JP5131993B2 - マルチバンドギャップを備えるナノ結晶シリコン光電池及びその製造方法 - Google Patents
マルチバンドギャップを備えるナノ結晶シリコン光電池及びその製造方法 Download PDFInfo
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- JP5131993B2 JP5131993B2 JP2009177927A JP2009177927A JP5131993B2 JP 5131993 B2 JP5131993 B2 JP 5131993B2 JP 2009177927 A JP2009177927 A JP 2009177927A JP 2009177927 A JP2009177927 A JP 2009177927A JP 5131993 B2 JP5131993 B2 JP 5131993B2
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- 229910021423 nanocrystalline silicon Inorganic materials 0.000 title claims description 63
- 238000000034 method Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 42
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 32
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 24
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 18
- 239000002159 nanocrystal Substances 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 318
- 239000010409 thin film Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 19
- 238000005224 laser annealing Methods 0.000 description 18
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 8
- 229910000449 hafnium oxide Inorganic materials 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 235000013842 nitrous oxide Nutrition 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- 238000005424 photoluminescence Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004304 SiNy Inorganic materials 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/545—Microcrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
当該技術分野における上記欠陥及び不備を解決し、接合損失及び格子不整合による光電変換効率を改善し、高性能な光電池を実現することである。
110 第1導電層
140 Siリッチ誘電体層
145 ナノ結晶シリコン
170 第2導電層
180 誘電体層
181 接触孔
200 光電池
210 第1導電層
240 Siリッチ誘電体層
245 ナノ結晶シリコン
270 第2導電層
292 レーザー
295 光線
400 光電池バッテリー
401 光電池
410 第1導電層
440 Siリッチ誘電体層
445 ナノ結晶シリコン
470 第2導電層
480 充電式バッテリー
485 電流計
495 光線
510〜720 曲線
900 光電池
910 第1導電層
920 第1半導体層
930 第1Siリッチ誘電体層
940 第2Siリッチ誘電体層
960 第2半導体層
970 第2導電層
1000 光電池
1001 光電変換層
1010 第1導電層
1020 N型ドープ半導体層
1030 第1Siリッチ誘電体副層
1040 第2Siリッチ誘電体副層
1050 第3Siリッチ誘電体副層
1060 P型ドープ半導体層
1070 第2導電層
1101 表示パネル
1102 液晶表示パネル
1110 表示領域
1120 表示領域
1130 光検出器
1140 光電池
1150 周辺光検出器
1160 LCDドライバー
1200 低温多結晶シリコンパネル
1201 光電池
1210 基板
1221 読み出しTFT
1222 ソース領域
1224 ドレイン領域
1226 ゲート電極
1230 第1導電層
1240 Siリッチ誘電体層
1245 ナノ結晶シリコン
1270 第2導電層
1295 周辺光線
1296 バックライト
1300 低温多結晶シリコンパネル
1301 薄膜トランジスタ
1303 蓄積コンデンサ
1305 感光器
1307 アクティブ領域
1310 基板
1355 第1電極
1365 Siリッチ誘電体層
1375 第2電極
1400 方法
1410 第1基板
1412 スイッチ領域
1414 太陽電池領域
1420 ゲート電極
1430 誘電体層
1442 アモルファスシリコン層
1444 ドープのアモルファスシリコン層
