JP5099714B2 - Multi-chip module - Google Patents

Description

  The present invention relates to a multichip module (MCM), for example, a multichip module in which a plurality of semiconductor chips having several different functions are mounted on a single mounting substrate so as to be substantially integrated as a single semiconductor integrated circuit device. It is related to technology effective when applied to.

  In so-called multichip module technology, a plurality of semiconductor chips are mounted on a mounting substrate having a plurality of internal wirings and a plurality of external terminals, and the plurality of semiconductor chips and the mounting substrate are integrated. The In JP-A-6-224360 and JP-A-2003-7963, JP-A-2003-224242 is devised to provide a space for providing bonding wires in a multi-chip stack structure. That is, in Japanese Patent Laid-Open No. 6-224360, a step is provided on the back surface of the chip. In JP 2003-7963 A, a spacer is provided. In Japanese Patent Laid-Open No. 2003-224242, a chip is provided on the back surface of the chip.

JP-A-6-224360 JP 2003-7963 A JP 2003-224242 A

  Advances in semiconductor technology are the direction of technology that attempts to configure a plurality of semiconductor chips, such as microcomputer chips, DRAM chips, and flash memory chips, as a whole as a single package semiconductor device. Has produced. In other words, instead of a plurality of semiconductor chips, each one semiconductor chip is packaged by a normal packaging technology such as QFP (Quad Flat Package), CSP (Chip Size Package or Chip Scale Package), BGA (Ball Grid Array). When using a semiconductor device and mounting the plurality of semiconductor devices on a mounting board such as a printed circuit board, it becomes difficult to reduce the distance between the semiconductor chips and the wiring distance thereof, and the signal delay due to the wiring is large. There will be restrictions in speeding up and downsizing the device.

  On the other hand, in the multi-chip module (Multi Chip Module) technology, in order to make a plurality of semiconductor chips in a form of a single package into a semiconductor device in a significantly small form called a so-called bare chip, The wiring distance between the chips can be shortened, and the characteristics of the semiconductor device can be improved. Further, by making a plurality of chips into one package, the semiconductor device can be reduced in size, and the semiconductor device can be reduced in size by reducing its mounting area.

  As a semiconductor chip to be configured as a multichip module, it is desirable to select closely related ones such as a microcomputer chip and a DRAM or flash memory chip coupled to the microcomputer chip. . When selecting such a combination of a plurality of semiconductor chips closely related to each other, the characteristics of the multichip module can be fully utilized. However, in the above-mentioned Patent Documents 1 to 3, no consideration is given to the improvement of the function as a whole and the further miniaturization which are the characteristics of such a multichip module. Just stop and stop.

  An object of the present invention is to provide a multichip module that achieves high performance and miniaturization. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

The outline of a typical invention among the inventions disclosed in the present application will be briefly described as follows. That is, the first semiconductor chip is applied on the surface of the mounting substrate on which the plurality of electrodes are formed. A second semiconductor chip and a third semiconductor chip each having a plurality of bonding pads and a back surface are mounted on the periphery of each main surface on the front surface of the first semiconductor chip. Of the bonding pads in the second semiconductor chip, the bonding pad on the first side of the first semiconductor chip is bonded to the first electrode of the mounting substrate via the first bonding wire and to the bonding in the second semiconductor chip. A bonding pad existing on the second side of the first semiconductor chip among the pads is electrically connected to the second electrode of the mounting substrate via the second bonding wire and the third semiconductor chip. The first, second, and third semiconductor chips on the mounting substrate are sealed with a resin sealing body.

  In the first semiconductor chip mounted on the surface of the mounting board, while realizing a good signal transmission path, a larger area is not required in the mounting board than the first semiconductor chip for connection with the mounting board. The size of the substrate can be reduced. The second semiconductor chip and the third semiconductor chip can be connected to the mounting substrate under the same conditions, and a double circuit function can be realized.

