JP5067399B2 - Manufacturing method of electronic device - Google Patents

Manufacturing method of electronic device Download PDF

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JP5067399B2
JP5067399B2 JP2009148341A JP2009148341A JP5067399B2 JP 5067399 B2 JP5067399 B2 JP 5067399B2 JP 2009148341 A JP2009148341 A JP 2009148341A JP 2009148341 A JP2009148341 A JP 2009148341A JP 5067399 B2 JP5067399 B2 JP 5067399B2
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component
tape member
cutting
plate
substrate
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JP2011009257A (en
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宣正 半田
伸 早坂
典久 今泉
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Description

本発明は、基板の一面に電子部品を搭載してなる電子装置の製造方法であって、一面に複数の基板形成領域を有する板材の各基板形成領域に電子部品を搭載した後、基板形成領域毎に板材を切断して基板単位に個片化する製造方法に関する。   The present invention relates to a method of manufacturing an electronic device in which an electronic component is mounted on one surface of a substrate, and the electronic component is mounted on each substrate forming region of a plate having a plurality of substrate forming regions on one surface, and then the substrate forming region The present invention relates to a manufacturing method in which a plate material is cut into individual pieces for each substrate.

従来より、基板の両板面の一面に電子部品を搭載してなる電子装置を製造する製造方法としては、基板が形成される基板形成領域を一面に複数個有し、各々の基板形成領域の外周に位置する切断部にて切断されるようになっている板材を用意し、各々の基板形成領域に電子部品を搭載した後、切断部にて板材を切断することにより、個片化された基板を形成する方法が一般的である（たとえば、特許文献１〜４参照）。   Conventionally, as a manufacturing method for manufacturing an electronic device in which electronic components are mounted on one surface of both plate surfaces of a substrate, a plurality of substrate forming regions on which a substrate is formed are provided on one surface. After preparing a plate material that is to be cut at the cutting portion located on the outer periphery, and mounting electronic components on each substrate forming region, the plate material was cut into pieces by cutting the plate material at the cutting portion A method of forming a substrate is common (see, for example, Patent Documents 1 to 4).

ここで、従来では、一般的な板材の切断方法としてルーター加工やダイシング加工がある。たとえば、ルーター加工は、ＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）などのプリント基板を用いたＩＣパッケージを分割する方法として採用される。しかし、ルーター加工では、大量の切削屑が発生するし、また、ダイシング加工では、水で切削屑を洗い流すようにしているものの、完全に異物を防ぐことはできない。   Here, conventionally, there are router processing and dicing processing as a general cutting method of a plate material. For example, the router processing is adopted as a method of dividing an IC package using a printed circuit board such as BGA (Ball Grid Array). However, in the router processing, a large amount of cutting waste is generated, and in the dicing processing, the cutting waste is washed away with water, but the foreign matter cannot be completely prevented.

そこで、上記特許文献１〜４などに記載されているように、従来では、電子部品が搭載されている板材の一面および当該電子部品を被覆するように、テープ部材を板材の一面に貼り付け、この状態で、切断部に沿って板材を切断するようにしている。この方法によれば、切削屑や異物が基板や電子部品に付着するのを防止できる。   Therefore, as described in Patent Documents 1 to 4 and the like, conventionally, a tape member is attached to one surface of the plate material so as to cover the one surface of the plate material on which the electronic component is mounted and the electronic component, In this state, the plate material is cut along the cutting portion. According to this method, it is possible to prevent cutting waste and foreign matter from adhering to the substrate and the electronic component.

しかし、この場合、基板の一面に搭載された電子部品にもテープ部材が貼り付く形となるため、テープ部材との接着または接触が問題となるような電子部品、たとえばワイヤボンディング用のベアチップなどが搭載されている場合には、単純にはテープ部材を貼り付けることは困難である。   However, in this case, since the tape member is also attached to the electronic component mounted on one surface of the substrate, an electronic component such as a bare chip for wire bonding that causes a problem of adhesion or contact with the tape member is present. If it is mounted, it is difficult to simply attach the tape member.

一方で、従来では、特許文献５に記載されているように、シリコン基板に対し、四方向に突起を設け、その突起にテープ部材を貼り付けることで、基板上のアクチュエータ素子や電極などとテープ部材とを接触させずに保護しながら、ダイシングを行うようにした方法が提案されている。   On the other hand, conventionally, as described in Patent Document 5, by providing protrusions in four directions on a silicon substrate and attaching a tape member to the protrusions, the actuator elements and electrodes on the substrate and the tape A method has been proposed in which dicing is performed while protecting the member without contacting it.

