JP5107049B2 - 光デバイスと電子デバイスとを集積回路に集積する方法 - Google Patents

光デバイスと電子デバイスとを集積回路に集積する方法 Download PDF

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JP5107049B2
JP5107049B2 JP2007541397A JP2007541397A JP5107049B2 JP 5107049 B2 JP5107049 B2 JP 5107049B2 JP 2007541397 A JP2007541397 A JP 2007541397A JP 2007541397 A JP2007541397 A JP 2007541397A JP 5107049 B2 JP5107049 B2 JP 5107049B2
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semiconductor layer
region
semiconductor substrate
electronic device
optical device
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Japanese (ja)
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JP2008521216A (ja
JP2008521216A5 (enExample
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ジー． ケイブ、ナイジェル
ジア、オマール
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NXP USA Inc
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NXP USA Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00

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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Optical Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2007541397A 2004-11-15 2005-11-14 光デバイスと電子デバイスとを集積回路に集積する方法 Expired - Fee Related JP5107049B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/989,940 2004-11-15
US10/989,940 US7109051B2 (en) 2004-11-15 2004-11-15 Method of integrating optical devices and electronic devices on an integrated circuit
PCT/US2005/041155 WO2006055476A2 (en) 2004-11-15 2005-11-14 Method of integrating optical devices and electronic devices on an integrated circuit

Publications (3)

Publication Number Publication Date
JP2008521216A JP2008521216A (ja) 2008-06-19
JP2008521216A5 JP2008521216A5 (enExample) 2008-11-27
JP5107049B2 true JP5107049B2 (ja) 2012-12-26

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JP2007541397A Expired - Fee Related JP5107049B2 (ja) 2004-11-15 2005-11-14 光デバイスと電子デバイスとを集積回路に集積する方法

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US (1) US7109051B2 (enExample)
EP (1) EP1854128A4 (enExample)
JP (1) JP5107049B2 (enExample)
WO (1) WO2006055476A2 (enExample)

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US7785983B2 (en) 2007-03-07 2010-08-31 Freescale Semiconductor, Inc. Semiconductor device having tiles for dual-trench integration and method therefor
US8211732B2 (en) * 2008-09-11 2012-07-03 Omnivision Technologies, Inc. Image sensor with raised photosensitive elements
US8513037B2 (en) * 2010-12-03 2013-08-20 Bae Systems Information And Electronic Systems Integration Inc. Method of integrating slotted waveguide into CMOS process
US8886925B2 (en) 2011-10-11 2014-11-11 Citrix Systems, Inc. Protecting enterprise data through policy-based encryption of message attachments
US9280377B2 (en) 2013-03-29 2016-03-08 Citrix Systems, Inc. Application with multiple operation modes
US9599561B2 (en) 2011-10-13 2017-03-21 Affymetrix, Inc. Methods, systems and apparatuses for testing and calibrating fluorescent scanners
US8910239B2 (en) 2012-10-15 2014-12-09 Citrix Systems, Inc. Providing virtualized private network tunnels
US9971585B2 (en) 2012-10-16 2018-05-15 Citrix Systems, Inc. Wrapping unmanaged applications on a mobile device
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US9595629B2 (en) * 2012-10-22 2017-03-14 Mellanox Technologies Silicon Photonics Inc. Enhancing planarization uniformity in optical devices
KR102007258B1 (ko) * 2012-11-21 2019-08-05 삼성전자주식회사 광전 집적회로 기판의 제조방법
US9989703B2 (en) * 2012-11-30 2018-06-05 International Business Machines Corporation Semiconductor structure and method for manufacturing a semiconductor structure
KR20140095678A (ko) * 2013-01-25 2014-08-04 삼성전자주식회사 광소자 및 전자소자를 포함하는 반도체 장치 및 그 제조 방법
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
US9387815B2 (en) 2013-02-28 2016-07-12 Kevin Goldstein Apparatus for collection of debris escaping around a vehicle tailgate
US8849978B1 (en) 2013-03-29 2014-09-30 Citrix Systems, Inc. Providing an enterprise application store
US10284627B2 (en) 2013-03-29 2019-05-07 Citrix Systems, Inc. Data management for an application with multiple operation modes
US9985850B2 (en) 2013-03-29 2018-05-29 Citrix Systems, Inc. Providing mobile device management functionalities
US9355223B2 (en) 2013-03-29 2016-05-31 Citrix Systems, Inc. Providing a managed browser
US9772461B2 (en) * 2013-10-02 2017-09-26 Photonics Electronics Technology Research Association Semiconductor integrated circuit and method for manufacturing the same
KR102590996B1 (ko) * 2018-10-17 2023-10-17 삼성전자주식회사 반도체 장치
US10884192B1 (en) * 2019-12-16 2021-01-05 Hewlett Packard Enterprise Development Lp Single-etch wide-bandwidth grating couplers with individually-tuned grating sections

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Also Published As

Publication number Publication date
EP1854128A4 (en) 2010-12-15
US7109051B2 (en) 2006-09-19
JP2008521216A (ja) 2008-06-19
WO2006055476A2 (en) 2006-05-26
EP1854128A2 (en) 2007-11-14
WO2006055476A3 (en) 2009-05-14
US20060105479A1 (en) 2006-05-18

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