It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing of one Example for demonstrating the multichip module which concerns on this invention. It is a top view of one Example for demonstrating the multichip module which concerns on this invention. It is sectional drawing which shows one Example of the multichip module which concerns on this invention. It is sectional drawing which shows another Example of the multichip module which concerns on this invention. It is a block diagram which shows one Example of microcomputer LSI used for this invention. It is a block diagram which shows one Example of the multichip module which concerns on this invention. It is sectional drawing of one Example of the land grid array type multichip module used for this invention. It is sectional drawing of one Example of the land grid array type multichip module used for this invention. It is sectional drawing of one Example of the land grid array type multichip module used for this invention. It is sectional drawing of one Example of the land grid array type multichip module used for this invention.

A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 6 are sectional views showing an embodiment for explaining a multichip module according to the present invention. 1 to 6, the configuration of the multichip module according to the present invention is shown in the form of an assembly flow. The multi-chip module of this embodiment is an application specific integrated circuit, that is, a microcomputer LSI (hereinafter simply referred to as an ASIC) including a CPU constituting an application specific IC, and is composed of two synchronous dynamic random modules. access memory, and a flash EEPROM (Synchronous Dynamic Random access memory, referred to simply as SDRAM or less) (Flash Electrically Erasable and Programm a ble Read only memory; hereinafter simply referred to as FLASH) is a stacked configuration.

  Although not particularly limited, the sizes of the semiconductor chips to be combined are 5.75 × 5.75 for ASIC 500, 6.84 × 6.80 for SDRAM 300 and 301, and 8.51 × 5.82 for FLASH 200. Is done. Each of the SDRAMs 300 and 301 has a storage capacity of about 128 Mbits, and the total of the two SDRAMs has a large storage capacity of 256 Mbits as described above. The FLASH 200 is configured to have a storage capacity such as 128 Mbits. Some SDRAMs have a storage capacity of 256 Mbits per chip, but the above two 128 Mbits are stacked so that the size of the other semiconductor chips 200 and 500 can be reduced. For example, they are mounted on a small mounting substrate 100 such as 13 × 13.

  In this embodiment, one semiconductor chip excluding the two SDRAMs 300 and 301, FLASH 200 in the embodiment of FIGS. 1 to 6, is mounted on the mounting substrate 100 as shown in FIG. That is, the Au bump 201 is formed on the pad of the FLASH 200 that is a bare chip, the anisotropic conductive film ACF is temporarily attached to the pad of the mounting substrate 100, and the FLASH 200 in the form of a bare chip in which the Au bump 201 is formed on the pad. It mounts on the mounting substrate 100, and thermocompression bonding is performed and imposition is carried out.

  As shown in FIG. 2, the SDRAM 300 is mounted back to back on the FLASH 200 (with the back surfaces of the chips facing each other). That is, the SDRAM 300 is bonded to the FLASH 200 back to back using a thermosetting adhesive or the die bond film 302 provided on the back surface, and connected to the corresponding electrode 101 of the mounting substrate 100 by the wire 303 by wire bonding. Then, a spacer 400 is provided in the chip central portion excluding the peripheral portion of the chip including the portion where the bonding pad for wire bonding of the SDRAM 300 is formed. The spacer 400 is not particularly limited, but is formed of a silicon substrate in order to make the thermal expansion coefficient uniform with the stacked structure semiconductor chip, and is bonded using a thermosetting adhesive or a die bond film 401 provided on the back surface. Is done.

  As shown in FIG. 3, the SDRAM 301 is mounted on the surface of the spacer 400. That is, the SDRAM 301 is bonded onto the spacer 400 using a thermosetting adhesive or a die bond film 304 provided on the back surface, and connected to the corresponding electrode of the mounting substrate 100 by the wire 305 by wire bonding. At this time, the die bond film 304 provided on the back surface side of the upper SDRAM 301 is also used to maintain electrical insulation even when the wire 303 provided on the lower SDRAM 300 contacts the back surface of the upper SDRAM 300. it can. Even when the thermosetting adhesive is used, it is desirable to provide the above-mentioned electrical insulation property by applying it to the entire back surface of the SDRAM 301 on the upper layer side.

