JP5125450B2 - 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置 Download PDF

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JP5125450B2
JP5125450B2 JP2007307292A JP2007307292A JP5125450B2 JP 5125450 B2 JP5125450 B2 JP 5125450B2 JP 2007307292 A JP2007307292 A JP 2007307292A JP 2007307292 A JP2007307292 A JP 2007307292A JP 5125450 B2 JP5125450 B2 JP 5125450B2
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resin composition
optical semiconductor
semiconductor element
thermosetting
substrate
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JP2008255327A (ja
JP2008255327A5 (https=
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勇人 小谷
直之 浦崎
加奈子 湯浅
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2007307292A 2007-03-13 2007-11-28 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置 Active JP5125450B2 (ja)

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JP2007307292A JP5125450B2 (ja) 2007-03-13 2007-11-28 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置

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JP2007063425 2007-03-13
JP2007063425 2007-03-13
JP2007307292A JP5125450B2 (ja) 2007-03-13 2007-11-28 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置

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JP2012188760A Division JP5727977B2 (ja) 2007-03-13 2012-08-29 光半導体装置

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JP2008255327A JP2008255327A (ja) 2008-10-23
JP2008255327A5 JP2008255327A5 (https=) 2011-12-08
JP5125450B2 true JP5125450B2 (ja) 2013-01-23

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JP2007307292A Active JP5125450B2 (ja) 2007-03-13 2007-11-28 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置
JP2012188760A Active JP5727977B2 (ja) 2007-03-13 2012-08-29 光半導体装置
JP2014122392A Active JP6247599B2 (ja) 2007-03-13 2014-06-13 タブレット及びそれを用いたｌｅｄデバイスの製造方法
JP2016214418A Active JP6341256B2 (ja) 2007-03-13 2016-11-01 タブレット及びおよびそれを用いた光半導体装置の製造方法

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JP2014122392A Active JP6247599B2 (ja) 2007-03-13 2014-06-13 タブレット及びそれを用いたｌｅｄデバイスの製造方法
JP2016214418A Active JP6341256B2 (ja) 2007-03-13 2016-11-01 タブレット及びおよびそれを用いた光半導体装置の製造方法

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009008947A1 (de) * 2009-02-13 2010-08-19 Dagmar Bettina Kramer Verfahren zur Herstellung einer LED-Leuchte
JP5359349B2 (ja) * 2009-02-18 2013-12-04 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP6133004B2 (ja) * 2009-03-31 2017-05-24 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
EP2472578B1 (en) * 2010-12-28 2020-06-03 Nichia Corporation Light emitting device
JP5803541B2 (ja) * 2011-10-11 2015-11-04 コニカミノルタ株式会社 Ｌｅｄ装置およびその製造方法、並びにそれに用いる蛍光体分散液
JP5831424B2 (ja) * 2012-10-17 2015-12-09 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2014068804A1 (ja) * 2012-10-31 2014-05-08 パナソニック株式会社 発光装置及びその製造方法
KR102213602B1 (ko) * 2014-12-23 2021-02-05 주식회사 두산 열경화성 수지 조성물 및 이를 포함하는 판상체
JP5949976B2 (ja) * 2015-02-18 2016-07-13 日立化成株式会社 粉末状熱硬化性樹脂組成物の製造方法、熱硬化性樹脂組成物タブレットの製造方法、及び光半導体装置の製造方法
JP6191705B2 (ja) * 2016-01-04 2017-09-06 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
CN108633317B (zh) 2016-02-12 2021-07-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
WO2019003600A1 (ja) * 2017-06-28 2019-01-03 京セラ株式会社 封止用樹脂組成物、電子部品及び電子部品の製造方法
JP6807355B2 (ja) * 2018-07-18 2021-01-06 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199649A (ja) * 1998-01-07 1999-07-27 Toray Ind Inc エポキシ樹脂組成物および半導体装置
JP4614214B2 (ja) * 1999-12-02 2011-01-19 信越化学工業株式会社 半導体装置素子用中空パッケージ
JP2002322345A (ja) * 2001-04-24 2002-11-08 Matsushita Electric Works Ltd 光半導体装置用樹脂組成物及び光半導体装置
JP2003007744A (ja) * 2001-06-21 2003-01-10 Sumitomo Bakelite Co Ltd 半導体パッケージの成形方法
JP4421228B2 (ja) * 2003-07-03 2010-02-24 京セラケミカル株式会社 光半導体封止用樹脂組成物および光半導体装置
JP3816910B2 (ja) * 2003-09-04 2006-08-30 吉川工業株式会社 半導体素子収納用パッケージ
JP4308731B2 (ja) * 2004-08-10 2009-08-05 セイコーインスツル株式会社 近視野光ヘッドおよび該近視野光ヘッドを用いた情報再生装置
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
JP2006265370A (ja) * 2005-03-24 2006-10-05 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2006298973A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Works Ltd 光半導体封止用樹脂組成物及び光半導体装置
JP4753624B2 (ja) * 2005-05-24 2011-08-24 富士電機株式会社 難燃性樹脂加工品
CN101268559B (zh) * 2005-08-04 2010-11-17 日亚化学工业株式会社 发光装置及其制造方法以及成形体及密封构件

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JP5727977B2 (ja) 2015-06-03
JP6247599B2 (ja) 2017-12-13
JP2014225675A (ja) 2014-12-04
JP6341256B2 (ja) 2018-06-13
JP2017022424A (ja) 2017-01-26
JP2013021342A (ja) 2013-01-31

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