JP5100686B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

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Publication number
JP5100686B2
JP5100686B2 JP2009042328A JP2009042328A JP5100686B2 JP 5100686 B2 JP5100686 B2 JP 5100686B2 JP 2009042328 A JP2009042328 A JP 2009042328A JP 2009042328 A JP2009042328 A JP 2009042328A JP 5100686 B2 JP5100686 B2 JP 5100686B2
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Japan
Prior art keywords
block
flat
punch
eyelet
semiconductor device
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Application number
JP2009042328A
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English (en)
Japanese (ja)
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JP2010199287A5 (https=
JP2010199287A (ja
Inventor
正夫 海沼
吉彦 中村
潤一郎 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009042328A priority Critical patent/JP5100686B2/ja
Publication of JP2010199287A publication Critical patent/JP2010199287A/ja
Publication of JP2010199287A5 publication Critical patent/JP2010199287A5/ja
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Publication of JP5100686B2 publication Critical patent/JP5100686B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

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  • Semiconductor Lasers (AREA)
JP2009042328A 2009-02-25 2009-02-25 半導体装置の製造方法 Active JP5100686B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009042328A JP5100686B2 (ja) 2009-02-25 2009-02-25 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009042328A JP5100686B2 (ja) 2009-02-25 2009-02-25 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010199287A JP2010199287A (ja) 2010-09-09
JP2010199287A5 JP2010199287A5 (https=) 2012-03-01
JP5100686B2 true JP5100686B2 (ja) 2012-12-19

Family

ID=42823721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009042328A Active JP5100686B2 (ja) 2009-02-25 2009-02-25 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5100686B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024066173A (ja) 2022-11-01 2024-05-15 新光電気工業株式会社 ステム及びステムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880029B2 (ja) * 1992-11-09 1999-04-05 新光電気工業株式会社 半導体ステムの製造方法
JP3327042B2 (ja) * 1995-04-17 2002-09-24 松下電器産業株式会社 半導体レーザ装置
JP4926458B2 (ja) * 2005-11-17 2012-05-09 新光電気工業株式会社 光半導体素子用ステムの製造方法

Also Published As

Publication number Publication date
JP2010199287A (ja) 2010-09-09

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