As shown in FIG. 4, the ASIC 500 is mounted on the center portion of the chip excluding the peripheral portion of the chip including the portion where the bonding pads for wire bonding of the SDRAM 301 are formed. The ASIC 500 is bonded using a thermosetting adhesive or a die bond film 502 provided on the back surface. Then, it is connected by corresponding electrode and the wire 50 4 of the mounting substrate 100 by wire bonding. Against SDRAM300,301 As described above, because the size of the ASIC 500 is small, the wire 50 4 there is a possibility that inconvenience arises in contact with the periphery of the chip of SDRAM301 provided on the lower layer, ASIC 500 The terminal chip 501 is mounted on the right side of the SDRAM 301 using a thermosetting adhesive or a die bond film 503 provided on the back surface. As a result, the bonding pad provided on the right side of the ASIC 500 is connected to the bonding pad of the terminal chip 501 by the wire 505. A bonding pad is provided at the other end of the wiring having one end connected to the bonding pad of the terminal chip 501, and the bonding pad of the terminal chip 501 is connected to the corresponding electrode of the mounting substrate 100 by a wire 504.

  As shown in FIG. 5, the FLASH 200, SDRAM 300, 301, spacer 400, ASIC 50 and terminal chip 501, and bonding wires provided on them are sealed with a resin sealing body 600, as shown in FIG. A ball reflow as an external terminal 700 is performed on the back surface side of the mounting substrate 100 to form a multichip module.

  The FLASH 200 has a plurality of bump electrodes 201 that can be attached to the mounting substrate 100. The FLASH 200 is padded via an insulating film made of polyimide resin on a circuit forming surface of a semiconductor chip in which elements and wirings are completed, if necessary, that is, called an area array pad. A wiring that enables rearrangement of electrodes (bonding pads) is formed, and a pad electrode (land electrode for bump connection) is formed on the wiring.

  In the area array pad technology, pad electrodes arranged at a relatively small pitch such as several tens to 100 μm as external terminals in a semiconductor chip have a diameter of 0.1 mm to 0.2 mm. , And a pump electrode array having a relatively large pitch such as 400 μm to 600 μm. For this reason, the area array pad technology is effective for forming an imposition chip of a semiconductor chip in which a large number of pad electrodes are provided as in the ASIC 500.

  The mounting substrate 100 is electrically coupled to an insulating substrate made of glass epoxy or glass, relatively fine internal wiring having a multilayer wiring structure formed on the insulating substrate, and a bump electrode of a semiconductor chip. It has a plurality of lands to be done and a plurality of external terminals. In addition to the lands, the mounting substrate 100 is also provided with electrodes for wire connection with bonding pads provided in the SDRAMs 300 and 301 and the ASIC 500 on the main surface on the semiconductor chip mounting side.

  The FLASH 200 of this embodiment is called a so-called AND type and is not particularly limited, but does not have an independent address terminal. The address signal is serially input in a time division manner using the data terminal. That is, in the flash memory of this embodiment, a command, an address, and data for specifying an operation mode are also taken in via the data terminal I / O (7: 0). An input signal input via the input / output buffer is transmitted to a command decoder, an address counter, etc. through an internal signal line. For this reason, as shown in FIG. 7A, bump electrodes are arranged along two sides (short sides in this embodiment) of the semiconductor chip 200, and the imposition is performed.

  As shown in FIG. 7B, in the SDRAM, bonding pads are arranged along two sides (short sides in this embodiment) of a semiconductor chip, and wires are formed by corresponding electrodes of the mounting substrate 100, wires 303, and the like. Bonded. As shown in FIG. 7C, the ASIC 500 and the terminal chip 501 are bonded to the corresponding electrodes of the mounting substrate 100 radially by wires 503 or the like, with bonding pads arranged at the four peripheral portions thereof.

