JP5146428B2 - 透明トランジスタ及びその製造方法 - Google Patents
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- JP5146428B2 JP5146428B2 JP2009213211A JP2009213211A JP5146428B2 JP 5146428 B2 JP5146428 B2 JP 5146428B2 JP 2009213211 A JP2009213211 A JP 2009213211A JP 2009213211 A JP2009213211 A JP 2009213211A JP 5146428 B2 JP5146428 B2 JP 5146428B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000004065 semiconductor Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 21
- 150000004767 nitrides Chemical class 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 166
- 239000010408 film Substances 0.000 description 60
- 230000008569 process Effects 0.000 description 37
- 239000010409 thin film Substances 0.000 description 15
- 239000012212 insulator Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Description
本発明の第2の実施例に係るトランジスタは、逆スタガード型(inverted staggered type)の薄膜トランジスタであって、ソース/ドレイン電極及びゲート電極で多層構造の透明導電膜を有する。
110 半導体層
120 金属層
130 透明導電層/透明絶縁層
140 絶縁膜
150 透明層
160 金属層
170 透明層
S/D ソース/ドレイン電極
G ゲート電極
Claims (8)
- 基板と、
下部透明層、金属層及び上部透明層の多層構造を有し、前記基板上に形成されているソース電極及びドレイン電極と、
前記ソース電極及びドレイン電極の間に形成されているチャネルと、
前記ソース電極、前記ドレイン電極及び前記チャネルを被覆するように形成された絶縁膜と、
前記絶縁膜上に形成されたゲート電極とを含み、
前記下部透明層または前記上部透明層が前記チャネルと同一の透明半導体層で形成され、
前記ゲート電極は、前記下部透明層、前記金属層及び前記上部透明層の多層構造を有し、前記ソース電極及び前記ドレイン電極または前記ゲート電極の上部透明層或いは下部透明層は、窒化膜で形成されていることを特徴とする透明トランジスタ。 - 前記ゲート電極の前記下部透明層は、前記基板と前記ゲート電極とを電気的に絶縁する絶縁膜で形成されることを特徴とする請求項1に記載の透明トランジスタ。
- 前記ソース電極及び前記ドレイン電極の前記上部透明層または前記下部透明層は、透明導電膜または透明絶縁膜で形成されることを特徴とする請求項1に記載の透明トランジスタ。
- 前記下部透明層または前記上部透明層を形成する前記窒化膜は、屈折率が2.0以上であることを特徴とする請求項1に記載の透明トランジスタ。
- 基板上に透明半導体層、金属層及び透明層を順に積層し、パターニングして、ソース/ドレイン領域及びチャネル領域を形成する段階と、
前記チャネル領域の前記透明層及び前記金属層をエッチングし、前記透明半導体を露出させる段階と、
露出された前記透明半導体層を被覆するように絶縁膜を形成する段階と、
前記絶縁膜上にゲート電極を形成する段階とを含み、
前記ゲート電極は、下部透明層、金属層及び上部透明層の多層構造を有し、前記透明層、前記透明半導体層または前記ゲート電極の上部透明層或いは下部透明層は、窒化膜で形成されていることを特徴とするトランジスタの製造方法。 - 基板上に透明層及び金属層を積層し、チャネル領域の前記金属層をエッチングして下部の前記透明層を露出させる段階と、
露出された前記透明層及び前記金属層を被覆するように透明半導体層を積層し、エッチングしてソース電極、ドレイン電極及びチャネルを形成する段階と、
前記ソース電極、前記ドレイン電極及び前記チャネルを被覆するように絶縁膜を形成する段階と、
前記絶縁膜上に下部透明層、金属層及び上部透明層を積層してゲート電極を形成する段階とを含み、
前記透明層、前記透明半導体層または前記ゲート電極の上部透明層或いは下部透明層は、窒化膜で形成されていることを特徴とするトランジスタの製造方法。 - 基板の上に透明半導体、金属層、透明層を積層し、ソース電極及びドレイン電極を形成する段階と、
前記ソース電極及びドレイン電極の上に第1のゲート絶縁膜を形成する段階と、
前記第1のゲート絶縁膜の上にフォトレジストを塗布し、マスクを用いて前記透明層及び金属層をエッチングしてチャネルを形成する段階と、
前記フォトレジスト及びチャネルの上に第2のゲート絶縁膜を形成する段階と、
前記第2のゲート絶縁膜の上にゲート電極を形成する段階と、
前記フォトレジストを除去する段階とを含み、
前記透明半導体または前記透明層は、窒化膜で形成されていることを特徴とするトランジスタの製造方法。 - 前記第1のゲート絶縁膜は、前記第2のゲート絶縁膜より厚く形成されることを特徴とする請求項7に記載のトランジスタの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0131647 | 2008-12-22 | ||
KR1020080131647A KR101182403B1 (ko) | 2008-12-22 | 2008-12-22 | 투명 트랜지스터 및 그의 제조 방법 |
Publications (2)
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JP2010147458A JP2010147458A (ja) | 2010-07-01 |
JP5146428B2 true JP5146428B2 (ja) | 2013-02-20 |
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JP2009213211A Expired - Fee Related JP5146428B2 (ja) | 2008-12-22 | 2009-09-15 | 透明トランジスタ及びその製造方法 |
Country Status (3)
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US (4) | US8269220B2 (ja) |
JP (1) | JP5146428B2 (ja) |
KR (1) | KR101182403B1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US8247276B2 (en) | 2009-02-20 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, method for manufacturing the same, and semiconductor device |
US8759820B2 (en) * | 2010-08-20 | 2014-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8936965B2 (en) * | 2010-11-26 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US9443984B2 (en) | 2010-12-28 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI552345B (zh) * | 2011-01-26 | 2016-10-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
CN102655095B (zh) | 2011-06-01 | 2014-10-15 | 京东方科技集团股份有限公司 | 薄膜晶体管及阵列基板的制造方法 |
