KR101267670B1 - 웨이퍼 척용 온도 센서 - Google Patents

웨이퍼 척용 온도 센서 Download PDF

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Publication number
KR101267670B1
KR101267670B1 KR1020100053856A KR20100053856A KR101267670B1 KR 101267670 B1 KR101267670 B1 KR 101267670B1 KR 1020100053856 A KR1020100053856 A KR 1020100053856A KR 20100053856 A KR20100053856 A KR 20100053856A KR 101267670 B1 KR101267670 B1 KR 101267670B1
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KR
South Korea
Prior art keywords
temperature sensor
wafer chuck
fixing block
wafer
chuck
Prior art date
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KR1020100053856A
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English (en)
Korean (ko)
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KR20100136915A (ko
Inventor
에이이치 시노하라
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100136915A publication Critical patent/KR20100136915A/ko
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Publication of KR101267670B1 publication Critical patent/KR101267670B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
KR1020100053856A 2009-06-19 2010-06-08 웨이퍼 척용 온도 센서 Active KR101267670B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-147061 2009-06-19
JP2009147061A JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ

Publications (2)

Publication Number Publication Date
KR20100136915A KR20100136915A (ko) 2010-12-29
KR101267670B1 true KR101267670B1 (ko) 2013-05-24

Family

ID=43510815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100053856A Active KR101267670B1 (ko) 2009-06-19 2010-06-08 웨이퍼 척용 온도 센서

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JP (1) JP5197505B2 (enExample)
KR (1) KR101267670B1 (enExample)
TW (1) TWI471538B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277651B (zh) * 2013-06-13 2016-04-06 新乡学院 一种用于高温热探测的陶瓷基座
JP2016161356A (ja) * 2015-02-27 2016-09-05 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN108780753B (zh) * 2016-03-28 2023-04-25 株式会社国际电气 基板处理装置、温度测定单元及半导体器件的制造方法
CN110739657B (zh) * 2018-07-20 2021-09-21 施耐德电器工业公司 用于环网柜的电缆头及环网柜
TWI797484B (zh) * 2020-10-06 2023-04-01 致茂電子股份有限公司 晶圓吸盤檢測系統
JP7474678B2 (ja) 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009042070A (ja) 2007-08-09 2009-02-26 Sei Hybrid Kk 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090638U (ja) * 1983-11-26 1985-06-21 株式会社三共合金鋳造所 温度測定治具
JPS6124628U (ja) * 1984-07-11 1986-02-14 三菱重工業株式会社 熱電対取付治具
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JP2000286207A (ja) * 1999-03-30 2000-10-13 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP4659328B2 (ja) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
JP4307130B2 (ja) * 2003-04-08 2009-08-05 キヤノン株式会社 露光装置
EP1800067A1 (en) * 2004-10-14 2007-06-27 Celerity, Inc. Method and system for wafer temperature control

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009042070A (ja) 2007-08-09 2009-02-26 Sei Hybrid Kk 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Also Published As

Publication number Publication date
TW201129787A (en) 2011-09-01
JP2011002390A (ja) 2011-01-06
TWI471538B (zh) 2015-02-01
KR20100136915A (ko) 2010-12-29
JP5197505B2 (ja) 2013-05-15

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