  In order to efficiently mount the four semiconductor chips 200, 300, 301, 500 on the mounting substrate 100, the stacked structure is used. In other words, an intermediate size FLASH 200 is applied to the mounting substrate 100, the SDRAM 300 is stacked back to back on the mounting substrate 100, the same SDRAM 301 is mounted thereon via a spacer, and the ASIC 500 is further stacked. To do. When viewed from the mounting substrate 100, the FLASH 200 and the ASIC 500 can be entirely mounted on the portion occupied by the SDRAM. As a result, a multichip module in which the above four semiconductor chips are mounted on a small mounting substrate such as 13 × 13 can be configured.

  FIG. 8 shows a cross-sectional view of one embodiment of a multichip module according to the present invention. This embodiment corresponds to the embodiment shown in FIGS. The SDRAMs 300 and 301 and the FLASH 200 are configured from existing semiconductor chips, whereas the microcomputer LSI (ASIC) 500 has a bonding pad arrangement corresponding to the SDRAMs 300 and 301 combined therewith. The microcomputer LSI (ASIC) 500 is configured as a specific application IC as described above.

  That is, the ASIC 500 includes so-called modules or macrocells as independent circuit function units so that each circuit block can be easily configured so that a plurality of circuit blocks centering on a CPU (central processing unit) are mounted. To be made. Each functional unit can be changed in its scale configuration. The setting of the ASIC 500 pad arrangement corresponding to the combination with the above-described memories SDRAM 300, 301 and FLASH 200 is performed in accordance with the layout design of the functional block corresponding to the combination of the functional units.

  FIG. 9 shows a cross-sectional view of another embodiment of the multichip module according to the present invention. In this embodiment, the ASIC 500 is mounted on the mounting substrate 100 in the same manner as in the above-described embodiment. In this case, when the size of the ASIC 500 is smaller than the SDRAMs 300 and 301 mounted thereon as in the above-described embodiment, a spacer 501 'is provided to stably mount the SDRAMs 300 and 301. That is, since the ASIC 500 is imprinted, the terminal chip 501 as shown in FIG. 8 is not necessary, and the spacer 501 ′ is provided instead.

  Generally, the number of terminals provided in the ASIC 500 is larger than that of the SDRAMs 300 and 301 and the FLASH 200. Therefore, by performing the surface mounting as described above, the number of bonding electrodes provided on the mounting substrate side is greatly reduced as compared with the case of being electrically connected by wire bonding as shown in FIG. The size can be reduced. Further, from the viewpoint of circuit operation performance, when a bonding wire formed relatively long is used in the signal transmission path of the microprocessor CPU that needs to perform high-speed signal transmission, the bonding wire is relatively large. The inductance component hinders the high-frequency clock and the signal transmission speed synchronized with the high-frequency clock. In this embodiment, the mounting board can be downsized as described above, and the circuit operation performance can be reduced. It will be advantageous.

  FIG. 10 is a block diagram showing an embodiment of a microcomputer LSI used in the present invention. Each circuit block shown in the figure is formed on a single substrate such as single crystal silicon by a known CMOS (complementary MOS) semiconductor integrated circuit manufacturing technique. Although the above-mentioned Mancon LSI is not particularly limited, the RISC (Reduced instruction set computer) type central processing unit CPU realizes high-performance arithmetic processing, integrates peripheral devices necessary for system configuration, and is intended for portable device applications. It has been. The central processing unit CPU has a RISC type instruction set, and the basic instruction performs pipeline processing and operates in one instruction and one state (one system clock cycle). With the central processing unit CPU and the data signal processor DSP as the center, the following peripheral circuits are mounted, for example, toward a mobile phone.

  The internal bus consists of an I bus, Y bus, X bus, L bus, and peripheral bus, and a memory XYMEM and memory controller XYCNT for image processing are provided as built-in peripheral modules so that a user system can be configured with the minimum number of parts. It is done. The memory XYMEM and the controller XYCNT are connected to the I bus, X, Y bus, and L bus, and perform data input / output for image processing and data output operation for display operation.

