JP5225089B2 - 直接ロードプラテンを用いた研磨装置および方法 - Google Patents

直接ロードプラテンを用いた研磨装置および方法 Download PDF

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Publication number
JP5225089B2
JP5225089B2 JP2008533459A JP2008533459A JP5225089B2 JP 5225089 B2 JP5225089 B2 JP 5225089B2 JP 2008533459 A JP2008533459 A JP 2008533459A JP 2008533459 A JP2008533459 A JP 2008533459A JP 5225089 B2 JP5225089 B2 JP 5225089B2
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Japan
Prior art keywords
substrate
polishing
platen
loading
robot
Prior art date
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Expired - Fee Related
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JP2008533459A
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English (en)
Japanese (ja)
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JP2009509782A (ja
JP2009509782A5 (enExample
Inventor
ハン チー チェン，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008533459A 2005-09-30 2006-09-21 直接ロードプラテンを用いた研磨装置および方法 Expired - Fee Related JP5225089B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/241,254 2005-09-30
US11/241,254 US7198548B1 (en) 2005-09-30 2005-09-30 Polishing apparatus and method with direct load platen
PCT/US2006/036940 WO2007041020A1 (en) 2005-09-30 2006-09-21 Polishing apparatus and method with direct load platen background

Publications (3)

Publication Number Publication Date
JP2009509782A JP2009509782A (ja) 2009-03-12
JP2009509782A5 JP2009509782A5 (enExample) 2009-10-08
JP5225089B2 true JP5225089B2 (ja) 2013-07-03

Family

ID=37517023

Family Applications (1)

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JP2008533459A Expired - Fee Related JP5225089B2 (ja) 2005-09-30 2006-09-21 直接ロードプラテンを用いた研磨装置および方法

Country Status (4)

Country Link
US (1) US7198548B1 (enExample)
JP (1) JP5225089B2 (enExample)
CN (2) CN103203685A (enExample)
WO (1) WO2007041020A1 (enExample)

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CN102084466B (zh) * 2008-07-01 2013-09-11 应用材料公司 模块化底板半导体抛光器结构
US8528886B2 (en) * 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
US8442659B2 (en) * 2009-02-18 2013-05-14 Mei, Llc Rotary actuator position sensor
JP6073222B2 (ja) * 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
CN102240927B (zh) * 2011-05-30 2014-01-08 清华大学 利用化学机械抛光设备进行化学机械抛光的方法
US20140141696A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. Polishing System with In-Sequence Sensor
CN106463384B (zh) * 2014-07-18 2020-03-17 应用材料公司 修改基板厚度轮廓
JP6403015B2 (ja) * 2015-07-21 2018-10-10 東芝メモリ株式会社 研磨装置および半導体製造方法
CN105598827B (zh) * 2016-01-05 2018-05-22 天津华海清科机电科技有限公司 化学机械抛光机
CN108818299B (zh) * 2018-06-06 2023-08-18 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
SG11202103477TA (en) * 2018-09-07 2021-05-28 Hangzhou Zhonggui Electronic Technology Co Ltd Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
JP7763244B2 (ja) 2020-09-08 2025-10-31 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ処理のための基板ハンドリングシステム及び方法
CN112223109A (zh) * 2020-09-27 2021-01-15 湖北匠达智能装备有限公司 一种阀板自动上料装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
CN115091340B (zh) * 2022-07-25 2025-12-19 上饶市名创智能科技有限公司 全自动智能抛光机
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments
CN117754441B (zh) * 2024-01-23 2024-06-28 邢台永庆轴承有限公司 一种轴承套圈双面自动抛光设备及抛光方法

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KR860008003A (ko) * 1985-04-08 1986-11-10 제이·로렌스 킨 양면 포리싱 작업용 캐리어 조립체
JPH0825122B2 (ja) * 1988-01-08 1996-03-13 九州電子金属株式会社 薄円板状被加工物の加圧盤に対する位置決め装置
US5238354A (en) 1989-05-23 1993-08-24 Cybeq Systems, Inc. Semiconductor object pre-aligning apparatus
US5616603A (en) 1995-05-26 1997-04-01 Smithkline Beecham Plc Enantiomers of carbazole derivatives as 5-HT1 -like agonists
JP3623220B2 (ja) * 1993-09-21 2005-02-23 株式会社東芝 ポリッシング装置及び方法
KR100258802B1 (ko) * 1995-02-15 2000-06-15 전주범 평탄화 장치 및 그를 이용한 평탄화 방법
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
KR100306824B1 (ko) * 1998-05-06 2001-11-30 윤종용 화학적기계적평탄화기계를위한웨이퍼홀더
US6436228B1 (en) 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
JP3132468B2 (ja) * 1998-05-20 2001-02-05 日本電気株式会社 半導体ウェハ研磨装置及びその研磨方法
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FR2806551B1 (fr) 2000-03-15 2002-05-10 Valeo Electronique Procedes et dispositifs pour le suivi de la rotation de moteurs electriques a courant continu
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US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
WO2002096601A1 (en) * 2001-05-29 2002-12-05 Ebara Corporation Polishing apparatus and polishing method
JP2006319249A (ja) * 2005-05-16 2006-11-24 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス

Also Published As

Publication number Publication date
US20070077861A1 (en) 2007-04-05
WO2007041020A1 (en) 2007-04-12
CN101277787B (zh) 2014-07-09
US7198548B1 (en) 2007-04-03
JP2009509782A (ja) 2009-03-12
CN103203685A (zh) 2013-07-17
CN101277787A (zh) 2008-10-01

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