特開２００７−２３５００８号公報JP 2007-235008 A 特開２００２−３２４８１５号公報JP 2002-324815 A 特許第４１７３７７８号公報Japanese Patent No. 4173778 特開２００６−２６１５６８号公報JP 2006-261568 A 特開２００５−２７７３６５号公報JP 2005-277365 A

しかし、上記特許文献５の方法を適用する場合、基板に対しては必要な回路部とは別に、上記突起を設ける必要があり、コストアップとなる。さらに、基板がプリント基板のような反りの影響を受けやすいものであると、突起とテープ部材との貼り付け性が悪化し、結果、貼り付け界面に隙間が生じ、保護できなくなるおそれがある。   However, when the method of Patent Document 5 is applied, it is necessary to provide the protrusion separately from the necessary circuit portion on the substrate, resulting in an increase in cost. Furthermore, if the substrate is susceptible to warping as in a printed circuit board, the sticking property between the protrusion and the tape member deteriorates, and as a result, there is a possibility that a gap is formed at the sticking interface and protection cannot be performed.

本発明は、上記問題に鑑みてなされたものであり、基板となる板材の一面に突起を設けることなく、電子部品とテープ部材とを離した状態で電子部品をテープ部材で被覆し、板材の切断を行えるようにすることを目的とする。   The present invention has been made in view of the above problems, and without providing a protrusion on one surface of a plate material to be a substrate, the electronic component and the tape member are covered with the tape member in a state where the electronic component and the tape member are separated from each other. The purpose is to enable cutting.

上記目的を達成するため、請求項１に記載の発明においては、以下のような工程を有する電子装置の製造方法が提供される。   In order to achieve the above object, according to the first aspect of the present invention, there is provided an electronic device manufacturing method having the following steps.

・基板（１０）が形成される基板形成領域（１１０）を一面に複数個有し、各々の基板形成領域（１１０）の外周に位置する切断部（１２０）にて切断されるようになっている板材（１００）を用意し、電子部品（２１、２２）の搭載工程では、電子部品として第１の部品（２１）と当該搭載後の高さが第１の部品（２１）よりも高い第２の部品（２２）とを、互いに隣り合うように、各々の基板形成領域（１１０）について搭載すること。   A plurality of substrate forming regions (110) on which the substrate (10) is formed are provided on one side, and are cut at a cutting portion (120) positioned on the outer periphery of each substrate forming region (110). In the mounting process of the electronic components (21, 22), the first component (21) as the electronic component and the height after the mounting are higher than those of the first component (21). Two components (22) are mounted on each substrate forming region (110) so as to be adjacent to each other.

・テープ部材（２００）の貼り付け工程では、テープ部材（２００）を切断部（１２０）に貼り付けて、テープ部材（２００）のうち切断部（１２０）に貼り付いている部位の内周に位置する各々の基板形成領域（１１０）および電子部品（２１、２２）をテープ部材（２００）で被覆して封止すること。   In the step of attaching the tape member (200), the tape member (200) is attached to the cut portion (120), and the tape member (200) is attached to the inner periphery of the portion attached to the cut portion (120). Each substrate forming region (110) and electronic component (21, 22) positioned are covered with a tape member (200) and sealed.

・それとともに、テープ部材（２００）の貼り付け工程では、テープ部材（２００）で被覆されている各々の基板形成領域（１１０）においては、さらにテープ部材（２００）を第２の部品（２２）に貼り付けて第２の部品（２２）に支持させ、第２の部品（２２）の周囲にてテープ部材（２００）と板材（１００）の一面とが離れた空間を形成することにより、第２の部品（２２）に隣り合う第１の部品（２１）を当該空間に位置させて、当該第１の部品（２１）がテープ部材（２００）とは非接触の状態でテープ部材（２００）に被覆されるようにすること。   At the same time, in the step of attaching the tape member (200), in each substrate forming region (110) covered with the tape member (200), the tape member (200) is further replaced with the second component (22). And the second component (22) is supported, and a space in which the tape member (200) and one surface of the plate member (100) are separated is formed around the second component (22). The first component (21) adjacent to the second component (22) is positioned in the space, and the tape component (200) is in a state where the first component (21) is not in contact with the tape member (200). To be covered.