  The I bus includes a cache memory CACHE and a cache memory controller CCN, a memory management controller MMU, a translation lookaside buffer TLB, an interrupt controller INTC, a clock oscillator / watchdog timer CPG / WDT, a video I / O module VIO, and an external bus An interface is provided. The memory LSI is connected via the external bus interface.

  Connected to the L bus are the cache memory CACHE, cache memory controller CCN, memory management controller MMU, translation lookaside buffer TLB, the central processing unit CPU, data signal processor DSP, user break controller UBC, and advanced user debugger AUD. Is done.

The peripheral bus includes 16-bit timer unit TMU, compare match timer CMT, serial I / O (with FIFO) SIOF0, FIFO built-in serial communication interface SCIF1, I ² C controller I ² C, multi-function interface MFI, NAND / An AND flash interface FLCTL, a user debug interface H-UDI, an ASE memory ASERAM, a pin function controller PFC, and an RCLK operation watchdog timer RWDT are connected. A bus state controller BSC and a direct memory access controller DMAC are connected to the peripheral bus and the I bus.

  FIG. 11 is a block diagram showing an embodiment of the multichip module according to the present invention. In this figure, the electrical connection relationship between the microcomputer SH of FIG. 1 and the like, the memory SDRAM, and the flash memory FLASH is illustrated together with signal terminal names. In order to enable high performance and miniaturization while taking advantage of the features of the multichip module in which the microcomputer SH, the memory SDRAM, and the flash memory FLASH as shown in FIG. 11 are combined, signals are exchanged with each other. The computer SH and the memory SDRAM are connected to each other by an address bus (13 bits), a data bus (32 bits), and a control bus formed on the mounting board.

For example, the address bus includes 13 lines corresponding to the address terminals A0 to A12 of two SDRAM0 and SDRAM1, and the data bus includes 32 lines corresponding to the data terminals DQ0 to DQ31 of the two SDRAM0 and SDRAM1. In the microcomputer SH, address terminals A2 to A14 are connected to the address bus, and D0 to D31 are connected to the data bus.

  The microcomputer SH has control output terminals of CKIO, CKE, SC2B, CS3B, RASLB, CASLB, RD / WRB, WE3B / DQMUU, WE2B / DQMUL, and WE1B / DQMLU, WE0B / DQMLL corresponding to SDRAM, Each is connected to the CLK, CKE, CSB, RASB, CASB, WEB and DQM7, DQM5, DQM2, DQM0 of the SDRAM. In this case, two chips, SDRAM0 and SDRAM1, are mounted on the SDRAM. These two SDRAM0 and SDRAM1 are assigned two chip select signals SC2B and SC3B for forming the microcomputer SH, and one of them is selected by SC2B or SC3B. Therefore, SDRAM0 and SARM1 are all shared by other signal pins in parallel.

  In FIG. 11, each terminal name with “B” corresponds to a logical symbol having an active level at a low level in which “over” is added to the terminal name in the drawing. The terminals WE3B / DQMUU, WE2B / DQMUL, and WE1B / DQMLU, WE0B / DQMLL are maximum signals. The 32-bit data bus is divided into four groups of 8 bits each, and WE3B / DQMUU, WE2B / DQMUL, and WE1B / Write / read selective masking is performed by DQMLU and WE0B / DQMLL.

  The microcomputer SH of this embodiment has an interface corresponding to the flash memory FLASH. That is, the flash memory FLASH includes data terminals I / O (7: 0) and control signals WEB, SC, OEB, RDY / BusyB, and CEB. Correspondingly, the microcomputer SH is also provided with NA_IO (7: 0) and control signals NA_WEB, NA_SC, NA_OEB, NA_RYBY, and NA_CEB. Since the write / read operation between the microcomputer SH and the flash memory FLASH is slower than the operation speed with the SDRAM or the like, the bonding wire is a signal transmission path as in the embodiment of FIG. However, since there is no hindrance to the transmission speed, it is possible to reduce the size of the MCM while improving the overall performance.

