JP5161876B2 - Ac結合パラメトリック試験プローブ - Google Patents
Ac結合パラメトリック試験プローブ Download PDFInfo
- Publication number
- JP5161876B2 JP5161876B2 JP2009514468A JP2009514468A JP5161876B2 JP 5161876 B2 JP5161876 B2 JP 5161876B2 JP 2009514468 A JP2009514468 A JP 2009514468A JP 2009514468 A JP2009514468 A JP 2009514468A JP 5161876 B2 JP5161876 B2 JP 5161876B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- test
- substrate
- chip
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Description
Claims (3)
- 半導体デバイス上の集積回路(IC)を試験する方法であって、
固体誘電体絶縁材料被覆を有する試験プローブと前記ICの部品との間で時変試験信号を結合するステップを含み、
前記結合が交流(AC)信号の誘導結合を含み、
前記試験プローブが、
第1の誘電体材料を含むプローブアームと、
前記固体誘電体絶縁材料被覆を含む第2の誘電体材料を有するチップであって、当該チップが前記プローブアームの表面に結合されるとともに当該表面から延伸している、チップと、
前記プローブアーム内に配置された第1の電気的導電線と、
前記プローブアーム内に配置された第2の電気的導電線と、
前記チップ内に配置された誘導結合要素と
を含み、
前記第1の電気的導電線と前記第2の電気的導電線が、前記チップに延伸しかつ前記誘導結合要素に接続されており、
前記第2の誘電体材料が、磁性材料を含む、方法。 - 半導体デバイス上の集積回路(IC)を試験するための試験プローブであって、
第1の誘電体材料を含むプローブアームと、
固体誘電体絶縁材料被覆を含む第2の誘電体材料を有するチップであって、当該チップが前記プローブアームの表面に結合されるとともに当該表面から延伸している、チップと、
前記プローブアーム内に配置された第1の電気的導電線と、
前記プローブアーム内に配置された第2の電気的導電線と、
前記チップ内に配置された誘導結合要素と
を含み、
前記試験プローブは、前記ICの部品との間に時変試験信号が結合されるものであり、当該結合は交流(AC)信号の誘導結合を含み、
前記第1の電気的導電線と前記第2の電気的導電線が、前記チップに延伸しかつ前記誘導結合要素に接続されており、
前記第2の誘電体材料が、磁性材料を含む、試験プローブ。 - プローブおよび前記プローブのための支持構造を含み、前記プローブが請求項2による前記試験プローブを含む、プローブカード組立て体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/447,371 | 2006-06-06 | ||
US11/447,371 US7952375B2 (en) | 2006-06-06 | 2006-06-06 | AC coupled parameteric test probe |
PCT/US2007/069806 WO2007146582A2 (en) | 2006-06-06 | 2007-05-25 | Ac coupled parametric test probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009540578A JP2009540578A (ja) | 2009-11-19 |
JP5161876B2 true JP5161876B2 (ja) | 2013-03-13 |
Family
ID=38832622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009514468A Expired - Fee Related JP5161876B2 (ja) | 2006-06-06 | 2007-05-25 | Ac結合パラメトリック試験プローブ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7952375B2 (ja) |
EP (1) | EP2027477A2 (ja) |
JP (1) | JP5161876B2 (ja) |
KR (1) | KR20090018715A (ja) |
CN (1) | CN101495878A (ja) |
TW (1) | TWI456203B (ja) |
WO (1) | WO2007146582A2 (ja) |
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-
2006
- 2006-06-06 US US11/447,371 patent/US7952375B2/en not_active Expired - Fee Related
-
2007
- 2007-05-25 EP EP07811949A patent/EP2027477A2/en not_active Withdrawn
- 2007-05-25 KR KR1020097000198A patent/KR20090018715A/ko not_active Application Discontinuation
- 2007-05-25 CN CNA200780021208XA patent/CN101495878A/zh active Pending
- 2007-05-25 JP JP2009514468A patent/JP5161876B2/ja not_active Expired - Fee Related
- 2007-05-25 WO PCT/US2007/069806 patent/WO2007146582A2/en active Application Filing
- 2007-06-05 TW TW096120089A patent/TWI456203B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7952375B2 (en) | 2011-05-31 |
CN101495878A (zh) | 2009-07-29 |
US20070296435A1 (en) | 2007-12-27 |
WO2007146582A2 (en) | 2007-12-21 |
JP2009540578A (ja) | 2009-11-19 |
WO2007146582A3 (en) | 2009-03-19 |
KR20090018715A (ko) | 2009-02-20 |
TW200806995A (en) | 2008-02-01 |
TWI456203B (zh) | 2014-10-11 |
EP2027477A2 (en) | 2009-02-25 |
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