・板材（１００）の切断は、板材（１００）におけるテープ部材（２００）が貼り付いている一面とは反対側の他面側から切り込んでいくことにより行うこと。本製造方法はこれらの点を特徴としている。   The cutting of the plate material (100) is performed by cutting from the other surface side of the plate material (100) opposite to the one surface to which the tape member (200) is attached. This manufacturing method is characterized by these points.

それによれば、第２の部品（２２）として、第１の部品（２１）よりも背が高く且つテープ部材（２００）と貼り付いても問題ないものを用いることで、基板（１０）となる板材（１００）の一面に上記従来のような突起を設けることなく、電子部品としての第１の部品（２１）とテープ部材（２００）とを離した状態で第１の部品（２１）をテープ部材（２００）で被覆し、板材（１００）の切断を行うことができる。   According to this, the substrate (10) is obtained by using a second component (22) that is taller than the first component (21) and can be attached to the tape member (200) without any problem. The first component (21) is taped in a state in which the first component (21) as the electronic component and the tape member (200) are separated from each other without providing the conventional projection on one surface of the plate member (100). The plate (100) can be cut by covering with the member (200).

また、板材（１００）をテープ部材（２００）側から切り込んでいくと、切断部（１２０）にて先にテープ部材（２００）が切断され、その後、板材（１００）の切断へ移行するので、板材（１００）の切断完了前に、切断部（１２０）に貼り付いているテープ部材（２００）の部分が剥がれ、そこから水分等が侵入する可能性があるが、本発明のように、板材（１００）の切断を、板材（１００）におけるテープ部材（２００）が貼り付いている一面とは反対側の他面側から行えば、そのような問題を回避できる。   Further, when the plate member (100) is cut from the tape member (200) side, the tape member (200) is cut first at the cutting portion (120), and then the plate member (100) is shifted to cutting. Before the cutting of the plate material (100) is completed, the tape member (200) attached to the cutting portion (120) may be peeled off, and moisture or the like may enter from there, but as in the present invention, the plate material Such a problem can be avoided by cutting (100) from the other side of the plate member (100) opposite to the one side to which the tape member (200) is attached.

また、請求項２に記載の発明によれば、請求項１に記載の電子装置の製造方法において、第１の部品（２１）はワイヤボンディングにより基板形成領域（１１０）に接続されるものであり、第１の部品（２１）と第２の部品（２２）とを、基板形成領域（１１０）におけるワイヤボンディングされる部位を挟んで隣り合うように搭載することを特徴としている。   According to a second aspect of the present invention, in the electronic device manufacturing method according to the first aspect, the first component (21) is connected to the substrate forming region (110) by wire bonding. The first component (21) and the second component (22) are mounted so as to be adjacent to each other with a portion to be wire-bonded in the substrate forming region (110).

それによれば、基板形成領域（１１０）におけるワイヤボンディングされる部位を、テープ部材（２００）とは非接触の状態でテープ部材（２００）により被覆・保護することができる。   According to this, the portion to be wire-bonded in the substrate forming region (110) can be covered and protected by the tape member (200) in a non-contact state with the tape member (200).

さらに、請求項３に記載の発明では、請求項２に記載の電子装置の製造方法において、第２の部品（２２）として、その搭載後の高さが、第１の部品（２１）にワイヤボンディングを行って形成されるワイヤ（３０）よりも高いものを用い、電子部品（２１、２２）の搭載工程では、第１の部品（２１）および第２の部品（２２）の搭載を行うとともに、第１の部品（２１）にワイヤボンディングを行うことを特徴としている。   Further, according to the invention described in claim 3, in the method of manufacturing the electronic device according to claim 2, the height after mounting as the second component (22) is a wire to the first component (21). In the mounting process of the electronic components (21, 22), the first component (21) and the second component (22) are mounted in a mounting process using a wire higher than the wire (30) formed by bonding. The first component (21) is wire-bonded.

それによれば、第１の部品（２１）にワイヤボンディングを行った後に、テープ部材（２００）の貼り付けを行ったとき、このテープ部材（２００）とワイヤ（３０）とを非接触とすることができる。   According to this, when the tape member (200) is attached after the wire bonding to the first component (21), the tape member (200) and the wire (30) are not in contact with each other. Can do.

