JP5176290B2 - ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 - Google Patents

ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 Download PDF

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Publication number
JP5176290B2
JP5176290B2 JP2006163116A JP2006163116A JP5176290B2 JP 5176290 B2 JP5176290 B2 JP 5176290B2 JP 2006163116 A JP2006163116 A JP 2006163116A JP 2006163116 A JP2006163116 A JP 2006163116A JP 5176290 B2 JP5176290 B2 JP 5176290B2
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Prior art keywords
paste composition
epoxy resin
dielectric constant
dielectric
composition
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JP2006163116A
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Japanese (ja)
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JP2007027101A (ja
JP2007027101A5 (https=
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義豪 原
敏央 野中
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Toray Industries Inc
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Toray Industries Inc
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  • Compositions Of Oxide Ceramics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
JP2006163116A 2005-06-15 2006-06-13 ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 Expired - Fee Related JP5176290B2 (ja)

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Application Number Priority Date Filing Date Title
JP2006163116A JP5176290B2 (ja) 2005-06-15 2006-06-13 ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005174821 2005-06-15
JP2005174821 2005-06-15
JP2006163116A JP5176290B2 (ja) 2005-06-15 2006-06-13 ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板

Publications (3)

Publication Number Publication Date
JP2007027101A JP2007027101A (ja) 2007-02-01
JP2007027101A5 JP2007027101A5 (https=) 2009-07-30
JP5176290B2 true JP5176290B2 (ja) 2013-04-03

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JP2006163116A Expired - Fee Related JP5176290B2 (ja) 2005-06-15 2006-06-13 ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5076696B2 (ja) * 2006-10-03 2012-11-21 日立化成工業株式会社 液状組成物、抵抗体、抵抗体素子及び配線板
JP4398500B2 (ja) * 2007-04-06 2010-01-13 株式会社日本触媒 樹脂組成物及び光学部材
JP2009029904A (ja) * 2007-07-26 2009-02-12 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
CN101861629B (zh) * 2008-01-18 2012-02-01 东丽株式会社 高介电常数糊剂组合物及使用其的电介质组合物
JP5500095B2 (ja) * 2011-01-31 2014-05-21 Ｔｄｋ株式会社 電子回路モジュール部品及び電子回路モジュール部品の製造方法
DE102012205650A1 (de) * 2012-04-05 2013-10-10 Siemens Aktiengesellschaft Isolierstoff für rotierende Maschinen
JP5941958B2 (ja) 2014-09-30 2016-06-29 住友理工株式会社 トランスデューサ用誘電材料、およびその製造方法、並びにそれを用いたトランスデューサ
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006213797A (ja) * 2005-02-02 2006-08-17 Nippon Paint Co Ltd 熱硬化性誘電体樹脂組成物及び熱硬化性誘電体樹脂フィルム

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