JP5105811B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP5105811B2 JP5105811B2 JP2006258180A JP2006258180A JP5105811B2 JP 5105811 B2 JP5105811 B2 JP 5105811B2 JP 2006258180 A JP2006258180 A JP 2006258180A JP 2006258180 A JP2006258180 A JP 2006258180A JP 5105811 B2 JP5105811 B2 JP 5105811B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- pixel electrode
- metal film
- transparent conductive
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010408 film Substances 0.000 claims description 823
- 229910052751 metal Inorganic materials 0.000 claims description 288
- 239000002184 metal Substances 0.000 claims description 288
- 239000004065 semiconductor Substances 0.000 claims description 100
- 239000010410 layer Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 48
- 239000011229 interlayer Substances 0.000 claims description 44
- 239000010409 thin film Substances 0.000 claims description 20
- 238000005192 partition Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 description 40
- 238000000034 method Methods 0.000 description 38
- 238000001312 dry etching Methods 0.000 description 27
- 239000004973 liquid crystal related substance Substances 0.000 description 27
- 239000000463 material Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000001039 wet etching Methods 0.000 description 19
- 239000012535 impurity Substances 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 16
- 238000005401 electroluminescence Methods 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 8
- 230000010355 oscillation Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910052715 tantalum Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229910052779 Neodymium Inorganic materials 0.000 description 4
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 229910052769 Ytterbium Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229910052691 Erbium Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 229910052775 Thulium Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 229910052839 forsterite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019974 CrSi Inorganic materials 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- ZCLBLRDCYNGAGV-UHFFFAOYSA-N [Si]=O.[Sn].[In] Chemical compound [Si]=O.[Sn].[In] ZCLBLRDCYNGAGV-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006258180A JP5105811B2 (ja) | 2005-10-14 | 2006-09-25 | 表示装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005301022 | 2005-10-14 | ||
JP2005301022 | 2005-10-14 | ||
JP2006258180A JP5105811B2 (ja) | 2005-10-14 | 2006-09-25 | 表示装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011246099A Division JP5417412B2 (ja) | 2005-10-14 | 2011-11-10 | 表示装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007133371A JP2007133371A (ja) | 2007-05-31 |
JP2007133371A5 JP2007133371A5 (enrdf_load_stackoverflow) | 2009-10-22 |
JP5105811B2 true JP5105811B2 (ja) | 2012-12-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006258180A Active JP5105811B2 (ja) | 2005-10-14 | 2006-09-25 | 表示装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5105811B2 (enrdf_load_stackoverflow) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4932602B2 (ja) * | 2006-11-14 | 2012-05-16 | 三菱電機株式会社 | 多層薄膜パターン及び表示装置の製造方法 |
KR101415561B1 (ko) * | 2007-06-14 | 2014-08-07 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그의 제조 방법 |
US7824939B2 (en) | 2007-10-23 | 2010-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device comprising separated and electrically connected source wiring layers |
KR101448903B1 (ko) | 2007-10-23 | 2014-10-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그의 제작방법 |
JP5380037B2 (ja) | 2007-10-23 | 2014-01-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP5377940B2 (ja) | 2007-12-03 | 2013-12-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR101455308B1 (ko) | 2007-12-03 | 2014-10-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터의 제작 방법 및 표시 장치의 제작 방법 |
US8035107B2 (en) | 2008-02-26 | 2011-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
CN101939694B (zh) | 2008-02-27 | 2014-01-29 | 株式会社半导体能源研究所 | 液晶显示器件及其制造方法以及电子装置 |
US8101442B2 (en) | 2008-03-05 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing EL display device |
US7989275B2 (en) | 2008-03-10 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, manufacturing method thereof, display device, and manufacturing method thereof |
JP5364422B2 (ja) | 2008-04-17 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
US9041202B2 (en) | 2008-05-16 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
US7790483B2 (en) | 2008-06-17 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and manufacturing method thereof, and display device and manufacturing method thereof |
US8741702B2 (en) * | 2008-10-24 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US8207026B2 (en) | 2009-01-28 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor and manufacturing method of display device |
KR101015850B1 (ko) | 2009-02-09 | 2011-02-24 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 제조 방법 |
US7989234B2 (en) | 2009-02-16 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor and method for manufacturing display device |
US20100224878A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8461582B2 (en) | 2009-03-05 | 2013-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP5514474B2 (ja) * | 2009-05-29 | 2014-06-04 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法、不揮発性半導体記憶素子の作製方法 |
TWI650848B (zh) | 2009-08-07 | 2019-02-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
KR101778513B1 (ko) | 2009-10-09 | 2017-09-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 표시 장치 및 이를 포함한 전자 기기 |
JP6076626B2 (ja) * | 2012-06-14 | 2017-02-08 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
CN103258827B (zh) * | 2013-04-28 | 2016-03-23 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
TWI649606B (zh) * | 2013-06-05 | 2019-02-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
CN103413898B (zh) * | 2013-08-29 | 2015-11-11 | 深圳市华星光电技术有限公司 | 有机发光二极管阳极连接结构及其制作方法 |
JP6497876B2 (ja) * | 2014-09-01 | 2019-04-10 | 三菱電機株式会社 | 液晶表示パネル、及びその製造方法 |
KR102651136B1 (ko) * | 2016-04-12 | 2024-03-25 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN105742299B (zh) * | 2016-05-16 | 2019-11-29 | 京东方科技集团股份有限公司 | 一种像素单元及其制作方法、阵列基板及显示装置 |
JP2019074684A (ja) * | 2017-10-18 | 2019-05-16 | シャープ株式会社 | 表示パネル用基板の製造方法 |
CN115996609A (zh) * | 2020-12-30 | 2023-04-21 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板和显示装置 |
WO2023243460A1 (ja) * | 2022-06-15 | 2023-12-21 | ソニーグループ株式会社 | 液晶表示素子および表示装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2955277B2 (ja) * | 1997-07-28 | 1999-10-04 | シャープ株式会社 | 液晶表示装置 |
JP3281849B2 (ja) * | 1997-10-07 | 2002-05-13 | シャープ株式会社 | アクティブマトリクス型液晶表示装置 |
JP3284187B2 (ja) * | 1998-01-29 | 2002-05-20 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
JP4167335B2 (ja) * | 1998-01-30 | 2008-10-15 | シャープ株式会社 | 液晶表示装置 |
JP2001326360A (ja) * | 2000-05-18 | 2001-11-22 | Sharp Corp | アクティブマトリクス基板の製造方法およびアクティブマトリクス基板および薄膜電界効果トランジスタの製造方法 |
KR100858297B1 (ko) * | 2001-11-02 | 2008-09-11 | 삼성전자주식회사 | 반사-투과형 액정표시장치 및 그 제조 방법 |
JP4302347B2 (ja) * | 2001-12-18 | 2009-07-22 | シャープ株式会社 | 薄膜トランジスタ基板及びその製造方法 |
JP4373086B2 (ja) * | 2002-12-27 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP4085094B2 (ja) * | 2004-02-19 | 2008-04-30 | シャープ株式会社 | 導電素子基板の製造方法、液晶表示装置の製造方法 |
JP4275038B2 (ja) * | 2004-09-01 | 2009-06-10 | シャープ株式会社 | アクティブマトリクス基板およびそれを備えた表示装置 |
KR101139522B1 (ko) * | 2004-12-04 | 2012-05-07 | 엘지디스플레이 주식회사 | 반투과형 박막 트랜지스터 기판 및 그 제조 방법 |
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