JP5197505B2 - ウエハチャック用の温度センサ - Google Patents
ウエハチャック用の温度センサ Download PDFInfo
- Publication number
- JP5197505B2 JP5197505B2 JP2009147061A JP2009147061A JP5197505B2 JP 5197505 B2 JP5197505 B2 JP 5197505B2 JP 2009147061 A JP2009147061 A JP 2009147061A JP 2009147061 A JP2009147061 A JP 2009147061A JP 5197505 B2 JP5197505 B2 JP 5197505B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- wafer chuck
- fixing block
- wafer
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 20
- 230000037431 insertion Effects 0.000 claims description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 83
- 238000007689 inspection Methods 0.000 description 19
- 239000000523 sample Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
11 測温体
12 ケーブル
13 固定用ブロック
13A 第1の貫通孔(貫通孔)
14 取付部材
15 連結部材(第1のネジ部材)
20 ウエハチャック
21B 挿入孔
Claims (5)
- ウエハチャックの側面に形成された挿入孔内に挿入された測温体によってウエハチャックに保持されたウエハの処理温度を測定する温度センサであって、上記ウエハチャックの挿入孔に対応する貫通孔を有する固定用ブロックを上記ウエハチャックの側面に連結部材を介して連結し、且つ、上記貫通孔から上記挿入孔に挿入される測温体の基部に設けられた取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするウエハチャック用の温度センサ。
- ウエハチャックに保持されたウエハの処理温度を測定するために、上記ウエハチャックの側面に形成された挿入孔に測温体が挿入され、固定用ブロックを介して上記ウエハチャックに取り付けられる温度センサであって、上記固定用ブロックは、上記測温体が貫通し且つ上記測温体の基部で一体化した取付部材が装着される貫通孔と、上記固定用ブロックを上記ウエハチャックに連結するための連結部材と、を備え、上記取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするウエハチャック用の温度センサ。
- 上記測温体は、保護管内に収納された白金抵抗素子を主体に構成されていることを特徴とする請求項1または請求項2に記載のウエハチャック用の温度センサ。
- 上記固定用ブロックは高絶縁性材料によって形成されていることを特徴とする請求項1〜は請求項3のいずれか1項に記載のウエハチャック用の温度センサ。
- 上記高絶縁性材料は高純度のアルミナセラミックスによって形成されていることを特徴とする請求項4に記載のウエハチャック用の温度センサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009147061A JP5197505B2 (ja) | 2009-06-19 | 2009-06-19 | ウエハチャック用の温度センサ |
KR1020100053856A KR101267670B1 (ko) | 2009-06-19 | 2010-06-08 | 웨이퍼 척용 온도 센서 |
TW99119932A TWI471538B (zh) | 2009-06-19 | 2010-06-18 | Temperature sensor for wafer cups |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009147061A JP5197505B2 (ja) | 2009-06-19 | 2009-06-19 | ウエハチャック用の温度センサ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011002390A JP2011002390A (ja) | 2011-01-06 |
JP2011002390A5 JP2011002390A5 (ja) | 2012-06-07 |
JP5197505B2 true JP5197505B2 (ja) | 2013-05-15 |
Family
ID=43510815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009147061A Active JP5197505B2 (ja) | 2009-06-19 | 2009-06-19 | ウエハチャック用の温度センサ |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5197505B2 (ja) |
KR (1) | KR101267670B1 (ja) |
TW (1) | TWI471538B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103277651B (zh) * | 2013-06-13 | 2016-04-06 | 新乡学院 | 一种用于高温热探测的陶瓷基座 |
JP2016161356A (ja) * | 2015-02-27 | 2016-09-05 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
KR102219361B1 (ko) * | 2016-03-28 | 2021-02-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 온도 측정 유닛 및 반도체 장치의 제조 방법 |
CN110739657B (zh) * | 2018-07-20 | 2021-09-21 | 施耐德电器工业公司 | 用于环网柜的电缆头及环网柜 |
TWI797484B (zh) * | 2020-10-06 | 2023-04-01 | 致茂電子股份有限公司 | 晶圓吸盤檢測系統 |
JP7474678B2 (ja) | 2020-10-28 | 2024-04-25 | 東京エレクトロン株式会社 | 載置台、検査装置及び検査方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090638U (ja) * | 1983-11-26 | 1985-06-21 | 株式会社三共合金鋳造所 | 温度測定治具 |
JPS6124628U (ja) * | 1984-07-11 | 1986-02-14 | 三菱重工業株式会社 | 熱電対取付治具 |
DE69118315T2 (de) * | 1990-11-01 | 1996-08-14 | Canon Kk | Waferhaltebefestigung für Belichtungsgerät |
JPH0945752A (ja) * | 1995-07-27 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X線投影露光装置及びデバイス製造方法 |
JP2000286207A (ja) * | 1999-03-30 | 2000-10-13 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法 |
JP4659328B2 (ja) * | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
JP4307130B2 (ja) * | 2003-04-08 | 2009-08-05 | キヤノン株式会社 | 露光装置 |
US20080097657A1 (en) * | 2004-10-14 | 2008-04-24 | Celerity, Inc. | Method and System for Wafer Temperature Control |
JP4905290B2 (ja) | 2007-08-09 | 2012-03-28 | 住友電気工業株式会社 | 半導体製造装置用測温装置及びそれを搭載した半導体製造装置 |
-
2009
- 2009-06-19 JP JP2009147061A patent/JP5197505B2/ja active Active
-
2010
- 2010-06-08 KR KR1020100053856A patent/KR101267670B1/ko active IP Right Grant
- 2010-06-18 TW TW99119932A patent/TWI471538B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20100136915A (ko) | 2010-12-29 |
KR101267670B1 (ko) | 2013-05-24 |
JP2011002390A (ja) | 2011-01-06 |
TWI471538B (zh) | 2015-02-01 |
TW201129787A (en) | 2011-09-01 |
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