JP5117282B2 - 配線基板及びこれを備えた電子装置 - Google Patents

配線基板及びこれを備えた電子装置 Download PDF

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Publication number
JP5117282B2
JP5117282B2 JP2008137973A JP2008137973A JP5117282B2 JP 5117282 B2 JP5117282 B2 JP 5117282B2 JP 2008137973 A JP2008137973 A JP 2008137973A JP 2008137973 A JP2008137973 A JP 2008137973A JP 5117282 B2 JP5117282 B2 JP 5117282B2
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Japan
Prior art keywords
wiring board
press
hole
holes
fit
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Expired - Fee Related
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JP2008137973A
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Japanese (ja)
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JP2009289447A5 (enExample
JP2009289447A (ja
Inventor
拓人 山口
志郎 山下
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2008137973A 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置 Expired - Fee Related JP5117282B2 (ja)

Priority Applications (1)

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JP2008137973A JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

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JP2008137973A JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

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JP2009289447A JP2009289447A (ja) 2009-12-10
JP2009289447A5 JP2009289447A5 (enExample) 2010-10-28
JP5117282B2 true JP5117282B2 (ja) 2013-01-16

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JP2008137973A Expired - Fee Related JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10644423B2 (en) 2016-11-14 2020-05-05 Hitachi Automotive Systems, Ltd. Semiconductor module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628772B2 (ja) 2011-10-20 2014-11-19 日立オートモティブシステムズ株式会社 プリント基板およびそれを用いた電子機器
JP6274058B2 (ja) 2014-09-22 2018-02-07 株式会社デンソー 電子装置、及び電子装置を備えた電子構造体
JP6711262B2 (ja) * 2016-12-26 2020-06-17 株式会社デンソー 電子装置
JP2019020300A (ja) * 2017-07-19 2019-02-07 アイシン精機株式会社 センサ電極構造およびセンサ電極構造の製造方法
JP2019169279A (ja) * 2018-03-22 2019-10-03 株式会社アドヴィックス プレスフィット端子接続装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419806Y2 (enExample) * 1990-11-27 1992-05-06
JPH0629026U (ja) * 1992-09-10 1994-04-15 本多通信工業株式会社 コネクタ用ハウジング
JP2004134302A (ja) * 2002-10-11 2004-04-30 Fujitsu Ten Ltd プレスフィット端子接続装置及びプレスフィット接続配線基板
JP2008053091A (ja) * 2006-08-25 2008-03-06 Honda Tsushin Kogyo Co Ltd プレスフィットコンタクト

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10644423B2 (en) 2016-11-14 2020-05-05 Hitachi Automotive Systems, Ltd. Semiconductor module
DE112017005171B4 (de) 2016-11-14 2024-05-23 Hitachi Astemo, Ltd. Halbleitermodul

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Publication number Publication date
JP2009289447A (ja) 2009-12-10

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