また、請求項４に記載の発明では、請求項１〜請求項３に記載の電子装置の製造方法において、テープ部材（２００）の貼り付け工程では、切断部（１２０）に対応する位置に突起（３１０）を有する治具（３００）を用い、突起（３１０）と切断部（１２０）とを位置合わせしつつ、板材（１００）の一面と治具（３００）とをテープ部材（２００）を介して対向させ、テープ部材（２００）を当該テープ部材（２００）の平面方向に弛まないように引っ張りながら、テープ部材（２００）に対して、治具（３００）における突起（３１０）以外の部位を非接触としつつ突起（３１０）を接触させた状態で、突起（３１０）にてテープ部材（２００）を切断部（１２０）に押し付けることにより、テープ部材（２００）を、切断部（１２０）および第２の部品（２２）に貼り付けることを特徴としている。   According to a fourth aspect of the present invention, in the electronic device manufacturing method according to the first to third aspects, the tape member (200) is attached at a position corresponding to the cut portion (120) in the step of attaching the tape member (200). Using the jig (300) having (310), aligning the projection (310) and the cutting part (120), and bonding the one surface of the plate (100) and the jig (300) to the tape member (200). The portion other than the projection (310) in the jig (300) with respect to the tape member (200) while pulling the tape member (200) so as not to loosen in the planar direction of the tape member (200). The tape member (200) is pressed against the cutting part (120) with the protrusion (310) in a state where the protrusion (310) is in contact with the tape member (200) in a non-contact state, thereby the tape member (200) is pressed into the cutting part (120 And it is characterized by pasting the second part (22).

それによれば、テープ部材（２００）をその平面方向に弛まないように引っ張りながら、治具（３００）の突起（３１０）にて切断部（１２０）に押し付け、当該切断部（１２０）および第２の部品（２２）に貼り付けるため、切断部（１２０）の内周の基板形成領域（１１０）のうち第２の部品（２２）以外の部位にて、テープ部材（２００）は弛み無く張られ、テープ部材（２００）と板材（１００）の一面とが離れた空間が適切に形成される。   According to this, while pulling the tape member (200) so as not to loosen in the plane direction, the tape member (200) is pressed against the cutting part (120) by the protrusion (310) of the jig (300), and the cutting part (120) and the second part are pressed. The tape member (200) is stretched without slack in a portion other than the second component (22) in the substrate forming region (110) on the inner periphery of the cutting portion (120). A space in which the tape member (200) and one surface of the plate member (100) are separated is appropriately formed.

また、テープ部材（２００）は治具（３００）の突起（３１０）で板材（１００）に押し付けられるので、テープ部材（２００）の貼り付け後に板材（１００）の切断を行うときには、この治具（３００）を、板材（１００）を支持する支持部材として用いることができる。その結果、工程の簡略化などが図れる。   Further, since the tape member (200) is pressed against the plate (100) by the projection (310) of the jig (300), this jig is used when cutting the plate (100) after the tape member (200) is attached. (300) can be used as a support member that supports the plate (100). As a result, the process can be simplified.

なお、特許請求の範囲およびこの欄で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。   In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

