JP5229189B2 - 電子部品モジュール - Google Patents

電子部品モジュール Download PDF

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Publication number
JP5229189B2
JP5229189B2 JP2009260283A JP2009260283A JP5229189B2 JP 5229189 B2 JP5229189 B2 JP 5229189B2 JP 2009260283 A JP2009260283 A JP 2009260283A JP 2009260283 A JP2009260283 A JP 2009260283A JP 5229189 B2 JP5229189 B2 JP 5229189B2
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JP
Japan
Prior art keywords
protrusion
resin layer
substrate
electronic component
component module
Prior art date
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Active
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JP2009260283A
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English (en)
Japanese (ja)
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JP2010045393A (ja
JP2010045393A5 (enExample
Inventor
広忠 古川
さゆり 寺崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2009260283A priority Critical patent/JP5229189B2/ja
Publication of JP2010045393A publication Critical patent/JP2010045393A/ja
Publication of JP2010045393A5 publication Critical patent/JP2010045393A5/ja
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Publication of JP5229189B2 publication Critical patent/JP5229189B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2009260283A 2009-11-13 2009-11-13 電子部品モジュール Active JP5229189B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009260283A JP5229189B2 (ja) 2009-11-13 2009-11-13 電子部品モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009260283A JP5229189B2 (ja) 2009-11-13 2009-11-13 電子部品モジュール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007307172A Division JP4434268B2 (ja) 2007-11-28 2007-11-28 電子部品モジュール

Publications (3)

Publication Number Publication Date
JP2010045393A JP2010045393A (ja) 2010-02-25
JP2010045393A5 JP2010045393A5 (enExample) 2010-11-18
JP5229189B2 true JP5229189B2 (ja) 2013-07-03

Family

ID=42016458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009260283A Active JP5229189B2 (ja) 2009-11-13 2009-11-13 電子部品モジュール

Country Status (1)

Country Link
JP (1) JP5229189B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015019519A1 (ja) * 2013-08-07 2015-02-12 パナソニックＩｐマネジメント株式会社 Ｄｃ－ｄｃコンバータモジュール
JP6489286B2 (ja) * 2016-04-13 2019-03-27 株式会社村田製作所 インダクタモジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4030028B2 (ja) * 1996-12-26 2008-01-09 シチズン電子株式会社 Ｓｍｄ型回路装置及びその製造方法
JP3365622B2 (ja) * 1999-12-17 2003-01-14 松下電器産業株式会社 Ｌｃ複合部品および電源素子
JP2001203108A (ja) * 2000-01-18 2001-07-27 Tdk Corp コイル装置
JP2002233140A (ja) * 2001-01-30 2002-08-16 Fuji Electric Co Ltd 超小型電力変換装置
JP2007195286A (ja) * 2006-01-17 2007-08-02 Tdk Corp Ｄｃ−ｄｃコンバータ及びコイル部品

Also Published As

Publication number Publication date
JP2010045393A (ja) 2010-02-25

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