CN103203685A - 具有直接装载台板的抛光设备和方法 - Google Patents

具有直接装载台板的抛光设备和方法 Download PDF

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Publication number
CN103203685A
CN103203685A CN201310076001XA CN201310076001A CN103203685A CN 103203685 A CN103203685 A CN 103203685A CN 201310076001X A CN201310076001X A CN 201310076001XA CN 201310076001 A CN201310076001 A CN 201310076001A CN 103203685 A CN103203685 A CN 103203685A
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CN
China
Prior art keywords
substrate
polishing
carrier head
manipulator
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310076001XA
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English (en)
Chinese (zh)
Inventor
陈宏清
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN103203685A publication Critical patent/CN103203685A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201310076001XA 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法 Pending CN103203685A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/241,254 2005-09-30
US11/241,254 US7198548B1 (en) 2005-09-30 2005-09-30 Polishing apparatus and method with direct load platen

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200680036363.4A Division CN101277787B (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Publications (1)

Publication Number Publication Date
CN103203685A true CN103203685A (zh) 2013-07-17

Family

ID=37517023

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310076001XA Pending CN103203685A (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法
CN200680036363.4A Expired - Fee Related CN101277787B (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200680036363.4A Expired - Fee Related CN101277787B (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Country Status (4)

Country Link
US (1) US7198548B1 (enExample)
JP (1) JP5225089B2 (enExample)
CN (2) CN103203685A (enExample)
WO (1) WO2007041020A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818299A (zh) * 2018-06-06 2018-11-16 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102084466B (zh) * 2008-07-01 2013-09-11 应用材料公司 模块化底板半导体抛光器结构
US8528886B2 (en) * 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
US8442659B2 (en) * 2009-02-18 2013-05-14 Mei, Llc Rotary actuator position sensor
JP6073222B2 (ja) * 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
CN102240927B (zh) * 2011-05-30 2014-01-08 清华大学 利用化学机械抛光设备进行化学机械抛光的方法
US9227293B2 (en) * 2012-11-21 2016-01-05 Applied Materials, Inc. Multi-platen multi-head polishing architecture
WO2016010865A1 (en) * 2014-07-18 2016-01-21 Applied Materials, Inc. Modifying substrate thickness profiles
JP6403015B2 (ja) * 2015-07-21 2018-10-10 東芝メモリ株式会社 研磨装置および半導体製造方法
CN105598827B (zh) * 2016-01-05 2018-05-22 天津华海清科机电科技有限公司 化学机械抛光机
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
US12251785B2 (en) * 2018-09-07 2025-03-18 Hangzhou Sizone Electronic Technology Inc. Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
JP7763244B2 (ja) 2020-09-08 2025-10-31 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ処理のための基板ハンドリングシステム及び方法
CN112223109A (zh) * 2020-09-27 2021-01-15 湖北匠达智能装备有限公司 一种阀板自动上料装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
CN115091340B (zh) * 2022-07-25 2025-12-19 上饶市名创智能科技有限公司 全自动智能抛光机
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments
CN117754441B (zh) * 2024-01-23 2024-06-28 邢台永庆轴承有限公司 一种轴承套圈双面自动抛光设备及抛光方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85105523A (zh) * 1985-04-08 1986-07-02 罗德尔股份有限公司 两面抛光操作中使用的夹头组件
CN1132676A (zh) * 1995-02-15 1996-10-09 大宇电子株式会社 抛光衬底上形成的介质层的装置
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6146256A (en) * 1998-05-06 2000-11-14 Samsung Electronics, Co. Ltd. Clamping wafer holder for chemical-mechanical planarization machines and method for using it
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US20020164929A1 (en) * 2000-04-05 2002-11-07 Pinson Jay D. Method of polishing and cleaning substrates
CN1512929A (zh) * 2001-05-29 2004-07-14 株式会社荏原制作所 抛光装置与抛光方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825122B2 (ja) * 1988-01-08 1996-03-13 九州電子金属株式会社 薄円板状被加工物の加圧盤に対する位置決め装置
US5238354A (en) 1989-05-23 1993-08-24 Cybeq Systems, Inc. Semiconductor object pre-aligning apparatus
US5616603A (en) 1995-05-26 1997-04-01 Smithkline Beecham Plc Enantiomers of carbazole derivatives as 5-HT1 -like agonists
JP3623220B2 (ja) * 1993-09-21 2005-02-23 株式会社東芝 ポリッシング装置及び方法
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
JP3132468B2 (ja) * 1998-05-20 2001-02-05 日本電気株式会社 半導体ウェハ研磨装置及びその研磨方法
JP2000210865A (ja) * 1999-01-25 2000-08-02 Nichiden Mach Ltd 平面研磨装置
US6716086B1 (en) * 1999-06-14 2004-04-06 Applied Materials Inc. Edge contact loadcup
FR2806551B1 (fr) 2000-03-15 2002-05-10 Valeo Electronique Procedes et dispositifs pour le suivi de la rotation de moteurs electriques a courant continu
US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
JP2006319249A (ja) * 2005-05-16 2006-11-24 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85105523A (zh) * 1985-04-08 1986-07-02 罗德尔股份有限公司 两面抛光操作中使用的夹头组件
CN1132676A (zh) * 1995-02-15 1996-10-09 大宇电子株式会社 抛光衬底上形成的介质层的装置
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6146256A (en) * 1998-05-06 2000-11-14 Samsung Electronics, Co. Ltd. Clamping wafer holder for chemical-mechanical planarization machines and method for using it
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US20020164929A1 (en) * 2000-04-05 2002-11-07 Pinson Jay D. Method of polishing and cleaning substrates
CN1512929A (zh) * 2001-05-29 2004-07-14 株式会社荏原制作所 抛光装置与抛光方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818299A (zh) * 2018-06-06 2018-11-16 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法
CN108818299B (zh) * 2018-06-06 2023-08-18 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法

Also Published As

Publication number Publication date
CN101277787B (zh) 2014-07-09
US7198548B1 (en) 2007-04-03
CN101277787A (zh) 2008-10-01
JP2009509782A (ja) 2009-03-12
WO2007041020A1 (en) 2007-04-12
JP5225089B2 (ja) 2013-07-03
US20070077861A1 (en) 2007-04-05

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Application publication date: 20130717