  A land grid array (LGA) type multichip that uses gold (Au) / solder (Sn, etc.) bonding to connect the semiconductor chip and the mounting substrate, and does not have a ball-shaped protruding electrode on the back surface side of the mounting substrate. An example of a module is described next.

  As shown in FIG. 12, the MCM of the present embodiment has basically the same configuration as the multichip module MCM described in FIG. 1 to FIG. 6 or FIG. 9 described above, and the following configuration is different. . That is, the Au stud bump 1 is electrically and mechanically connected to the connection portion 4 of the mounting substrate 3 with the bonding material 2 interposed. In order to suppress damage of the semiconductor chip 5 caused by concentration of thermal stress due to the difference in thermal expansion coefficient between the mounting substrate 3 and the semiconductor chip 5 between the semiconductor chip 5 and the mounting substrate 3, Resin 6 is filled. Furthermore, on the back surface of the mounting substrate 3, for example, land electrodes 7 are formed as external terminals for electrical connection to a printed wiring board (PCB).

  In this embodiment, the ball-shaped protruding electrodes shown in FIGS. 1 to 6 and the like are not formed. Therefore, the module is excellent in miniaturization and thinning. Although not shown, a barrier layer such as Cr / Cu / Au may be formed on the surface of the land electrode 7. The mounting substrate 3 mainly covers a rigid substrate (core substrate) 8, flexible layers 9 and 10 formed on the opposite surfaces of the rigid substrate 8 by a build-up method, and covers the flexible layers 9 and 10. Thus, the protective film 11 or 12 is formed. The rigid substrate 8 and the flexible layers 9 and 10 are not shown in detail, but have, for example, a multilayer wiring structure. Each insulating layer of the rigid substrate 8 is formed of, for example, a high elastic resin substrate in which glass fiber is impregnated with an epoxy or polyimide resin, and each of the insulating layers of the flexible layers 9 and 10 is, for example, an epoxy low elastic resin. It is formed with.

  Each wiring layer of the multilayer wiring formed by the rigid substrate 8 and the flexible layers 9 and 10 is formed of a metal film made of, for example, copper (Cu). The protective films 11 and 12 are made of, for example, a polyimide resin. The protective film 11 is formed mainly for the purpose of protecting the wiring formed in the uppermost wiring layer of the flexible layer 9. For the semiconductor chip 5, securing and mounting of the adhesive force with the adhesive resin at the time of mounting is implemented. Control the spread of solder wetting at the time. The protective film 12 is formed mainly for the purpose of protecting the wiring formed in the uppermost wiring layer of the flexible layer 10, and controls the solder wetting and spreading at the time of solder mounting on the land electrode 7.

  Although not limited to this, the semiconductor chip 5 mainly includes a semiconductor substrate, a plurality of semiconductor elements formed on one main surface of the semiconductor substrate, and an insulating layer and a wiring layer on the one main surface of the semiconductor substrate. Each has a multilayer wiring layer in which a plurality of layers are stacked, and a surface protective film (final protective film) formed so as to cover the multilayer wiring layer. The semiconductor substrate is made of, for example, single crystal silicon, the insulating layer is made of, for example, a silicon oxide film, and the wiring layer is made of, for example, a metal film such as aluminum (Al) or an aluminum alloy. The surface protective film is formed of an insulating film such as silicon oxide or silicon nitride and an organic insulating film.

  A plurality of electrode pads 13 are formed on one main surface of the semiconductor chip 5 that faces each other and the other main surface (back surface). The plurality of electrode pads 13 are formed in the uppermost wiring layer of the multilayer wiring layers of the semiconductor chip 5 and are exposed by bonding openings formed in the surface protective film of the semiconductor chip 5. The plurality of electrode pads 13 are arranged along each side of the semiconductor chip 5. The planar shape of each of the plurality of electrode pads 13 is, for example, a square shape of 70 [μm] × 70 [μm]. Further, each of the plurality of electrode pads 13 is arranged with an arrangement pitch of, for example, about 85 [μm].

