JP5185947B2 - Ledソケットおよび取換可能な組立品 - Google Patents
Ledソケットおよび取換可能な組立品 Download PDFInfo
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- JP5185947B2 JP5185947B2 JP2009539410A JP2009539410A JP5185947B2 JP 5185947 B2 JP5185947 B2 JP 5185947B2 JP 2009539410 A JP2009539410 A JP 2009539410A JP 2009539410 A JP2009539410 A JP 2009539410A JP 5185947 B2 JP5185947 B2 JP 5185947B2
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- socket
- led
- led lamp
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- 239000000758 substrate Substances 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 22
- 230000000994 depressogenic effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
- F21L4/00—Electric lighting devices with self-contained electric batteries or cells
- F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
- F21L4/022—Pocket lamps
- F21L4/027—Pocket lamps the light sources being a LED
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/717—Structural association with built-in electrical component with built-in light source
- H01R13/7175—Light emitting diodes (LEDs)
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
この発明の一態様のソケットは、
レンズと、電力接触部を有する実装基板に実装された少なくとも1つのLEDチップとを有するパッケージLEDランプを解放可能に実装するためのソケットであって、
前記LEDランプの前記実装基板上の電力接触部と接触するため、および前記LEDチップに電力を供給するためのソケット電力接触部と、
動作中に前記実装基板上の前記電力接触部と電気的に接触するように前記ソケット電力接触部を保持し、前記LEDランプを取り換えるのが望ましいときに前記LEDランプが手で容易に取り除かれ、かつ取り換えられるようにする機構と
を備え、
前記機構は、指の力で押下されて前記LEDランプを取り換えることができるバネ付勢されたトレーを備え、
前記バネ付勢されたトレーは、押下されないとき、バネの力を与えて、前記トレーの中のLEDランプの前記実装基板上の前記電力接触部に対して前記ソケット電力接触部を付勢することを特徴とする。
この発明の一態様のLED光モジュールは、
プリント回路基板と、
前記プリント回路基板上に物理的に実装され、かつ、電気的に接続された複数のLEDランプと、
を備えるLED光モジュールであって、
前記各LEDランプは、レンズと、実装基板に実装された少なくとも1つのLEDチップとを有し、
前記各LEDランプは、電気的に接触するための電力接触部を有し、
バネ付勢機構が、前記LEDランプを受け入れるためのソケットに設けられたトレーに対して前記LEDランプの電力接触部を付勢するために設けられ、
前記トレーは、前記LEDランプを取り換えることができるように指の力で押下可能であり、押下されないとき、バネの力を与えて、前記ソケットの電力接触部を前記LEDランプの電力接触部に対して付勢して、前記LEDランプへ電力を供給することを特徴とする。
この発明の一態様の個人携帯用LEDライトは、
取り換え可能なLEDランプを有する個人携帯用LEDライトであって、
電力をオンおよびオフするための電力スイッチと、
容易に解放可能なLEDランプソケットと、
実装基板に実装されたLEDチップを有するLEDランプと、
前記電力スイッチおよび前記LEDランプソケットが実装された筐体と
を備え、
前記容易に解放可能なLEDランプソケットは、
前記LEDランプ上のランプ電力接触部と接触するため、および前記LEDチップに電力を供給するためのソケット電力接触部と、
指の力で押下されて前記LEDランプを取り換えることができ、押下されないとき、バネの力を与えて、動作中に前記ランプ電力接触部と電気的に接触するように前記ソケット電力接触部を付勢するバネ付勢トレー機構と、
を備えることを特徴とする。
Claims (13)
- レンズと、電力接触部を有する実装基板に実装された少なくとも1つのLEDチップとを有するパッケージLEDランプを解放可能に実装するためのソケットであって、
前記LEDランプの前記実装基板上の電力接触部と接触するため、および前記LEDチップに電力を供給するためのソケット電力接触部と、
動作中に前記実装基板上の前記電力接触部と電気的に接触するように前記ソケット電力接触部を保持し、前記LEDランプを取り換えるのが望ましいときに前記LEDランプが手で容易に取り除かれ、かつ取り換えられるようにする機構と
を備え、
前記機構は、指の力で押下されて前記LEDランプを取り換えることができるバネ付勢されたトレーを備え、
前記バネ付勢されたトレーは、押下されないとき、バネの力を与えて、前記トレーの中のLEDランプの前記実装基板上の前記電力接触部に対して前記ソケット電力接触部を付勢することを特徴とするソケット。 - 前記LEDランプをロックまたは解放するための解放可能なロック機構を有するヒンジアームをさらに備えることを特徴とする請求項1に記載のソケット。
