JP5231792B2 - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP5231792B2
JP5231792B2 JP2007317037A JP2007317037A JP5231792B2 JP 5231792 B2 JP5231792 B2 JP 5231792B2 JP 2007317037 A JP2007317037 A JP 2007317037A JP 2007317037 A JP2007317037 A JP 2007317037A JP 5231792 B2 JP5231792 B2 JP 5231792B2
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JP
Japan
Prior art keywords
wire
tip
hole
electronic device
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007317037A
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English (en)
Japanese (ja)
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JP2009141193A5 (https=
JP2009141193A (ja
Inventor
忠宏 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007317037A priority Critical patent/JP5231792B2/ja
Publication of JP2009141193A publication Critical patent/JP2009141193A/ja
Publication of JP2009141193A5 publication Critical patent/JP2009141193A5/ja
Application granted granted Critical
Publication of JP5231792B2 publication Critical patent/JP5231792B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP2007317037A 2007-12-07 2007-12-07 電子装置の製造方法 Expired - Fee Related JP5231792B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007317037A JP5231792B2 (ja) 2007-12-07 2007-12-07 電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007317037A JP5231792B2 (ja) 2007-12-07 2007-12-07 電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009141193A JP2009141193A (ja) 2009-06-25
JP2009141193A5 JP2009141193A5 (https=) 2011-01-27
JP5231792B2 true JP5231792B2 (ja) 2013-07-10

Family

ID=40871510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007317037A Expired - Fee Related JP5231792B2 (ja) 2007-12-07 2007-12-07 電子装置の製造方法

Country Status (1)

Country Link
JP (1) JP5231792B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11757390B2 (en) 2019-11-01 2023-09-12 Mitsubishi Electric Corporation Motor inductance measurement device, motor drive system, and motor inductance measurement method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268038A (ja) * 1988-04-19 1989-10-25 Sanyo Electric Co Ltd ワイヤボンディング方法とボンディングツール及び半導体装置
JPH03127844A (ja) * 1989-10-13 1991-05-30 Fujitsu Ltd ボンディング装置およびボンディング方法
JPH05102232A (ja) * 1991-10-07 1993-04-23 Seiko Epson Corp 半導体製造装置
JP3768168B2 (ja) * 2002-04-10 2006-04-19 株式会社カイジョー 半導体構造およびボンディング方法
JP3902640B2 (ja) * 2002-07-23 2007-04-11 シャープタカヤ電子工業株式会社 ワイヤボンディング方法
JP2004172477A (ja) * 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP4374040B2 (ja) * 2007-06-29 2009-12-02 株式会社東芝 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11757390B2 (en) 2019-11-01 2023-09-12 Mitsubishi Electric Corporation Motor inductance measurement device, motor drive system, and motor inductance measurement method

Also Published As

Publication number Publication date
JP2009141193A (ja) 2009-06-25

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