JP5176557B2 - 電極パターンおよびワイヤボンディング方法 - Google Patents

電極パターンおよびワイヤボンディング方法 Download PDF

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Publication number
JP5176557B2
JP5176557B2 JP2008008066A JP2008008066A JP5176557B2 JP 5176557 B2 JP5176557 B2 JP 5176557B2 JP 2008008066 A JP2008008066 A JP 2008008066A JP 2008008066 A JP2008008066 A JP 2008008066A JP 5176557 B2 JP5176557 B2 JP 5176557B2
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Japan
Prior art keywords
wire bonding
electrode pattern
pattern
wire
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008008066A
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English (en)
Japanese (ja)
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JP2008263165A (ja
JP2008263165A5 (cg-RX-API-DMAC7.html
Inventor
義浩 久
勉 山口
秀幸 田中
和則 松尾
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2008008066A priority Critical patent/JP5176557B2/ja
Priority to TW097107465A priority patent/TWI387171B/zh
Priority to US12/042,650 priority patent/US7550673B2/en
Priority to KR1020080020362A priority patent/KR100941106B1/ko
Priority to CN2008100830350A priority patent/CN101272034B/zh
Publication of JP2008263165A publication Critical patent/JP2008263165A/ja
Publication of JP2008263165A5 publication Critical patent/JP2008263165A5/ja
Application granted granted Critical
Publication of JP5176557B2 publication Critical patent/JP5176557B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01074—Tungsten [W]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2008008066A 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法 Expired - Fee Related JP5176557B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008008066A JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法
TW097107465A TWI387171B (zh) 2007-03-19 2008-03-04 電極圖案及線焊接方法
US12/042,650 US7550673B2 (en) 2007-03-19 2008-03-05 Electrode pattern and wire bonding method
KR1020080020362A KR100941106B1 (ko) 2007-03-19 2008-03-05 전극 패턴 및 와이어본딩 방법
CN2008100830350A CN101272034B (zh) 2007-03-19 2008-03-18 电极图形以及引线接合方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007070684 2007-03-19
JP2007070684 2007-03-19
JP2008008066A JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法

Publications (3)

Publication Number Publication Date
JP2008263165A JP2008263165A (ja) 2008-10-30
JP2008263165A5 JP2008263165A5 (cg-RX-API-DMAC7.html) 2011-01-20
JP5176557B2 true JP5176557B2 (ja) 2013-04-03

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JP2008008066A Expired - Fee Related JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法

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Country Link
JP (1) JP5176557B2 (cg-RX-API-DMAC7.html)
KR (1) KR100941106B1 (cg-RX-API-DMAC7.html)
CN (1) CN101272034B (cg-RX-API-DMAC7.html)
TW (1) TWI387171B (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5441590B2 (ja) * 2009-09-29 2014-03-12 大王製紙株式会社 パンツタイプ使い捨ておむつ
JP6901902B2 (ja) * 2017-04-27 2021-07-14 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
KR102706879B1 (ko) * 2021-12-24 2024-09-13 주식회사 유라코퍼레이션 Pcb기판
CN121097496A (zh) * 2025-11-10 2025-12-09 长春理工大学 一种提高半导体激光器调制速率的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291126A (ja) 1986-06-11 1987-12-17 Fuji Xerox Co Ltd パタ−ン認識マ−ク
JPS63133638A (ja) * 1986-11-26 1988-06-06 Toshiba Corp ワイヤボンデイング方法
JP2621420B2 (ja) * 1988-09-28 1997-06-18 日本電気株式会社 半導体装置のボンディングパッド
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3611948B2 (ja) * 1997-05-16 2005-01-19 日本テキサス・インスツルメンツ株式会社 半導体装置及びその製造方法
JP2982794B1 (ja) 1998-06-17 1999-11-29 日本電気株式会社 半導体装置
JP2001024303A (ja) 1999-07-09 2001-01-26 Nippon Avionics Co Ltd 認識マーク
JP4352579B2 (ja) * 2000-05-16 2009-10-28 沖電気工業株式会社 半導体チップ及びその製造方法
US6789724B2 (en) * 2001-07-06 2004-09-14 Erico International Corporation Welding apparatus and method
WO2003100850A1 (en) * 2002-05-28 2003-12-04 Hitachi Chemical Co., Ltd. Substrate, wiring board, semiconductor package-use substrate, semiconductor package and production methods for them
US7042098B2 (en) 2003-07-07 2006-05-09 Freescale Semiconductor,Inc Bonding pad for a packaged integrated circuit
JP2005183669A (ja) * 2003-12-19 2005-07-07 Tdk Corp 実装基板およびそれを用いた電子部品

Also Published As

Publication number Publication date
KR100941106B1 (ko) 2010-02-10
TWI387171B (zh) 2013-02-21
CN101272034A (zh) 2008-09-24
JP2008263165A (ja) 2008-10-30
TW200843265A (en) 2008-11-01
KR20080085687A (ko) 2008-09-24
CN101272034B (zh) 2010-09-29

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