- 前記実装基板上の前記電気接触部は前記実装基板の上部表面上に実装され、前記ソケット電力接触部は前記上部表面電気接触部と電気的に接触するように配置されることを特徴とする請求項1に記載のソケット。
- 前記実装基板上の前記電気接触部は前記実装基板の下部表面上に実装され、前記ソケット電力接触部は、前記下部表面電気接触部と電気的に接触するように配置されることを特徴とする請求項1に記載のソケット。
- 前記パッケージLEDランプは、複数のLEDチップを含み、前記ソケットは、前記複数のLEDチップのための前記実装基板上の複数組の電気接触部に対応するソケット電力接触部を有することを特徴とする請求項1に記載のソケット。
- 前記LEDランプは、複数のLEDチップを含み、前記ソケットは、前記複数のLEDチップのための電気接触部に対応するソケット電力接触部を有することを特徴とする請求項1に記載のソケット。
- 複数のパッケージLEDランプのためのソケット電力接触部をさらに備える請求項1に記載のLED光ソケット。
- 前記バネ付勢されたトレーの上部表面は、前記LEDランプの基部の外寸法よりもわずかに大きな寸法を有することを特徴とする請求項1に記載のソケット。
- 前記パッケージLEDランプは、さらに、反射環を有し、前記少なくとも1つのLEDチップは上記実装基板上に表面実装されていることを特徴とする請求項1に記載のソケット。
- プリント回路基板と、
前記プリント回路基板上に物理的に実装され、かつ、電気的に接続された複数のLEDランプと、
を備えるLED光モジュールであって、
前記各LEDランプは、レンズと、実装基板に実装された少なくとも1つのLEDチップとを有し、
前記各LEDランプは、電気的に接触するための電力接触部を有し、
バネ付勢機構が、前記LEDランプを受け入れるためのソケットに設けられたトレーに対して前記LEDランプの電力接触部を付勢するために設けられ、
前記トレーは、前記LEDランプを取り換えることができるように指の力で押下可能であり、押下されないとき、バネの力を与えて、前記ソケットの電力接触部を前記LEDランプの電力接触部に対して付勢して、前記LEDランプへ電力を供給することを特徴とするLED光モジュール。 - 取り換え可能なLEDランプを有する個人携帯用LEDライトであって、
電力をオンおよびオフするための電力スイッチと、
容易に解放可能なLEDランプソケットと、
実装基板に実装されたLEDチップを有するLEDランプと、
前記電力スイッチおよび前記LEDランプソケットが実装された筐体と
を備え、
前記容易に解放可能なLEDランプソケットは、
前記LEDランプ上のランプ電力接触部と接触するため、および前記LEDチップに電力を供給するためのソケット電力接触部と、
指の力で押下されて前記LEDランプを取り換えることができ、押下されないとき、バネの力を与えて、動作中に前記ランプ電力接触部と電気的に接触するように前記ソケット電力接触部を付勢するバネ付勢トレー機構と、
を備えることを特徴とする個人携帯用LEDライト。 - 前記ソケット電力接触部は、点接触であることを特徴とする請求項11に記載の個人携帯用LEDライト。
- 前記バネ付勢トレー機構はバネ付勢されたトレーを有し、前記バネ付勢されたトレーの上部表面は、前記LEDランプの基部の外寸法よりもわずかに大きな寸法を有することを特徴とする請求項11に記載の個人携帯用LEDライト。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86816206P | 2006-12-01 | 2006-12-01 | |
US60/868,162 | 2006-12-01 | ||
US11/614,261 | 2006-12-21 | ||
US11/614,261 US7549786B2 (en) | 2006-12-01 | 2006-12-21 | LED socket and replaceable LED assemblies |
PCT/US2007/084773 WO2008070421A2 (en) | 2006-12-01 | 2007-11-15 | Led socket and replaceable led assemblies |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010512008A JP2010512008A (ja) | 2010-04-15 |
JP2010512008A5 JP2010512008A5 (ja) | 2011-12-22 |
JP5185947B2 true JP5185947B2 (ja) | 2013-04-17 |
Family
ID=39475475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009539410A Active JP5185947B2 (ja) | 2006-12-01 | 2007-11-15 | Ledソケットおよび取換可能な組立品 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7549786B2 (ja) |
EP (1) | EP2087555B1 (ja) |
JP (1) | JP5185947B2 (ja) |
KR (1) | KR101410950B1 (ja) |
CN (1) | CN101548436B (ja) |
TW (1) | TWI477711B (ja) |
WO (1) | WO2008070421A2 (ja) |
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KR20090096485A (ko) | 2009-09-10 |
EP2087555B1 (en) | 2019-04-03 |
US7549786B2 (en) | 2009-06-23 |
WO2008070421A3 (en) | 2009-05-07 |
KR101410950B1 (ko) | 2014-06-25 |
US7744266B2 (en) | 2010-06-29 |
CN101548436A (zh) | 2009-09-30 |
TW200839146A (en) | 2008-10-01 |
EP2087555A4 (en) | 2013-12-04 |
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