JP4404861B2 - 熱発生構成要素を冷却する装置、及び熱発生構成要素を冷却する装置を製造する方法 - Google Patents
熱発生構成要素を冷却する装置、及び熱発生構成要素を冷却する装置を製造する方法 Download PDFInfo
- Publication number
- JP4404861B2 JP4404861B2 JP2006015058A JP2006015058A JP4404861B2 JP 4404861 B2 JP4404861 B2 JP 4404861B2 JP 2006015058 A JP2006015058 A JP 2006015058A JP 2006015058 A JP2006015058 A JP 2006015058A JP 4404861 B2 JP4404861 B2 JP 4404861B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooling
- heat spreader
- generating component
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 238000000034 method Methods 0.000 title description 15
- 239000002826 coolant Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000110 cooling liquid Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
206 カバー(熱伝導性カバー)
200、300 集積回路チップ(半導体チップ)
301 上側面
302 基板
303 上側面
304 電気接続
305 下側面
306 コールドプレート(冷却板)
308 熱境界面(単一境界面)
310 ハウジング
312 チャンバ
314 冷却液
318 入継手
320 出継手
Claims (4)
- 熱発生構成要素を冷却する装置であって、
熱分散器の下側面によって前記熱発生構成要素に結合された前記熱分散器と、
前記熱分散器の上側面でハウジングに収容され、前記熱分散器の前記上側面に直接接触する冷却液と、
前記熱分散器の少なくとも側面に結合される冷却板とを備え、
前記熱発生構成要素と前記熱分散器とが同じ設置面積を占め、
前記ハウジングは前記冷却板の上側面と結合し、
前記冷却板と前記ハウジングとは同じ設置面積を占めることを特徴とする装置。 - 前記熱発生構成要素が半導体チップであることを特徴とする請求項1に記載の装置。
- 熱発生構成要素を冷却する装置を製造する方法であって、
熱分散器の下側面によって前記熱発生構成要素に前記熱分散器を結合するステップと、
前記熱分散器の上側面に冷却液が直接接触するように、前記熱分散器の上側面のハウジングに前記冷却液を収容するステップと、
前記熱分散器の少なくとも側面に冷却板を結合するステップとを含み、
前記熱発生構成要素と前記熱分散器とが同じ設置面積を占め、
前記ハウジングは前記冷却板の上側面と結合しており、
前記冷却板と前記ハウジングとは同じ設置面積を占めることを特徴とする方法。 - 前記熱発生構成要素が、半導体チップであることを特徴とする請求項3に記載の製造する方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/046,616 US20060169438A1 (en) | 2005-01-28 | 2005-01-28 | Thermally conductive cover directly attached to heat producing component |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006210918A JP2006210918A (ja) | 2006-08-10 |
JP4404861B2 true JP4404861B2 (ja) | 2010-01-27 |
Family
ID=36010537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006015058A Expired - Fee Related JP4404861B2 (ja) | 2005-01-28 | 2006-01-24 | 熱発生構成要素を冷却する装置、及び熱発生構成要素を冷却する装置を製造する方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20060169438A1 (ja) |
JP (1) | JP4404861B2 (ja) |
GB (1) | GB2422726A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101730449A (zh) * | 2008-10-24 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
CN101950197A (zh) * | 2010-05-24 | 2011-01-19 | 深圳市傲星泰科技有限公司 | 一种计算机电源 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1230184A (en) * | 1983-11-29 | 1987-12-08 | Toshiyuki Saito | Liquid cooling type high frequency solid state device |
JPS61220359A (ja) * | 1985-03-26 | 1986-09-30 | Hitachi Ltd | 半導体モジユ−ル冷却構造体 |
US4635709A (en) * | 1985-12-03 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Air Force | Dual mode heat exchanger |
US4928207A (en) * | 1989-06-15 | 1990-05-22 | International Business Machines Corporation | Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston |
JPH03208365A (ja) * | 1990-01-10 | 1991-09-11 | Hitachi Ltd | 電子装置の冷却機構及びその使用方法 |
US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
US6333849B1 (en) * | 1996-07-01 | 2001-12-25 | Compaq Computer Corporation | Apparatus for liquid cooling of specific computer components |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US6796370B1 (en) * | 2000-11-03 | 2004-09-28 | Cray Inc. | Semiconductor circular and radial flow cooler |
US20040055322A1 (en) * | 2002-09-19 | 2004-03-25 | Sun Microsystems, Inc. | Field replaceable packard refrigeration module with vapor chamber heat sink for cooling electronic components |
US7078803B2 (en) * | 2002-09-27 | 2006-07-18 | Isothermal Systems Research, Inc. | Integrated circuit heat dissipation system |
US7007741B2 (en) * | 2002-10-18 | 2006-03-07 | Sun Microsystems, Inc. | Conformal heat spreader |
US6778393B2 (en) * | 2002-12-02 | 2004-08-17 | International Business Machines Corporation | Cooling device with multiple compliant elements |
US6771500B1 (en) * | 2003-03-27 | 2004-08-03 | Stmicroelectronics, Inc. | System and method for direct convective cooling of an exposed integrated circuit die surface |
JP4122250B2 (ja) * | 2003-03-31 | 2008-07-23 | 山洋電気株式会社 | 電子部品冷却装置 |
US7454920B2 (en) * | 2004-11-04 | 2008-11-25 | Raytheon Company | Method and apparatus for moisture control within a phased array |
-
2005
- 2005-01-28 US US11/046,616 patent/US20060169438A1/en not_active Abandoned
-
2006
- 2006-01-18 GB GB0601022A patent/GB2422726A/en not_active Withdrawn
- 2006-01-24 JP JP2006015058A patent/JP4404861B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-23 US US11/880,651 patent/US20080011459A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2006210918A (ja) | 2006-08-10 |
GB0601022D0 (en) | 2006-03-01 |
GB2422726A (en) | 2006-08-02 |
US20080011459A1 (en) | 2008-01-17 |
US20060169438A1 (en) | 2006-08-03 |
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