  On one main surface of the semiconductor chip 3, a stud bump 1 made of, for example, gold (Au) is disposed as a protruding electrode. The plurality of stud bumps 1 are respectively disposed on a plurality of electrode pads 13 disposed on one main surface of the semiconductor chip 5 and are electrically and mechanically connected. The stud bump 1 is formed by, for example, a ball bonding method using an Au wire and using ultrasonic vibration in combination with thermocompression bonding. In the ball bonding method, a ball is formed at the tip of the Au wire, and then the ball is thermocompression bonded to the electrode pad of the chip while applying ultrasonic vibration, and then the Au wire is cut from the ball portion to form a bump. It is a method to do. Accordingly, the stud bump formed on the electrode pad is firmly connected to the electrode pad.

  Hereinafter, manufacturing when the semiconductor chip such as the ASIC is mounted on the mounting substrate of the multichip module MCM will be described with reference to FIGS. 13 to 15 are principal part cross-sectional views for explaining the manufacture of the multichip module MCM. As shown in FIG. 13, the paste-like bonding material 2 is supplied onto the connection portion 4 arranged in the chip mounting region on one main surface of the mounting substrate 3 by, for example, a dispensing method. A solder paste material is used as the bonding material 2. As the solder paste material, a solder paste material in which at least fine solder particles and a flux are kneaded is used. In this embodiment, for example, a solder paste material in which solder particles of a 98 [wt%] Pb (lead) -2 [wt%] Sn (tin) composition having a melting point of about 300 ° C. are kneaded is used. The dispensing method is a method in which a solder paste material is projected from a thin nozzle and applied.

  Next, as shown in FIG. 14, the mounting substrate 3 is placed on the heat stage 14, and then the semiconductor chip 5 is transported by the collet 15 onto the chip mounting area so that the stud bump 1 is positioned on the connection portion 4. Thereafter, the mounting substrate 3 is heated by the heat stage 14 and the semiconductor chip 5 is heated by the collet 15 to melt the bonding material 2 as shown in FIG. 15, and then the molten bonding material 2 is solidified. . As a result, the semiconductor chip 3 is mounted on the chip mounting region on one main surface of the mounting substrate 3.

Then, as shown in FIG. 10, the underfill resin 6 is filled between the chip mounting region on one main surface of the mounting substrate 3 and the semiconductor chip 5. Thereafter, like the MCM shown in FIGS. 1 to 6, the SDRAM is stacked on the semiconductor chip 5 so that the back surfaces thereof face each other. Thereafter, the connection portion 4 between the electrode pad of the SDRAM and the mounting substrate 3 is formed. connected by bonderizing I Nguwaiya, further laminated FLASH200, connected by Bonde I Nguwaiya. Finally the four semiconductor chips SAIC, SDRAM, multichip module MCM by a FLASH and the Bonde I Nguwaiya sealed with resin is substantially complete.

  When mounting the LGA type MCM on the PCB, for example, a solder layer is previously formed on the PCB side connection electrode by printing or the like, and the land electrode formed on the back surface of the LGA type MCM is used for the PCB side connection. By aligning the electrodes and then performing solder reflow, the solder layers are connected to each other. Further, a thin solder layer may be formed in advance on the land electrode of the LGA type MCM by printing or the like.

  Although the invention made by the inventor has been specifically described based on the above embodiment, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. For example, two SDRAMs may be provided on the top. That is, ASIC and FLASH may be laminated on the lower side. In the embodiment of FIG. 9, the spacer 400 may be replaced with the FLASH 200. For example, when the electrodes of the FLASH 200 are formed on one side of a rectangular chip, a stacked structure may be used so that no SDRAM is mounted on that portion. However, the size of the SDRAM and FLASH chips must satisfy the above relationship.

  The present invention can be widely used for semiconductor devices constituting a multichip module.

