JP5115045B2 - ポリイミドワニス - Google Patents

ポリイミドワニス Download PDF

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Publication number
JP5115045B2
JP5115045B2 JP2007157107A JP2007157107A JP5115045B2 JP 5115045 B2 JP5115045 B2 JP 5115045B2 JP 2007157107 A JP2007157107 A JP 2007157107A JP 2007157107 A JP2007157107 A JP 2007157107A JP 5115045 B2 JP5115045 B2 JP 5115045B2
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JP
Japan
Prior art keywords
group
general formula
compound
mol
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007157107A
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English (en)
Japanese (ja)
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JP2008308572A5 (enExample
JP2008308572A (ja
Inventor
智之 弓場
真佐夫 富川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2007157107A priority Critical patent/JP5115045B2/ja
Publication of JP2008308572A publication Critical patent/JP2008308572A/ja
Publication of JP2008308572A5 publication Critical patent/JP2008308572A5/ja
Application granted granted Critical
Publication of JP5115045B2 publication Critical patent/JP5115045B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP2007157107A 2007-06-14 2007-06-14 ポリイミドワニス Expired - Fee Related JP5115045B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007157107A JP5115045B2 (ja) 2007-06-14 2007-06-14 ポリイミドワニス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007157107A JP5115045B2 (ja) 2007-06-14 2007-06-14 ポリイミドワニス

Publications (3)

Publication Number Publication Date
JP2008308572A JP2008308572A (ja) 2008-12-25
JP2008308572A5 JP2008308572A5 (enExample) 2010-07-29
JP5115045B2 true JP5115045B2 (ja) 2013-01-09

Family

ID=40236465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007157107A Expired - Fee Related JP5115045B2 (ja) 2007-06-14 2007-06-14 ポリイミドワニス

Country Status (1)

Country Link
JP (1) JP5115045B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10809619B2 (en) * 2013-06-26 2020-10-20 Nissan Chemical Industries, Ltd. Resist underlayer film-forming composition containing substituted crosslinkable compound
WO2016171179A1 (ja) * 2015-04-24 2016-10-27 東レ株式会社 樹脂組成物、それを用いた半導体素子の製造方法および半導体装置
JP7097803B2 (ja) * 2018-12-20 2022-07-08 信越ポリマー株式会社 導電性高分子含有液及びその製造方法、並びに導電性フィルム及びその製造方法
CN115826360B (zh) * 2022-12-23 2023-09-12 江苏艾森半导体材料股份有限公司 感光性聚酰亚胺组合物、图形的制造方法、固化物和电子部件
CN115947648B (zh) * 2022-12-28 2024-10-18 北京彤程创展科技有限公司 一种交联剂及其制备方法、光刻胶

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003252991A (ja) * 2002-02-28 2003-09-10 Dow Corning Toray Silicone Co Ltd アクリルもしくはメタクリル官能性シリコーン変性ポリイミド樹脂、その製造方法および感光性樹脂組成物
JP4374840B2 (ja) * 2002-08-30 2009-12-02 東レ株式会社 ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置
JP4834949B2 (ja) * 2003-07-24 2011-12-14 東レ株式会社 熱硬化性樹脂組成物およびそれを用いた電子部品
JP4677887B2 (ja) * 2004-11-24 2011-04-27 東レ株式会社 感光性樹脂組成物
JP4826415B2 (ja) * 2005-10-12 2011-11-30 東レ株式会社 感光性樹脂組成物

Also Published As

Publication number Publication date
JP2008308572A (ja) 2008-12-25

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