JP5111510B2 - 基板上に機能材料のパターンを形成する方法 - Google Patents

基板上に機能材料のパターンを形成する方法 Download PDF

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Publication number
JP5111510B2
JP5111510B2 JP2009530358A JP2009530358A JP5111510B2 JP 5111510 B2 JP5111510 B2 JP 5111510B2 JP 2009530358 A JP2009530358 A JP 2009530358A JP 2009530358 A JP2009530358 A JP 2009530358A JP 5111510 B2 JP5111510 B2 JP 5111510B2
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Japan
Prior art keywords
stamp
substrate
functional material
pattern
film
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Expired - Fee Related
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JP2009530358A
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English (en)
Japanese (ja)
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JP2010505264A5 (enExample
JP2010505264A (ja
Inventor
ベアトリズ ブランチェット グラシエラ
ヘ ヒュン イ
デルマー ジェイコックス ゲアリー
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2009530358A 2006-09-28 2007-09-07 基板上に機能材料のパターンを形成する方法 Expired - Fee Related JP5111510B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/529,086 2006-09-28
US11/529,086 US20080083484A1 (en) 2006-09-28 2006-09-28 Method to form a pattern of functional material on a substrate
PCT/US2007/019653 WO2008042079A2 (en) 2006-09-28 2007-09-07 Method to form a pattern of functional material on a substrate

Publications (3)

Publication Number Publication Date
JP2010505264A JP2010505264A (ja) 2010-02-18
JP2010505264A5 JP2010505264A5 (enExample) 2010-10-21
JP5111510B2 true JP5111510B2 (ja) 2013-01-09

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ID=38830972

Family Applications (1)

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JP2009530358A Expired - Fee Related JP5111510B2 (ja) 2006-09-28 2007-09-07 基板上に機能材料のパターンを形成する方法

Country Status (6)

Country Link
US (1) US20080083484A1 (enExample)
EP (1) EP2067075B1 (enExample)
JP (1) JP5111510B2 (enExample)
KR (1) KR20090077785A (enExample)
CN (1) CN101517484A (enExample)
WO (1) WO2008042079A2 (enExample)

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US8128393B2 (en) 2006-12-04 2012-03-06 Liquidia Technologies, Inc. Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom
GB0701909D0 (en) * 2007-01-31 2007-03-14 Imp Innovations Ltd Deposition Of Organic Layers
US20080233280A1 (en) * 2007-03-22 2008-09-25 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate by treating a surface of a stamp
DE102007027999A1 (de) * 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Strukturen
GB2453766A (en) * 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
US8877298B2 (en) * 2008-05-27 2014-11-04 The Hong Kong University Of Science And Technology Printing using a structure coated with ultraviolet radiation responsive material
KR101468960B1 (ko) * 2008-07-16 2014-12-04 삼성전자주식회사 리소그래피 마스크 제조방법 및 이를 이용한 미세패턴형성방법
US8899957B2 (en) * 2009-09-25 2014-12-02 HGST Netherlands B.V. System, method and apparatus for manufacturing magnetic recording media
US20110120544A1 (en) * 2009-11-20 2011-05-26 Levy David H Deposition inhibitor composition and method of use
KR101152182B1 (ko) * 2010-05-04 2012-06-15 주식회사디아이 프로브 블록용 프로브 필름 및 이의 제조 방법
JP6206729B2 (ja) * 2011-05-23 2017-10-04 ナショナル ユニバーシティ オブ シンガポール 薄膜の転写方法
CZ2011555A3 (cs) * 2011-09-06 2013-03-13 Active Optix S.R.O. Zpusob vytvárení výrobku s funkcním reliéfním povrchem s vysokým rozlisením
DE112011105527B4 (de) * 2011-09-21 2020-01-16 Ev Group E. Thallner Gmbh Verfahren zur Herstellung einer polychromatisierenden Schicht und Substrat sowie Leuchtdiode mit polychromatisierender Schicht
CN102800379B (zh) * 2012-07-31 2014-05-07 江苏科技大学 一种用于线路制造的无需丝网印刷的银导电组合物
CN102874030A (zh) * 2012-10-08 2013-01-16 蚌埠翼诚玻璃有限公司 一种用于制造玻璃浮雕的模具
US9205638B2 (en) 2013-02-05 2015-12-08 Eastman Kodak Company Method of forming printed patterns
US9728518B2 (en) * 2014-04-01 2017-08-08 Ati Technologies Ulc Interconnect etch with polymer layer edge protection
US20160124205A1 (en) * 2014-10-27 2016-05-05 Yale University Simple, Fast and Plasma-Free Method of Fabricating PDMS Microstructures on Glass by Pop Slide Pattering
US20180171468A1 (en) * 2016-12-21 2018-06-21 Ncc Nano, Llc Method for deposting a functional material on a substrate
CN106647165B (zh) * 2016-09-28 2020-04-10 西安交通大学 一种基于柔性的可在任意曲面制造微纳结构的方法
EP3373712B1 (fr) * 2017-03-09 2023-03-29 MGI Digital Technology Procédé de dépôt de traces conductrices
CN109645986B (zh) * 2018-11-30 2021-10-22 昆明贵金属研究所 一种柔性生物电极用低温固化银/氯化银浆料及其制备方法
WO2021182551A1 (ja) * 2020-03-11 2021-09-16 Ｓｃｉｖａｘ株式会社 モールドおよびモールドの製造方法
CN114242924B (zh) * 2021-12-13 2023-09-26 广东省科学院半导体研究所 一种量子点光转换器件及其制备方法

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US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5935415A (en) * 1994-12-22 1999-08-10 Uop Llc Continuous catalytic reforming process with dual zones
US6518168B1 (en) * 1995-08-18 2003-02-11 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US5830823A (en) * 1995-11-07 1998-11-03 Larry F. Vaughn Method for printing
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US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6641860B1 (en) * 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
US6380101B1 (en) * 2000-04-18 2002-04-30 International Business Machines Corporation Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof
US20020098618A1 (en) * 2001-01-19 2002-07-25 Rogers John A. Method and apparatus for transferring a feature pattern from an inked surface to a substrate
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
US20050120902A1 (en) * 2001-04-25 2005-06-09 David Adams Edge transfer lithography
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EP1538481A1 (en) * 2003-12-05 2005-06-08 Sony International (Europe) GmbH A method of activating a silicon surface for subsequent patterning of molecules onto said surface
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CN100541234C (zh) * 2004-12-21 2009-09-16 纳幕尔杜邦公司 用于在基材上形成图案化氟聚合物膜的方法
CA2523896A1 (en) * 2005-10-19 2007-04-19 Francesco Stellacci Nanocontact printing
US20080000373A1 (en) * 2006-06-30 2008-01-03 Maria Petrucci-Samija Printing form precursor and process for preparing a stamp from the precursor

Also Published As

Publication number Publication date
CN101517484A (zh) 2009-08-26
EP2067075B1 (en) 2013-05-01
US20080083484A1 (en) 2008-04-10
WO2008042079A2 (en) 2008-04-10
WO2008042079A3 (en) 2008-05-22
EP2067075A2 (en) 2009-06-10
KR20090077785A (ko) 2009-07-15
JP2010505264A (ja) 2010-02-18

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