DESCRIPTION OF SYMBOLS 100 ... Mounting substrate, 101 ... Electrode, 200 ... FLASH, 201 ... Au bump, 300, 301 ... SDRAM, 302, 304 ... Die bond film, 303, 305 ... Wire, 400 ... Spacer, 401 ... Die bond film, 500 ... ASIC, 501 ... Terminal chip, 501 '... Spacer, 502, 503 ... Die bond film 504, 505 ... Wire, 600 ... Resin sealing body, 700 ... Ball,
CPU ... Central processing unit, DSP ... Data signal processor DSP, XYMEM ... Memory, XYCNT ... Memory controller, CACHE ... Cush memory, CCN ... Cache memory controller, MMU ... Memory management controller, TLB ... Translation lookaside buffer, INTC ... Interrupt Controller, CPG / WDT ... Clock oscillator / Watchdog timer, VIO ... Video I / O module, UBC ... User break controller, AUD ... Advanced user debugger, TMU ... Timer unit, CMT ... Compare match timer, SIOF0 ... Serial I / O (with FIFO), SCIF1 ... FIFO built-in serial communication interface, I ² C ... I ² C controller, MF ... Multifunctional interface, FLCTL ... NAND / AND flash interface, H-UDI ... User debug interface, ASERAM ... ASE memory, PFC ... Memory pin function controller, RWDT ... RCLK operation watchdog timer, BSC ... Bus state controller, DMAC ... Direct Memory access controller.
DESCRIPTION OF SYMBOLS 1 ... Au stud bump, 2 ... Bonding material, 3 ... Mounting board, 4 ... Connection part, 5 ... Semiconductor chip, 6 ... Underfill resin, 7 ... Land electrode, 8 ... Rigid board | substrate, 9, 10 ... Flexible layer, 11 , 12 ... Protective film, 13 ... Electrode pad, 14 ... Heat stage.

Claims (5)

A mounting substrate having a surface, a plurality of electrodes formed on the surface, and a back surface opposite to the surface;
First main surface, said plurality of first pads formed on the first main surface, and the first chip to have a first back surface opposite the top layer from the first major surface, wherein said mounting substrate A plurality of chips having a laminated structure mounted on the surface;
A second main surface, a plurality of second pads formed on the second main surface, and a second back surface opposite to the second main surface, wherein the second back surface faces the first chip. A second chip mounted on the first chip,
A third main surface, a plurality of third pads formed on the third main surface, and a third back surface opposite to the third main surface; and the third back surface adjacent to the second chip. A third chip mounted on the first chip so as to face the first chip;
A plurality of chips including the first chip, a second chip , a resin sealing body for sealing the third chip;
A plurality of external terminals formed on the back surface of the mounting substrate;
Including
The planar shape of the first main surface of the first chip consists of a rectangular shape having a first side and a second side opposite to the first side,
The size of the second chip is smaller than the size of the first chip,
The second chip is arranged closer to the first side of the first chip than the third chip,
The third chip is arranged closer to the second side of the first chip than the second chip,
The plurality of electrodes of the mounting substrate include a first electrode formed on the first side of the first chip and a second electrode formed on the second side of the first chip. And
The plurality of second pads of the second chip include a first side pad disposed on the first side of the first chip and a second side disposed on the second side of the first chip. A side pad,
The first side pad of the second chip is electrically connected to the first electrode of the mounting substrate via the first wire without passing through the third chip ,
The multi-chip module, wherein the second side pad of the second chip is electrically connected to the second electrode of the mounting substrate via a second wire and the third chip. In claim 1,
The first chip is mounted on the front surface of the mounting base so that the first back surface faces the front surface of the mounting substrate.
The multi-chip module, wherein the plurality of first pads of the first chip are electrically connected to the plurality of electrodes of the mounting substrate via a plurality of third wires, respectively. In claim 1,
The first chip is a memory chip;
The multi-chip module, wherein the second chip is a microcomputer chip that controls the first chip. In claim 3,
The multichip module, wherein the third chip is a terminal chip. In claim 1,
The size of the third chip is smaller than the size of the first chip.

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