JP5225825B2 - 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法 - Google Patents

半導体素子収納用パッケージの製造方法及び半導体装置の製造方法 Download PDF

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Publication number
JP5225825B2
JP5225825B2 JP2008321463A JP2008321463A JP5225825B2 JP 5225825 B2 JP5225825 B2 JP 5225825B2 JP 2008321463 A JP2008321463 A JP 2008321463A JP 2008321463 A JP2008321463 A JP 2008321463A JP 5225825 B2 JP5225825 B2 JP 5225825B2
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Japan
Prior art keywords
semiconductor element
relay substrate
manufacturing
coaxial connector
wiring pattern
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JP2008321463A
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Japanese (ja)
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JP2010147187A5 (enExample
JP2010147187A (ja
Inventor
幹夫 巣山
美鈴 待井
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008321463A priority Critical patent/JP5225825B2/ja
Publication of JP2010147187A publication Critical patent/JP2010147187A/ja
Publication of JP2010147187A5 publication Critical patent/JP2010147187A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]

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  • Semiconductor Lasers (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2008321463A 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法 Active JP5225825B2 (ja)

Priority Applications (1)

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JP2008321463A JP5225825B2 (ja) 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法

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Application Number Priority Date Filing Date Title
JP2008321463A JP5225825B2 (ja) 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法

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JP2010147187A JP2010147187A (ja) 2010-07-01
JP2010147187A5 JP2010147187A5 (enExample) 2011-12-01
JP5225825B2 true JP5225825B2 (ja) 2013-07-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094838B2 (ja) 1995-04-17 2000-10-03 住友金属工業株式会社 熱間仕上げ圧延における速度制御方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012011393A (ja) 2010-06-29 2012-01-19 Kobe Steel Ltd せん断用金型及びその製造方法
JP6166101B2 (ja) * 2013-05-29 2017-07-19 京セラ株式会社 光半導体素子収納用パッケージおよびこれを備えた実装構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3752473B2 (ja) * 2002-06-19 2006-03-08 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2006128323A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094838B2 (ja) 1995-04-17 2000-10-03 住友金属工業株式会社 熱間仕上げ圧延における速度制御方法

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