JP5106414B2 - 濃厚なフィルム半導体インク - Google Patents

濃厚なフィルム半導体インク Download PDF

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Publication number
JP5106414B2
JP5106414B2 JP2008546671A JP2008546671A JP5106414B2 JP 5106414 B2 JP5106414 B2 JP 5106414B2 JP 2008546671 A JP2008546671 A JP 2008546671A JP 2008546671 A JP2008546671 A JP 2008546671A JP 5106414 B2 JP5106414 B2 JP 5106414B2
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Japan
Prior art keywords
binder
semiconductor
oil
ink
substrate
Prior art date
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Expired - Fee Related
Application number
JP2008546671A
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English (en)
Japanese (ja)
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JP2009520866A5 (https=
JP2009520866A (ja
Inventor
デイビッド・トーマス・ブリトン
エクンダレ・アヨデレ・オド
マルギット・ヘルティング
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PST Sensors Pty Ltd
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PST Sensors Pty Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/08—Printing inks based on natural resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/005—Drying oils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/02—Vulcanised oils, e.g. factice
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Conductive Materials (AREA)
JP2008546671A 2005-12-22 2006-12-18 濃厚なフィルム半導体インク Expired - Fee Related JP5106414B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA200510436 2005-12-22
ZA2005/10436 2005-12-22
PCT/IB2006/003666 WO2007072162A1 (en) 2005-12-22 2006-12-18 Thick film semiconducting inks

Publications (3)

Publication Number Publication Date
JP2009520866A JP2009520866A (ja) 2009-05-28
JP2009520866A5 JP2009520866A5 (https=) 2009-12-17
JP5106414B2 true JP5106414B2 (ja) 2012-12-26

Family

ID=37907452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008546671A Expired - Fee Related JP5106414B2 (ja) 2005-12-22 2006-12-18 濃厚なフィルム半導体インク

Country Status (8)

Country Link
US (1) US9206324B2 (https=)
EP (1) EP1971651B1 (https=)
JP (1) JP5106414B2 (https=)
KR (1) KR101407252B1 (https=)
CN (1) CN101346441B (https=)
ES (1) ES2609413T3 (https=)
WO (1) WO2007072162A1 (https=)
ZA (1) ZA200804813B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599631B2 (en) 2001-01-26 2003-07-29 Nanogram Corporation Polymer-inorganic particle composites
US8568684B2 (en) 2000-10-17 2013-10-29 Nanogram Corporation Methods for synthesizing submicron doped silicon particles
US20090075083A1 (en) 1997-07-21 2009-03-19 Nanogram Corporation Nanoparticle production and corresponding structures
US7226966B2 (en) 2001-08-03 2007-06-05 Nanogram Corporation Structures incorporating polymer-inorganic particle blends
WO2008085806A1 (en) 2007-01-03 2008-07-17 Nanogram Corporation Nanoparticle inks based on silicon/germanium, doped particles, printing and processes for semiconductor applications
JP5560640B2 (ja) * 2008-09-30 2014-07-30 大日本印刷株式会社 半導体基板の製造方法及びその方法により得られた半導体基板
US8895962B2 (en) * 2010-06-29 2014-11-25 Nanogram Corporation Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods
JP2013539908A (ja) 2010-09-13 2013-10-28 ピーエスティ・センサーズ・（プロプライエタリー）・リミテッド ディスクリート電子部品の組立およびパッケージング方法
ES2663098T3 (es) 2010-09-13 2018-04-11 Pst Sensors (Pty) Limited Método de producción de un sensor de temperatura impreso
EP2643854B1 (en) * 2010-11-23 2017-12-20 RISE Acreo AB Diode, use thereof, and a method for producing the same
US20140179049A1 (en) * 2012-12-20 2014-06-26 Nanogram Corporation Silicon/germanium-based nanoparticle pastes with ultra low metal contamination
KR101958056B1 (ko) 2013-05-24 2019-03-13 데이진 가부시키가이샤 고점도 알콜 용매 및 실리콘/게르마늄계 나노입자를 포함하는 인쇄용 잉크
US20150108632A1 (en) * 2013-10-23 2015-04-23 Nano And Advanced Materials Institute Limited Thin film with negative temperature coefficient behavior and method of making thereof
JP6651165B2 (ja) * 2014-09-17 2020-02-19 旭化成株式会社 薄膜トランジスタ及びその製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2014760A (en) 1934-10-18 1935-09-17 Dewsbury Wilfred Graham Paint, lithographic varnish, printing ink, and the like and process of making same
US3015632A (en) 1956-12-31 1962-01-02 Tribune Company Electrically conductive printing ink and method of producing same
US3105632A (en) * 1960-03-14 1963-10-01 Dresser Ind High pressure centrifugal compressor
US3992212A (en) * 1972-08-18 1976-11-16 Universal Oil Products Company Electrical resistor inks
US3947278A (en) * 1973-12-19 1976-03-30 Universal Oil Products Company Duplex resistor inks
US3989644A (en) * 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
DE2934528A1 (de) * 1979-08-27 1981-04-02 Henkel KGaA, 4000 Düsseldorf Hilfsmittel fuer pigmentpasten
JPS62262025A (ja) 1986-05-07 1987-11-14 Canon Inc 液晶用セル
JPH064799B2 (ja) 1987-03-31 1994-01-19 谷口インキ製造株式会社 印刷インキ
JPH0713212B2 (ja) * 1987-10-16 1995-02-15 東レ株式会社 導電性インキ組成物
JPH01153776A (ja) 1987-12-10 1989-06-15 Fuji Kagakushi Kogyo Co Ltd 印字用液状インク
JPH08194790A (ja) 1995-01-18 1996-07-30 Apo Syst Kk ２次元コードカードシステム
JP2963657B2 (ja) * 1996-07-05 1999-10-18 株式会社信州セラミックス 被着処理剤
EP1104791A1 (en) * 1999-11-25 2001-06-06 Sicpa Holding S.A. Printing ink, use of micro-wires as antennas in security documents, method for producing a security document and methods for authentication of security documents
JP4722269B2 (ja) * 2000-08-29 2011-07-13 Ａｚエレクトロニックマテリアルズ株式会社 低誘電率多孔質シリカ質膜、半導体装置およびコーティング組成物、ならびに低誘電率多孔質シリカ質膜の製造方法
JP2003036520A (ja) 2001-07-25 2003-02-07 Fuji Photo Film Co Ltd 磁気記録媒体
WO2004003070A1 (de) * 2002-06-28 2004-01-08 Merck Patent Gmbh Härtung und trocknung von lacksystemen und druckfarben
JP2004244525A (ja) 2003-02-14 2004-09-02 Kyocera Chemical Corp 導電性塗料
US7306823B2 (en) * 2004-09-18 2007-12-11 Nanosolar, Inc. Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells

Also Published As

Publication number Publication date
US20090004832A1 (en) 2009-01-01
KR20080100170A (ko) 2008-11-14
EP1971651B1 (en) 2016-10-05
CN101346441A (zh) 2009-01-14
ZA200804813B (en) 2016-07-27
ES2609413T3 (es) 2017-04-20
JP2009520866A (ja) 2009-05-28
KR101407252B1 (ko) 2014-06-16
CN101346441B (zh) 2012-04-18
US9206324B2 (en) 2015-12-08
EP1971651A1 (en) 2008-09-24
WO2007072162A1 (en) 2007-06-28

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