KR101054581B1 - 반도체 패키지 및 반도체 패키지 조립체 - Google Patents

반도체 패키지 및 반도체 패키지 조립체 Download PDF

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Publication number
KR101054581B1
KR101054581B1 KR1020087025874A KR20087025874A KR101054581B1 KR 101054581 B1 KR101054581 B1 KR 101054581B1 KR 1020087025874 A KR1020087025874 A KR 1020087025874A KR 20087025874 A KR20087025874 A KR 20087025874A KR 101054581 B1 KR101054581 B1 KR 101054581B1
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South Korea
Prior art keywords
refrigerant
coolant
semiconductor element
package
semiconductor
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Expired - Fee Related
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KR1020087025874A
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English (en)
Korean (ko)
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KR20090027606A (ko
Inventor
쯔요시 하세가와
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가부시끼가이샤 도시바
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Publication of KR20090027606A publication Critical patent/KR20090027606A/ko
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Publication of KR101054581B1 publication Critical patent/KR101054581B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020087025874A 2006-09-05 2007-09-05 반도체 패키지 및 반도체 패키지 조립체 Expired - Fee Related KR101054581B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006240378A JP5105801B2 (ja) 2006-09-05 2006-09-05 半導体装置
JPJP-P-2006-240378 2006-09-05
PCT/JP2007/067340 WO2008029858A1 (fr) 2006-09-05 2007-09-05 Boîtier de semiconducteur et assemblage de boîtier de semiconducteur

Publications (2)

Publication Number Publication Date
KR20090027606A KR20090027606A (ko) 2009-03-17
KR101054581B1 true KR101054581B1 (ko) 2011-08-04

Family

ID=39157284

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087025874A Expired - Fee Related KR101054581B1 (ko) 2006-09-05 2007-09-05 반도체 패키지 및 반도체 패키지 조립체

Country Status (6)

Country Link
US (1) US8405204B2 (enExample)
EP (1) EP2061079B1 (enExample)
JP (1) JP5105801B2 (enExample)
KR (1) KR101054581B1 (enExample)
TW (1) TW200913187A (enExample)
WO (1) WO2008029858A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4768024B2 (ja) * 2006-07-28 2011-09-07 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
JP6124742B2 (ja) * 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
WO2016203884A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
WO2016204257A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
JP2018006418A (ja) * 2016-06-28 2018-01-11 富士ゼロックス株式会社 レーザ素子ユニット、照射装置及び画像形成装置
JP6636996B2 (ja) * 2017-07-11 2020-01-29 ファナック株式会社 Ｌｄモジュール冷却装置及びレーザ装置
JP6921282B1 (ja) * 2020-07-17 2021-08-18 三菱電機株式会社 電力変換装置
DE102023131882A1 (de) 2023-11-15 2025-05-15 TRUMPF Hüttinger GmbH + Co. KG Kühlanordnung, Elektronikbaugruppe, elektrischer Leistungsumwandler und Verfahren zu deren Zusammenbau

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308246A (ja) * 2000-02-16 2001-11-02 Hitachi Ltd 電力変換装置
JP2004103936A (ja) * 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
JPH054498A (ja) 1991-06-24 1993-01-14 Takeuchi Kogyo Kk 化粧品容器部品の製造方法および化粧品容器部品
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules
WO1995008844A1 (de) 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Kühlvorrichtung für ein leistungshalbleitermodul
JPH09307040A (ja) * 1996-05-15 1997-11-28 Hitachi Ltd 半導体装置、インバータ装置、および半導体装置の製造方法
US6414867B2 (en) 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
JP2005282715A (ja) * 2004-03-30 2005-10-13 Denso Corp 制御装置
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308246A (ja) * 2000-02-16 2001-11-02 Hitachi Ltd 電力変換装置
JP2004103936A (ja) * 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法

Also Published As

Publication number Publication date
US8405204B2 (en) 2013-03-26
EP2061079B1 (en) 2014-04-30
US20090072386A1 (en) 2009-03-19
WO2008029858A1 (fr) 2008-03-13
EP2061079A4 (en) 2011-12-07
KR20090027606A (ko) 2009-03-17
TW200913187A (en) 2009-03-16
EP2061079A1 (en) 2009-05-20
JP2008066387A (ja) 2008-03-21
JP5105801B2 (ja) 2012-12-26
TWI363408B (enExample) 2012-05-01

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