1444a ソースポート
1444b ドレインポート
1450 金属層
1452 第1部分
1454 第2部分
1456 第3部分
1460 Siリッチ誘電体層
1470 保護層
1472 貫通孔
1482 第1部分
1484 第2部分
Claims (8)
- 光電池であって、
第1導電層と、
第2導電層と、
前記第1導電層と前記第2導電層との間に形成され、マルチバンドギャップを有する光電変換層と、
前記第1導電層と前記光電変換層との間に形成されるN型ドープ半導体層と、
前記第2導電層と前記光電変換層との間に形成されるP型ドープ半導体層と
を備え、
前記光電変換層は、
前記N型ドープ半導体層上に形成され、且つ、屈折率n1を有する第1Siリッチ(Si−rich)誘電体層と、
前記第1Siリッチ誘電体層上に形成され、且つ、屈折率n2を有する第2Siリッチ(Si−rich)誘電体層と
を含み、
前記第1及び第2Siリッチ誘電体層のそれぞれは、大きさが約1nm〜20nmの複数のナノ結晶シリコンを備えるナノ結晶シリコン(nc−Si)層であり、
前記第2Siリッチ誘電体層の屈折率n2は前記第1Siリッチ誘電体層の屈折率n1より小さいことを特徴とする光電池。 - 前記第1及び第2Siリッチ誘電体層のそれぞれの材質はSiリッチ酸化物、Siリッチ窒化物、Siリッチ窒化酸化物、Siリッチ炭化物、またはこれらの組み合わせを含むことを特徴とする請求項1に記載の光電池。
- 前記光電変換層は、更に、前記第2Siリッチ誘電体層と前記第2導電層との間に形成され、且つ屈折率n3を有する第3Siリッチ誘電体層を含み、前記第1、第2、第3Siリッチ誘電体層のそれぞれの屈折率n1、n2、n3は、式n3<n2<n1に満たすことを特徴とする請求項1または2の何れか1項に記載の光電池。
- 前記第3Siリッチ誘電体層の材質は、Siリッチ酸化物、Siリッチ窒化物、Siリッチ窒素酸化物、Siリッチ炭化物、またはこれらの組み合わせを含むことを特徴とする請求項3に記載の光電池。
- 前記光電変換層は、アモルファスシリコン(a−Si)層と、多結晶シリコン(poly−Si)層とを更に含み、
前記第1Siリッチ誘電体層と第2Siリッチ誘電体層とは、前記アモルファスシリコン層と多結晶シリコン層との間に形成されることを特徴とする請求項1または2の何れか1項に記載の光電池。 - 前記第1と第2導電層のうち少なくとも一方の材質が透明導電材料であることを特徴とする請求項1乃至5の何れか1項に記載の光電池。
- 光電池の製造方法であって、
基板を提供するステップと、
前記基板上に第1導電層を形成するステップと、
前記第1導電層上にN型ドープ半導体層を形成するステップと、
前記N型ドープ半導体層上にマルチバンドギャップ(multi−band gap)を有する光電変換層を形成するステップと、
前記光電変換層上にP型ドープ半導体層を形成するステップと、
前記P型ドープ半導体層上に第2導電層を形成するステップと
を含み、
前記光電変換層を形成するステップは、
前記第1導電層上に、大きさが約1nm〜20nmの複数のナノ結晶シリコンを備えて屈折率n1を有する第1Siリッチ(Si−rich)誘電体層を形成する工程と、
前記第1Siリッチ誘電体層上に、大きさが約1nm〜20nmの複数のナノ結晶シリコンを備えて該第1Siリッチ誘電体層の屈折率n1より小さい屈折率n2を有する第2Siリッチ(Si−rich)誘電体層を形成する工程と
を含むことを特徴とする光電池の製造方法。 - 前記光電変換層を形成するステップは、前記第2Siリッチ誘電体層と第2導電層との間に、屈折率n3を有する第3Siリッチ誘電体層を形成する工程を更に含み、前記第1Siリッチリッチ誘電体層の前記屈折率n1と、前記第2Siリッチリッチ誘電体層の前記屈折率n2と、前記第3Siリッチリッチ誘電体層の前記屈折率n3とは、式n3<n2<n1に満たすことを特徴とする請求項7に記載の光電池の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/202,647 US9577137B2 (en) | 2007-01-25 | 2008-09-02 | Photovoltaic cells with multi-band gap and applications in a low temperature polycrystalline silicon thin film transistor panel |
US12/202,647 | 2008-09-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010062539A JP2010062539A (ja) | 2010-03-18 |
JP5131993B2 true JP5131993B2 (ja) | 2013-01-30 |
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JP2009177927A Active JP5131993B2 (ja) | 2008-09-02 | 2009-07-30 | マルチバンドギャップを備えるナノ結晶シリコン光電池及びその製造方法 |
Country Status (3)
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---|---|
JP (1) | JP5131993B2 (ja) |
CN (1) | CN101515608B (ja) |
TW (1) | TWI462307B (ja) |
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