JP5073104B2 - 流路部材およびこれを用いた熱交換器ならびに電子部品装置 - Google Patents
流路部材およびこれを用いた熱交換器ならびに電子部品装置 Download PDFInfo
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- JP5073104B2 JP5073104B2 JP2011543023A JP2011543023A JP5073104B2 JP 5073104 B2 JP5073104 B2 JP 5073104B2 JP 2011543023 A JP2011543023 A JP 2011543023A JP 2011543023 A JP2011543023 A JP 2011543023A JP 5073104 B2 JP5073104 B2 JP 5073104B2
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- flow path
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
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- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 6
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- 238000005219 brazing Methods 0.000 description 5
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- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 4
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L9/00—Rigid pipes
- F16L9/003—Rigid pipes with a rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
流路3となる貫通孔を形成するときに発生するバリを隙間4中で吸収し接合部1dに挟み込むことがないから接合不良の発生を抑制できることが分かる。
1a:蓋体部
1b:底板部
1c:側壁部
1d:接合部
1e:面取り
1f:バリ
1g:端面
3:流路
4:隙間
4a:隙間の奥行き
4b:隙間の最大高さ
5:金属板
6:電子部品
7,8:加工したセラミックグリーンシート
7b’,8b’:端面
7c’,8c’:面取り
20:熱交換器
30:電子部品装置
Claims (8)
- 蓋体部と側壁部と底板部とで構成され、内部に流体を流すための流路を有し、前記側壁部は、前記流路を形成するための孔を有する板状体を複数備えてなる積層体であって、該積層体を構成する各板状体の間および前記蓋体部と前記側壁部との間に、前記側壁部の前記流路側の端面に沿って、前記流路につながる隙間を有することを特徴とする流路部材。
- 前記流体が流れる方向に対して直交するように断面視したとき、前記隙間が矩形状,台形状または三角形状であることを特徴とする請求項1に記載の流路部材。
- 前記流体が流れる方向に対して直交するように断面視したとき、前記隙間は、前記流路側から前記側壁部側に延びる方向に向かって、上下に開口する方向の高さが低くなることを特徴とする請求項1に記載の流路部材。
- 前記流体が流れる方向に対して直交するように断面視したとき、前記隙間は、前記流路側から前記側壁部側に延びる方向の奥行きをaとし、上下に開口する方向の最大高さをbとしたとき、a>bの関係であることを特徴とする請求項1乃至請求項3のいずれかに記載の流路部材。
- 前記奥行きが0.03mm以上0.08mm以下であることを特徴とする請求項4に記載の流路部材。
- 前記隙間は、前記板状体の孔の端面の一部に設けられた面取り部と、該面取り部と対向するように設けられた他の前記板状体または前記蓋体部とによって形成されていることを特徴とする請求項1乃至請求項5のいずれかに記載の流路部材。
- 請求項1乃至請求項6のいずれかに記載の流路部材の前記蓋体部の外面に、金属板を設けてなることを特徴とする熱交換器。
- 請求項7に記載の熱交換器の前記金属板上に電子部品を搭載してなることを特徴とする電子部品装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011543023A JP5073104B2 (ja) | 2010-06-09 | 2011-06-09 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010132103 | 2010-06-09 | ||
JP2010132103 | 2010-06-09 | ||
PCT/JP2011/063250 WO2011155562A1 (ja) | 2010-06-09 | 2011-06-09 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
JP2011543023A JP5073104B2 (ja) | 2010-06-09 | 2011-06-09 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012097816A Division JP5502133B2 (ja) | 2010-06-09 | 2012-04-23 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5073104B2 true JP5073104B2 (ja) | 2012-11-14 |
JPWO2011155562A1 JPWO2011155562A1 (ja) | 2013-08-01 |
Family
ID=45098166
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011543023A Active JP5073104B2 (ja) | 2010-06-09 | 2011-06-09 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
JP2012097816A Active JP5502133B2 (ja) | 2010-06-09 | 2012-04-23 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012097816A Active JP5502133B2 (ja) | 2010-06-09 | 2012-04-23 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130088837A1 (ja) |
EP (1) | EP2582213B1 (ja) |
JP (2) | JP5073104B2 (ja) |
KR (1) | KR101503824B1 (ja) |
CN (1) | CN102934528B (ja) |
WO (1) | WO2011155562A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012165006A (ja) * | 2010-06-09 | 2012-08-30 | Kyocera Corp | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6005930B2 (ja) * | 2011-07-28 | 2016-10-12 | 京セラ株式会社 | 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置 |
US20130308273A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Laser sintered matching set radiators |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
JP6154248B2 (ja) * | 2012-08-24 | 2017-06-28 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP6290635B2 (ja) * | 2014-01-23 | 2018-03-07 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP2017044363A (ja) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | 流路部材 |
JP6909126B2 (ja) * | 2017-10-13 | 2021-07-28 | 京セラ株式会社 | 半導体装置の製造方法 |
CN109819603B (zh) * | 2017-11-20 | 2022-05-27 | Tvs电机股份有限公司 | 用于机动车辆的主控制单元组件 |
CN108036668B (zh) * | 2017-12-07 | 2024-03-15 | 程向锋 | 换热管、包括它的换热器和换热管的制造方法 |
JP7087715B2 (ja) * | 2018-06-21 | 2022-06-21 | 株式会社デンソー | 電力変換装置及び冷却システム |
JP7238635B2 (ja) * | 2019-06-27 | 2023-03-14 | 株式会社デンソー | 電力変換装置及び冷却システム |
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2011
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Patent Citations (3)
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JPH02306097A (ja) * | 1989-05-19 | 1990-12-19 | Nhk Spring Co Ltd | ヒートシンク |
JP2006329439A (ja) * | 2005-05-23 | 2006-12-07 | Furukawa Sky Kk | コールドプレート |
JP2009024933A (ja) * | 2007-07-19 | 2009-02-05 | Sony Corp | 熱拡散装置及びその製造方法 |
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JP2012165006A (ja) * | 2010-06-09 | 2012-08-30 | Kyocera Corp | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Also Published As
Publication number | Publication date |
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EP2582213A1 (en) | 2013-04-17 |
US20130088837A1 (en) | 2013-04-11 |
WO2011155562A1 (ja) | 2011-12-15 |
CN102934528B (zh) | 2015-07-01 |
EP2582213B1 (en) | 2021-01-20 |
JPWO2011155562A1 (ja) | 2013-08-01 |
JP5502133B2 (ja) | 2014-05-28 |
EP2582213A4 (en) | 2014-01-15 |
KR20130036244A (ko) | 2013-04-11 |
CN102934528A (zh) | 2013-02-13 |
KR101503824B1 (ko) | 2015-03-18 |
JP2012165006A (ja) | 2012-08-30 |
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