TWI471538B - Temperature sensor for wafer cups - Google Patents

Temperature sensor for wafer cups Download PDF

Info

Publication number
TWI471538B
TWI471538B TW99119932A TW99119932A TWI471538B TW I471538 B TWI471538 B TW I471538B TW 99119932 A TW99119932 A TW 99119932A TW 99119932 A TW99119932 A TW 99119932A TW I471538 B TWI471538 B TW I471538B
Authority
TW
Taiwan
Prior art keywords
temperature sensor
wafer chuck
temperature
wafer
fixing block
Prior art date
Application number
TW99119932A
Other languages
English (en)
Chinese (zh)
Other versions
TW201129787A (en
Inventor
Eiichi Shinohara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201129787A publication Critical patent/TW201129787A/zh
Application granted granted Critical
Publication of TWI471538B publication Critical patent/TWI471538B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW99119932A 2009-06-19 2010-06-18 Temperature sensor for wafer cups TWI471538B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009147061A JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ

Publications (2)

Publication Number Publication Date
TW201129787A TW201129787A (en) 2011-09-01
TWI471538B true TWI471538B (zh) 2015-02-01

Family

ID=43510815

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99119932A TWI471538B (zh) 2009-06-19 2010-06-18 Temperature sensor for wafer cups

Country Status (3)

Country Link
JP (1) JP5197505B2 (enExample)
KR (1) KR101267670B1 (enExample)
TW (1) TWI471538B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624671B (zh) * 2015-02-27 2018-05-21 Seiko Epson Corp Electronic component conveying device and electronic component inspection device
TWI797484B (zh) * 2020-10-06 2023-04-01 致茂電子股份有限公司 晶圓吸盤檢測系統

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277651B (zh) * 2013-06-13 2016-04-06 新乡学院 一种用于高温热探测的陶瓷基座
CN108780753B (zh) * 2016-03-28 2023-04-25 株式会社国际电气 基板处理装置、温度测定单元及半导体器件的制造方法
CN110739657B (zh) * 2018-07-20 2021-09-21 施耐德电器工业公司 用于环网柜的电缆头及环网柜
JP7474678B2 (ja) 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
US6084938A (en) * 1996-03-12 2000-07-04 Canon Kabushiki Kaisha X-ray projection exposure apparatus and a device manufacturing method
TW200406862A (en) * 2002-10-21 2004-05-01 Tokyo Electron Ltd Probe apparatus for temperature control of the examined body and probe examining method
TW200629351A (en) * 2004-10-14 2006-08-16 Entegris Inc Method and system for wafer temperature control
US7325404B2 (en) * 2003-04-08 2008-02-05 Canon Kabushiki Kaisha Exposure apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090638U (ja) * 1983-11-26 1985-06-21 株式会社三共合金鋳造所 温度測定治具
JPS6124628U (ja) * 1984-07-11 1986-02-14 三菱重工業株式会社 熱電対取付治具
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000286207A (ja) * 1999-03-30 2000-10-13 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP4905290B2 (ja) 2007-08-09 2012-03-28 住友電気工業株式会社 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
US6084938A (en) * 1996-03-12 2000-07-04 Canon Kabushiki Kaisha X-ray projection exposure apparatus and a device manufacturing method
TW200406862A (en) * 2002-10-21 2004-05-01 Tokyo Electron Ltd Probe apparatus for temperature control of the examined body and probe examining method
US7325404B2 (en) * 2003-04-08 2008-02-05 Canon Kabushiki Kaisha Exposure apparatus
TW200629351A (en) * 2004-10-14 2006-08-16 Entegris Inc Method and system for wafer temperature control

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624671B (zh) * 2015-02-27 2018-05-21 Seiko Epson Corp Electronic component conveying device and electronic component inspection device
TWI797484B (zh) * 2020-10-06 2023-04-01 致茂電子股份有限公司 晶圓吸盤檢測系統

Also Published As

Publication number Publication date
TW201129787A (en) 2011-09-01
JP2011002390A (ja) 2011-01-06
KR20100136915A (ko) 2010-12-29
JP5197505B2 (ja) 2013-05-15
KR101267670B1 (ko) 2013-05-24

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