（ａ）は、本発明の第１実施形態に係る電子装置の概略平面図であり、（ｂ）は同電子装置の概略断面図である。(A) is a schematic plan view of the electronic device which concerns on 1st Embodiment of this invention, (b) is a schematic sectional drawing of the electronic device. 第１実施形態に係る電子装置の製造方法に用いられる板材の一面を示す概略平面図である。It is a schematic plan view which shows one surface of the board | plate material used for the manufacturing method of the electronic device which concerns on 1st Embodiment. 第１実施形態に係る電子装置の製造方法におけるテープ部材の貼り付け工程を示す概略断面図である。It is a schematic sectional drawing which shows the sticking process of the tape member in the manufacturing method of the electronic device which concerns on 1st Embodiment. 第１実施形態に係る電子装置の製造方法における切断工程を示す概略断面図である。It is a schematic sectional drawing which shows the cutting process in the manufacturing method of the electronic device which concerns on 1st Embodiment. 第１実施形態の製造方法におけるテープ部材の貼り付け方法の他の例を示す概略断面図である。It is a schematic sectional drawing which shows the other example of the sticking method of the tape member in the manufacturing method of 1st Embodiment. 本発明の第２実施形態に係るテープ部材貼り付け後の板材１００の種々の例を示す概略断面図である。It is a schematic sectional drawing which shows the various examples of the board | plate material 100 after the tape member bonding which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は個片化された基板の概略平面図、（ｂ）はテープ部材貼り付け後の板材を示す概略断面図である。It is a figure which shows the principal part of the manufacturing method of the electronic device which concerns on 3rd Embodiment of this invention, (a) is a schematic plan view of the board | substrate separated into pieces, (b) is the board | plate material after tape member bonding. It is a schematic sectional drawing shown. 本発明の第４実施形態に係る個片化された基板の種々の例を示す概略断面図である。It is a schematic sectional drawing which shows the various examples of the board | substrate separated into pieces concerning 4th Embodiment of this invention. 本発明の第５実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は個片化された基板の概略平面図、（ｂ）はテープ部材貼り付け後の板材を示す概略断面図である。It is a figure which shows the principal part of the manufacturing method of the electronic device which concerns on 5th Embodiment of this invention, (a) is a schematic plan view of the board | substrate separated into pieces, (b) is the board | plate material after tape member bonding. It is a schematic sectional drawing shown. 本発明の第６実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は個片化された基板の概略平面図、（ｂ）はテープ部材貼り付け後の板材を示す概略断面図である。It is a figure which shows the principal part of the manufacturing method of the electronic device which concerns on 6th Embodiment of this invention, (a) is a schematic plan view of the board | substrate separated into pieces, (b) is the board | plate material after tape member bonding. It is a schematic sectional drawing shown. 第６実施形態に係る電子装置の製造方法の他の例を示す図であり、（ａ）は個片化された基板の概略平面図、（ｂ）はテープ部材貼り付け後の板材を示す概略断面図である。It is a figure which shows the other example of the manufacturing method of the electronic device which concerns on 6th Embodiment, (a) is a schematic plan view of the board | substrate separated into pieces, (b) is a schematic which shows the board | plate material after tape member bonding. It is sectional drawing. （ａ）は本発明の第７実施形態に係る電子装置の製造方法における切断工程を示す概略断面図であり、（ｂ）は（ａ）中のＡ部の拡大図である。(A) is a schematic sectional drawing which shows the cutting process in the manufacturing method of the electronic device which concerns on 7th Embodiment of this invention, (b) is an enlarged view of the A section in (a). 本発明の第８実施形態に係る電子装置の製造方法における切断工程を示す概略断面図である。It is a schematic sectional drawing which shows the cutting process in the manufacturing method of the electronic device which concerns on 8th Embodiment of this invention.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、説明の簡略化を図るべく、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

（第１実施形態）
図１（ａ）は、本発明の第１実施形態に係る電子装置１の概略平面構成を示す図であり、図１（ｂ）は同電子装置１の概略断面構成を示す図である。本実施形態の電子装置１は、大きくは基板１０の両板面のうちの一面に電子部品２１、２２を搭載してなるものである。 (First embodiment)
FIG. 1A is a diagram showing a schematic plan configuration of the electronic device 1 according to the first embodiment of the present invention, and FIG. 1B is a diagram showing a schematic cross-sectional configuration of the electronic device 1. The electronic device 1 of the present embodiment is broadly formed by mounting electronic components 21 and 22 on one surface of both plate surfaces of the substrate 10.

基板１０は、後述するように複数個の基板が一体に連なった多連の板材２００を個々の基板１０単位に切断して形成されるものである。このような基板１０として、本実施形態では、プリント基板１０を採用している。なお、プリント基板１０としては、単層基板でもよいし、多層基板であってもよい。   As will be described later, the substrate 10 is formed by cutting a plurality of plate members 200 in which a plurality of substrates are integrally connected into individual substrates 10. As such a board | substrate 10, the printed circuit board 10 is employ | adopted in this embodiment. The printed circuit board 10 may be a single layer board or a multilayer board.

電子部品２１、２２は、プリント基板１０の一面に搭載され、はんだや導電性接着剤などのダイボンド材、あるいはワイヤボンディングなどの一般的な接続方法を用いて、プリント基板１０と電気的および機械的に接続されている。   The electronic components 21 and 22 are mounted on one surface of the printed circuit board 10 and are electrically and mechanically connected to the printed circuit board 10 by using a general bonding method such as die bonding material such as solder or conductive adhesive or wire bonding. It is connected to the.

