JP5193611B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5193611B2
JP5193611B2 JP2008011473A JP2008011473A JP5193611B2 JP 5193611 B2 JP5193611 B2 JP 5193611B2 JP 2008011473 A JP2008011473 A JP 2008011473A JP 2008011473 A JP2008011473 A JP 2008011473A JP 5193611 B2 JP5193611 B2 JP 5193611B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor
semiconductor device
resin layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008011473A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008211188A (ja
JP2008211188A5 (https=
Inventor
健志 大塚
俊一 今岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2008011473A priority Critical patent/JP5193611B2/ja
Priority to US12/022,840 priority patent/US7893539B2/en
Priority to CN2008101092128A priority patent/CN101286507B/zh
Publication of JP2008211188A publication Critical patent/JP2008211188A/ja
Publication of JP2008211188A5 publication Critical patent/JP2008211188A5/ja
Application granted granted Critical
Publication of JP5193611B2 publication Critical patent/JP5193611B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008011473A 2007-01-31 2008-01-22 半導体装置 Expired - Fee Related JP5193611B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008011473A JP5193611B2 (ja) 2007-01-31 2008-01-22 半導体装置
US12/022,840 US7893539B2 (en) 2007-01-31 2008-01-30 Semiconductor apparatus and mobile apparatus
CN2008101092128A CN101286507B (zh) 2007-01-31 2008-01-31 半导体装置及便携式设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007020683 2007-01-31
JP2007020683 2007-01-31
JP2008011473A JP5193611B2 (ja) 2007-01-31 2008-01-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012279956A Division JP5431567B2 (ja) 2007-01-31 2012-12-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2008211188A JP2008211188A (ja) 2008-09-11
JP2008211188A5 JP2008211188A5 (https=) 2011-03-03
JP5193611B2 true JP5193611B2 (ja) 2013-05-08

Family

ID=39787192

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008011473A Expired - Fee Related JP5193611B2 (ja) 2007-01-31 2008-01-22 半導体装置
JP2012279956A Expired - Fee Related JP5431567B2 (ja) 2007-01-31 2012-12-21 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012279956A Expired - Fee Related JP5431567B2 (ja) 2007-01-31 2012-12-21 半導体装置

Country Status (2)

Country Link
JP (2) JP5193611B2 (https=)
CN (1) CN101286507B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5535351B1 (ja) * 2013-03-01 2014-07-02 株式会社東芝 半導体装置
JP6081229B2 (ja) 2013-03-01 2017-02-15 株式会社東芝 半導体装置、無線装置、及び記憶装置
JP6004537B2 (ja) 2013-03-18 2016-10-12 コベルコ建機株式会社 ジブ
KR102501845B1 (ko) 2021-02-08 2023-02-20 경희대학교 산학협력단 백수오 추출물을 유효성분으로 포함하는 피부 재생 또는 상처 치료용 조성물
JP2026048017A (ja) * 2024-09-04 2026-03-16 華泰電子股▲分▼有限公司 半導体パッケージ及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235113A (ja) * 1992-02-21 1993-09-10 Toshiba Corp 半導体装置
JPH06275752A (ja) * 1993-03-18 1994-09-30 Hitachi Ltd 半導体装置の冷却装置
JP2001320014A (ja) * 2000-05-11 2001-11-16 Seiko Epson Corp 半導体装置及びその製造方法
JP4554152B2 (ja) * 2002-12-19 2010-09-29 株式会社半導体エネルギー研究所 半導体チップの作製方法
JP2005150456A (ja) * 2003-11-17 2005-06-09 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005268533A (ja) * 2004-03-18 2005-09-29 Shinko Electric Ind Co Ltd 積層型半導体装置
JP2006196709A (ja) * 2005-01-13 2006-07-27 Sharp Corp 半導体装置およびその製造方法
JP2008177241A (ja) * 2007-01-16 2008-07-31 Toshiba Corp 半導体パッケージ

Also Published As

Publication number Publication date
JP2008211188A (ja) 2008-09-11
CN101286507A (zh) 2008-10-15
JP2013055367A (ja) 2013-03-21
JP5431567B2 (ja) 2014-03-05
CN101286507B (zh) 2011-12-21

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