JP5105801B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5105801B2
JP5105801B2 JP2006240378A JP2006240378A JP5105801B2 JP 5105801 B2 JP5105801 B2 JP 5105801B2 JP 2006240378 A JP2006240378 A JP 2006240378A JP 2006240378 A JP2006240378 A JP 2006240378A JP 5105801 B2 JP5105801 B2 JP 5105801B2
Authority
JP
Japan
Prior art keywords
working fluid
fluid supply
package
semiconductor
fluid discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006240378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008066387A (ja
Inventor
剛 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2006240378A priority Critical patent/JP5105801B2/ja
Priority to KR1020087025874A priority patent/KR101054581B1/ko
Priority to EP07806782.4A priority patent/EP2061079B1/en
Priority to PCT/JP2007/067340 priority patent/WO2008029858A1/ja
Priority to TW096134313A priority patent/TW200913187A/zh
Publication of JP2008066387A publication Critical patent/JP2008066387A/ja
Priority to US12/274,582 priority patent/US8405204B2/en
Application granted granted Critical
Publication of JP5105801B2 publication Critical patent/JP5105801B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006240378A 2006-09-05 2006-09-05 半導体装置 Expired - Fee Related JP5105801B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006240378A JP5105801B2 (ja) 2006-09-05 2006-09-05 半導体装置
KR1020087025874A KR101054581B1 (ko) 2006-09-05 2007-09-05 반도체 패키지 및 반도체 패키지 조립체
EP07806782.4A EP2061079B1 (en) 2006-09-05 2007-09-05 Semiconductor package and semiconductor package assembly
PCT/JP2007/067340 WO2008029858A1 (fr) 2006-09-05 2007-09-05 Boîtier de semiconducteur et assemblage de boîtier de semiconducteur
TW096134313A TW200913187A (en) 2006-09-05 2007-09-13 Semiconductor package and semiconductor package assembly
US12/274,582 US8405204B2 (en) 2006-09-05 2008-11-20 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006240378A JP5105801B2 (ja) 2006-09-05 2006-09-05 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011152777A Division JP5349547B2 (ja) 2011-07-11 2011-07-11 半導体パッケージ及び半導体装置

Publications (2)

Publication Number Publication Date
JP2008066387A JP2008066387A (ja) 2008-03-21
JP5105801B2 true JP5105801B2 (ja) 2012-12-26

Family

ID=39157284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006240378A Expired - Fee Related JP5105801B2 (ja) 2006-09-05 2006-09-05 半導体装置

Country Status (6)

Country Link
US (1) US8405204B2 (enExample)
EP (1) EP2061079B1 (enExample)
JP (1) JP5105801B2 (enExample)
KR (1) KR101054581B1 (enExample)
TW (1) TW200913187A (enExample)
WO (1) WO2008029858A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4768024B2 (ja) * 2006-07-28 2011-09-07 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
JP6124742B2 (ja) * 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
WO2016203884A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
WO2016204257A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
JP2018006418A (ja) * 2016-06-28 2018-01-11 富士ゼロックス株式会社 レーザ素子ユニット、照射装置及び画像形成装置
JP6636996B2 (ja) * 2017-07-11 2020-01-29 ファナック株式会社 Ｌｄモジュール冷却装置及びレーザ装置
JP6921282B1 (ja) * 2020-07-17 2021-08-18 三菱電機株式会社 電力変換装置
DE102023131882A1 (de) 2023-11-15 2025-05-15 TRUMPF Hüttinger GmbH + Co. KG Kühlanordnung, Elektronikbaugruppe, elektrischer Leistungsumwandler und Verfahren zu deren Zusammenbau

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
JPH054498A (ja) 1991-06-24 1993-01-14 Takeuchi Kogyo Kk 化粧品容器部品の製造方法および化粧品容器部品
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules
WO1995008844A1 (de) 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Kühlvorrichtung für ein leistungshalbleitermodul
JPH09307040A (ja) * 1996-05-15 1997-11-28 Hitachi Ltd 半導体装置、インバータ装置、および半導体装置の製造方法
JP3982180B2 (ja) * 2000-02-16 2007-09-26 株式会社日立製作所 電力変換装置
US6414867B2 (en) 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
JP2004103936A (ja) * 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
JP2005282715A (ja) * 2004-03-30 2005-10-13 Denso Corp 制御装置
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置

Also Published As

Publication number Publication date
US8405204B2 (en) 2013-03-26
EP2061079B1 (en) 2014-04-30
US20090072386A1 (en) 2009-03-19
WO2008029858A1 (fr) 2008-03-13
EP2061079A4 (en) 2011-12-07
KR20090027606A (ko) 2009-03-17
TW200913187A (en) 2009-03-16
EP2061079A1 (en) 2009-05-20
JP2008066387A (ja) 2008-03-21
TWI363408B (enExample) 2012-05-01
KR101054581B1 (ko) 2011-08-04

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