JP5169071B2 - 電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法 - Google Patents
電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法 Download PDFInfo
- Publication number
- JP5169071B2 JP5169071B2 JP2007214513A JP2007214513A JP5169071B2 JP 5169071 B2 JP5169071 B2 JP 5169071B2 JP 2007214513 A JP2007214513 A JP 2007214513A JP 2007214513 A JP2007214513 A JP 2007214513A JP 5169071 B2 JP5169071 B2 JP 5169071B2
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- resin
- electronic component
- conductive film
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- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title description 29
- 239000011347 resin Substances 0.000 claims description 145
- 229920005989 resin Polymers 0.000 claims description 145
- 239000000758 substrate Substances 0.000 claims description 60
- 238000007789 sealing Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 28
- 239000010410 layer Substances 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 12
- 239000011521 glass Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000010931 gold Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910006164 NiV Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910008599 TiW Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007214513A JP5169071B2 (ja) | 2007-08-21 | 2007-08-21 | 電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007214513A JP5169071B2 (ja) | 2007-08-21 | 2007-08-21 | 電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009049226A JP2009049226A (ja) | 2009-03-05 |
| JP2009049226A5 JP2009049226A5 (enExample) | 2010-10-07 |
| JP5169071B2 true JP5169071B2 (ja) | 2013-03-27 |
Family
ID=40501173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007214513A Active JP5169071B2 (ja) | 2007-08-21 | 2007-08-21 | 電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5169071B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8440924B2 (en) | 2008-07-30 | 2013-05-14 | Kabushiki Kaisha Tokia Rika Denki Seisakusho | Switch unit with multi-layer resin switch cover |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5149876B2 (ja) | 2009-07-23 | 2013-02-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TWI668821B (zh) * | 2016-10-25 | 2019-08-11 | Tdk Corporation | 電子零件模組及其製造方法 |
| WO2018211686A1 (ja) * | 2017-05-19 | 2018-11-22 | 新電元工業株式会社 | 電子モジュール |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110831A (ja) * | 1999-10-07 | 2001-04-20 | Seiko Epson Corp | 外部接続突起およびその形成方法、半導体チップ、回路基板ならびに電子機器 |
| JP2005101527A (ja) * | 2003-08-21 | 2005-04-14 | Seiko Epson Corp | 電子部品の実装構造、電気光学装置、電子機器及び電子部品の実装方法 |
| JP4165495B2 (ja) * | 2004-10-28 | 2008-10-15 | セイコーエプソン株式会社 | 半導体装置、半導体装置の製造方法、回路基板、電気光学装置、電子機器 |
| JP4207004B2 (ja) * | 2005-01-12 | 2009-01-14 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP2007165744A (ja) * | 2005-12-16 | 2007-06-28 | Epson Imaging Devices Corp | 半導体装置、実装構造体、電気光学装置、半導体装置の製造方法、実装構造体の製造方法、電気光学装置の製造方法、及び、電子機器 |
| JP4784304B2 (ja) * | 2005-12-27 | 2011-10-05 | セイコーエプソン株式会社 | 電子部品、電子部品の製造方法、回路基板及び電子機器 |
| JP2007188993A (ja) * | 2006-01-12 | 2007-07-26 | Epson Imaging Devices Corp | 電子部品の製造方法、及び、電気光学装置の製造方法 |
-
2007
- 2007-08-21 JP JP2007214513A patent/JP5169071B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8440924B2 (en) | 2008-07-30 | 2013-05-14 | Kabushiki Kaisha Tokia Rika Denki Seisakusho | Switch unit with multi-layer resin switch cover |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009049226A (ja) | 2009-03-05 |
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