JP5104030B2 - 多層セラミック基板およびその製造方法 - Google Patents
多層セラミック基板およびその製造方法 Download PDFInfo
- Publication number
- JP5104030B2 JP5104030B2 JP2007135141A JP2007135141A JP5104030B2 JP 5104030 B2 JP5104030 B2 JP 5104030B2 JP 2007135141 A JP2007135141 A JP 2007135141A JP 2007135141 A JP2007135141 A JP 2007135141A JP 5104030 B2 JP5104030 B2 JP 5104030B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- external electrode
- ceramic substrate
- multilayer ceramic
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007135141A JP5104030B2 (ja) | 2007-05-22 | 2007-05-22 | 多層セラミック基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007135141A JP5104030B2 (ja) | 2007-05-22 | 2007-05-22 | 多層セラミック基板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008294036A JP2008294036A (ja) | 2008-12-04 |
| JP2008294036A5 JP2008294036A5 (https=) | 2010-05-06 |
| JP5104030B2 true JP5104030B2 (ja) | 2012-12-19 |
Family
ID=40168489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007135141A Expired - Fee Related JP5104030B2 (ja) | 2007-05-22 | 2007-05-22 | 多層セラミック基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5104030B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5566271B2 (ja) * | 2010-11-24 | 2014-08-06 | 京セラ株式会社 | 配線基板およびその製造方法 |
| TWI539632B (zh) * | 2013-11-04 | 2016-06-21 | 隆達電子股份有限公司 | 發光二極體結構 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02148789A (ja) * | 1988-03-11 | 1990-06-07 | Internatl Business Mach Corp <Ibm> | 電子回路基板 |
| JPH08204337A (ja) * | 1995-01-25 | 1996-08-09 | Hitachi Ltd | 配線構造体およびその製造方法 |
| JPH08250861A (ja) * | 1995-03-14 | 1996-09-27 | Taiyo Yuden Co Ltd | 多層基板 |
| JPH09205005A (ja) * | 1996-01-24 | 1997-08-05 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
-
2007
- 2007-05-22 JP JP2007135141A patent/JP5104030B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008294036A (ja) | 2008-12-04 |
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