JP5197505B2 - ウエハチャック用の温度センサ - Google Patents

ウエハチャック用の温度センサ Download PDF

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Publication number
JP5197505B2
JP5197505B2 JP2009147061A JP2009147061A JP5197505B2 JP 5197505 B2 JP5197505 B2 JP 5197505B2 JP 2009147061 A JP2009147061 A JP 2009147061A JP 2009147061 A JP2009147061 A JP 2009147061A JP 5197505 B2 JP5197505 B2 JP 5197505B2
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JP
Japan
Prior art keywords
temperature sensor
wafer chuck
fixing block
wafer
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009147061A
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English (en)
Japanese (ja)
Other versions
JP2011002390A (ja
JP2011002390A5 (enExample
Inventor
榮一 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009147061A priority Critical patent/JP5197505B2/ja
Priority to KR1020100053856A priority patent/KR101267670B1/ko
Priority to TW99119932A priority patent/TWI471538B/zh
Publication of JP2011002390A publication Critical patent/JP2011002390A/ja
Publication of JP2011002390A5 publication Critical patent/JP2011002390A5/ja
Application granted granted Critical
Publication of JP5197505B2 publication Critical patent/JP5197505B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2009147061A 2009-06-19 2009-06-19 ウエハチャック用の温度センサ Active JP5197505B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009147061A JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ
KR1020100053856A KR101267670B1 (ko) 2009-06-19 2010-06-08 웨이퍼 척용 온도 센서
TW99119932A TWI471538B (zh) 2009-06-19 2010-06-18 Temperature sensor for wafer cups

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009147061A JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ

Publications (3)

Publication Number Publication Date
JP2011002390A JP2011002390A (ja) 2011-01-06
JP2011002390A5 JP2011002390A5 (enExample) 2012-06-07
JP5197505B2 true JP5197505B2 (ja) 2013-05-15

Family

ID=43510815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009147061A Active JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ

Country Status (3)

Country Link
JP (1) JP5197505B2 (enExample)
KR (1) KR101267670B1 (enExample)
TW (1) TWI471538B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277651B (zh) * 2013-06-13 2016-04-06 新乡学院 一种用于高温热探测的陶瓷基座
JP2016161356A (ja) * 2015-02-27 2016-09-05 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN108780753B (zh) * 2016-03-28 2023-04-25 株式会社国际电气 基板处理装置、温度测定单元及半导体器件的制造方法
CN110739657B (zh) * 2018-07-20 2021-09-21 施耐德电器工业公司 用于环网柜的电缆头及环网柜
TWI797484B (zh) * 2020-10-06 2023-04-01 致茂電子股份有限公司 晶圓吸盤檢測系統
JP7474678B2 (ja) 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090638U (ja) * 1983-11-26 1985-06-21 株式会社三共合金鋳造所 温度測定治具
JPS6124628U (ja) * 1984-07-11 1986-02-14 三菱重工業株式会社 熱電対取付治具
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JP2000286207A (ja) * 1999-03-30 2000-10-13 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP4659328B2 (ja) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
JP4307130B2 (ja) * 2003-04-08 2009-08-05 キヤノン株式会社 露光装置
EP1800067A1 (en) * 2004-10-14 2007-06-27 Celerity, Inc. Method and system for wafer temperature control
JP4905290B2 (ja) 2007-08-09 2012-03-28 住友電気工業株式会社 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Also Published As

Publication number Publication date
TW201129787A (en) 2011-09-01
JP2011002390A (ja) 2011-01-06
TWI471538B (zh) 2015-02-01
KR20100136915A (ko) 2010-12-29
KR101267670B1 (ko) 2013-05-24

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