt) 2008-07-29 2009-07-08 dispositivo emissor de luz
KR1020117004530A KR101602977B1 (ko) 2008-07-29 2009-07-08 발광 장치
EP09802646.1A EP2315263B1 (en) 2008-07-29 2009-07-08 Light-emitting device
US13/056,580 US8525208B2 (en) 2008-07-29 2009-07-08 Light emitting device
PCT/JP2009/003192 WO2010013396A1 (ja) 2008-07-29 2009-07-08 発光装置
CN200980129910.7A CN102113139B (zh) 2008-07-29 2009-07-08 发光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008195484A JP5233478B2 (ja) 2008-07-29 2008-07-29 発光装置

Publications (3)

Publication Number Publication Date
JP2010034325A JP2010034325A (ja) 2010-02-12
JP2010034325A5 JP2010034325A5 (enrdf_load_stackoverflow) 2011-09-08
JP5233478B2 true JP5233478B2 (ja) 2013-07-10

Family

ID=41738453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008195484A Active JP5233478B2 (ja) 2008-07-29 2008-07-29 発光装置

Country Status (1)

Country Link
JP (1) JP5233478B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012079723A (ja) 2010-09-30 2012-04-19 Toyoda Gosei Co Ltd 発光装置
DE102013214877A1 (de) * 2013-07-30 2015-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Abdeckelements und eines optoelektronischen Bauelements, Abdeckelement und optoelektronisches Bauelement
KR102101400B1 (ko) * 2013-08-20 2020-04-16 엘지디스플레이 주식회사 발광다이오드 패키지 및 이를 이용한 액정표시장치
JP6583297B2 (ja) * 2017-01-20 2019-10-02 日亜化学工業株式会社 発光装置用複合基板および発光装置の製造方法
JP7057512B2 (ja) * 2019-08-30 2022-04-20 日亜化学工業株式会社 発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100550856B1 (ko) * 2003-06-03 2006-02-10 삼성전기주식회사 발광 다이오드(ｌｅｄ) 소자의 제조 방법
JP2007317974A (ja) * 2006-05-29 2007-12-06 Enomoto Co Ltd サイドビュータイプｌｅｄデバイス及びそれを製造する方法
KR100772433B1 (ko) * 2006-08-23 2007-11-01 서울반도체 주식회사 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지
JP4914710B2 (ja) * 2006-12-27 2012-04-11 日立ケーブルプレシジョン株式会社 発光素子実装パッケージ用リードフレームおよびその製造方法

Also Published As

Publication number Publication date
JP2010034325A (ja) 2010-02-12

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