JP2010199287A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010199287A5 JP2010199287A5 JP2009042328A JP2009042328A JP2010199287A5 JP 2010199287 A5 JP2010199287 A5 JP 2010199287A5 JP 2009042328 A JP2009042328 A JP 2009042328A JP 2009042328 A JP2009042328 A JP 2009042328A JP 2010199287 A5 JP2010199287 A5 JP 2010199287A5
- Authority
- JP
- Japan
- Prior art keywords
- flat
- block
- punch
- eyelet
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009042328A JP5100686B2 (ja) | 2009-02-25 | 2009-02-25 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009042328A JP5100686B2 (ja) | 2009-02-25 | 2009-02-25 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010199287A JP2010199287A (ja) | 2010-09-09 |
| JP2010199287A5 true JP2010199287A5 (https=) | 2012-03-01 |
| JP5100686B2 JP5100686B2 (ja) | 2012-12-19 |
Family
ID=42823721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009042328A Active JP5100686B2 (ja) | 2009-02-25 | 2009-02-25 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5100686B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024066173A (ja) | 2022-11-01 | 2024-05-15 | 新光電気工業株式会社 | ステム及びステムの製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2880029B2 (ja) * | 1992-11-09 | 1999-04-05 | 新光電気工業株式会社 | 半導体ステムの製造方法 |
| JP3327042B2 (ja) * | 1995-04-17 | 2002-09-24 | 松下電器産業株式会社 | 半導体レーザ装置 |
| JP4926458B2 (ja) * | 2005-11-17 | 2012-05-09 | 新光電気工業株式会社 | 光半導体素子用ステムの製造方法 |
-
2009
- 2009-02-25 JP JP2009042328A patent/JP5100686B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015115419A5 (https=) | ||
| WO2009025961A3 (en) | Semiconductor component and method of manufacture | |
| EP2477242A3 (en) | Light-emitting device package and method of manufacturing the same | |
| EP2506318A3 (en) | Light emitting diode device and producing method thereof | |
| JP2007267113A5 (https=) | ||
| EP1662566A3 (en) | Semiconductor device and method of fabricating the same | |
| EP2669938A3 (en) | Semiconductor device with an oxide solder flow prevention area on a substrate and corresponding manufacturing method | |
| EP1848030A3 (en) | Method of manufacturing semiconductor apparatus | |
| WO2007117829A3 (en) | Method for bonding a semiconductor substrate to a metal substrate | |
| WO2010074956A3 (en) | Doping of lead-free solder alloys and structures formed thereby | |
| TWI557821B (zh) | 半導體裝置的製造方法以及打線裝置 | |
| EP2053651A3 (en) | Method for producing substrate | |
| JP2008277742A5 (https=) | ||
| JP5884752B2 (ja) | 超音波接合装置及び半導体装置の製造方法 | |
| JP5433526B2 (ja) | 電子機器とその製造方法 | |
| JP2016018931A5 (https=) | ||
| JP2019040763A5 (https=) | ||
| JP2010527509A5 (https=) | ||
| JP2011258732A5 (https=) | ||
| JP2010123592A5 (https=) | ||
| JP2009049285A5 (https=) | ||
| JP2019009183A5 (https=) | ||
| JP2015204263A5 (https=) | ||
| JP2010199287A5 (https=) | ||
| EP1933377A3 (en) | Semiconductor device and method for manufacturing the same |