US8969154B2 (en) * | 2011-08-23 | 2015-03-03 | Micron Technology, Inc. | Methods for fabricating semiconductor device structures and arrays of vertical transistor devices |
CN103975441B (zh) * | 2011-09-27 | 2017-06-09 | 凸版印刷株式会社 | 薄膜晶体管和图像显示装置 |
US8728861B2 (en) * | 2011-10-12 | 2014-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Fabrication method for ZnO thin film transistors using etch-stop layer |
KR20140086494A (ko) * | 2012-12-28 | 2014-07-08 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 그의 제조방법 |
KR102290247B1 (ko) | 2013-03-14 | 2021-08-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법 |
US10566455B2 (en) | 2013-03-28 | 2020-02-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
WO2014185755A1 (ko) | 2013-05-16 | 2014-11-20 | 주식회사 잉크테크 | 투명전극 필름의 제조방법 |
KR20160132982A (ko) * | 2014-03-18 | 2016-11-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법 |
US10147823B2 (en) * | 2015-03-19 | 2018-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US10276593B2 (en) | 2015-06-05 | 2019-04-30 | Sharp Kabushiki Kaisha | Active matrix substrate and method for manufacturing same, display device using active matrix substrate |
US9825177B2 (en) * | 2015-07-30 | 2017-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a semiconductor device using multiple etching mask |
WO2020106083A1 (ko) | 2018-11-21 | 2020-05-28 | (주)잉크테크 | 디스플레이용 전극 형성방법 |
KR102641279B1 (ko) * | 2021-12-27 | 2024-02-27 | 재단법인차세대융합기술연구원 | 박막 전력 소자용 스태거드 금속-반도체 전계 효과 트랜지스터 |
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JPH1170610A (ja) | 1996-07-26 | 1999-03-16 | Asahi Glass Co Ltd | 透明導電膜、および透明電極の形成方法 |
JPH1062816A (ja) | 1996-08-26 | 1998-03-06 | Toppan Printing Co Ltd | 液晶表示装置用電極板 |
KR100653467B1 (ko) | 1999-12-24 | 2006-12-04 | 비오이 하이디스 테크놀로지 주식회사 | 박막 트랜지스터-액정표시소자의 제조방법 |
KR100825317B1 (ko) * | 2001-12-31 | 2008-04-28 | 엘지디스플레이 주식회사 | 유기전계발광소자 |
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KR20070008257A (ko) | 2005-07-13 | 2007-01-17 | 삼성전자주식회사 | 배선 및 그 형성 방법과 박막 트랜지스터 기판 및 그 제조방법 |
KR101104419B1 (ko) | 2005-12-14 | 2012-01-12 | 사천홍시현시기건유한공사 | 능동형 유기 발광소자 및 그 제조방법 |
JP5305630B2 (ja) | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
TWI478347B (zh) * | 2007-02-09 | 2015-03-21 | Idemitsu Kosan Co | A thin film transistor, a thin film transistor substrate, and an image display device, and an image display device, and a semiconductor device |
JP4496237B2 (ja) * | 2007-05-14 | 2010-07-07 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
US8927970B2 (en) * | 2007-09-13 | 2015-01-06 | Lg Display Co., Ltd. | Organic electroluminescence device and method for manufacturing the same |
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2008
- 2008-12-22 KR KR1020080131647A patent/KR101182403B1/ko active IP Right Grant
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2009
- 2009-09-04 US US12/554,066 patent/US8269220B2/en not_active Expired - Fee Related
- 2009-09-15 JP JP2009213211A patent/JP5146428B2/ja not_active Expired - Fee Related
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2012
- 2012-08-21 US US13/590,768 patent/US8409935B2/en not_active Expired - Fee Related
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2013
- 2013-03-11 US US13/792,436 patent/US8546199B2/en not_active Expired - Fee Related
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Publication number | Publication date |
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US20100155792A1 (en) | 2010-06-24 |
US8269220B2 (en) | 2012-09-18 |
US20130189815A1 (en) | 2013-07-25 |
KR101182403B1 (ko) | 2012-09-13 |
US8546198B2 (en) | 2013-10-01 |
KR20100073064A (ko) | 2010-07-01 |
JP2010147458A (ja) | 2010-07-01 |
US20130189816A1 (en) | 2013-07-25 |
US20120315729A1 (en) | 2012-12-13 |
US8409935B2 (en) | 2013-04-02 |
US8546199B2 (en) | 2013-10-01 |
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