図示しないが、プリント基板１０の一面には、電子部品２１、２２が搭載されるランドやワイヤボンディングなどにより電気的接続を行うためのパッドなどが必要に応じて設けられている。   Although not shown in the drawing, on one surface of the printed circuit board 10, a land on which the electronic components 21 and 22 are mounted, a pad for electrical connection by wire bonding or the like is provided as necessary.

本実施形態では、この電子部品２１、２２として、背の高さが互いに異なる第１の部品２１および第２の部品２２が搭載されている。ここで、背の高さとは、プリント基板１０の一面上の電子部品２１、２２の高さであり、当該一面から部品先端部までの距離である。背の低い方が第１の部品２１であり、第１の部品２１よりも背の高い方が第２の部品２２である。   In the present embodiment, the first component 21 and the second component 22 having different heights are mounted as the electronic components 21 and 22. Here, the height of the back is the height of the electronic components 21 and 22 on one surface of the printed circuit board 10, and is the distance from the one surface to the tip of the component. The shorter one is the first component 21, and the shorter one is the second component 22 than the first component 21.

第１の部品２１は典型的には能動素子である。この能動素子としての第１の部品２１は、その能動面がプリント基板１０の一面とは反対側となるようにプリント基板１０の一面に搭載された、すなわち、能動面を上面として搭載されたものである。このような能動素子としては、具体的には一般的な半導体プロセスなどにより形成された半導体チップよりなるＩＣ素子やトランジスタ素子などが挙げられる。   The first component 21 is typically an active device. The first component 21 as the active element is mounted on one surface of the printed circuit board 10 so that its active surface is opposite to the one surface of the printed circuit board 10, that is, mounted with the active surface as the upper surface. It is. Specific examples of such an active element include an IC element and a transistor element made of a semiconductor chip formed by a general semiconductor process.

その他、第１の部品２１としては、ＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍｓ）により形成された加速度センサなどのセンサチップなどであってもよい。そして、これら能動素子やセンサチップなどは、典型的には、はんだや接着剤によりプリント基板１０に接合され、その上面とプリント基板１０の一面との間でワイヤボンディングすることにより実装される。   In addition, the first component 21 may be a sensor chip such as an acceleration sensor formed by MEMS (Micro Electro Mechanical Systems). These active elements, sensor chips, and the like are typically mounted by bonding to the printed circuit board 10 with solder or an adhesive, and wire bonding between the upper surface and one surface of the printed circuit board 10.

また、この第１の部品２１は、後述するテープ部材２００（後述の図３等参照）の貼り付けが禁止されているものである。これは、もし、当該テープ部材２００が第１の部品２１に貼り付いた場合、当該テープ部材２００の粘着剤の付着等により、第１の部品２１におけるワイヤ接続部が汚染されたり、能動面あるいはセンサチップの可動部の特性低下などが引き起こされたりするなどの不具合が生じるためである。   Further, the first component 21 is prohibited from being attached with a tape member 200 (see FIG. 3 and the like described later). This is because if the tape member 200 is attached to the first component 21, the wire connection portion in the first component 21 is contaminated due to the adhesion of the adhesive on the tape member 200, or the active surface or This is because problems such as a decrease in characteristics of the movable part of the sensor chip may occur.

第２の部品２２は典型的にはチップコンデンサ、チップ抵抗、コイル等の受動素子である。このような受動素子は、たとえば、はんだや導電性接着剤などによりプリント基板１０の一面に接続される。そして、この第２の部品２２は、第１の部品２１よりも背が高く且つ後述するテープ部材２００の貼り付けが許容されているものである。   The second component 22 is typically a passive element such as a chip capacitor, a chip resistor, or a coil. Such a passive element is connected to one surface of the printed circuit board 10 by, for example, solder or a conductive adhesive. And this 2nd component 22 is taller than the 1st component 21, and the affixing of the tape member 200 mentioned later is accept | permitted.

図１に示される例では、第１の部品２１はＩＣチップ、第２の部品２２はチップコンデンサとされている。そして、これら第１の部品２１と第２の部品２２とは、互いに隣り合う位置に配置されている。ここでは、図１に示されるように、複数個の第２の電子部品２２の間に複数個の第１の部品２１が配置された形とされている。   In the example shown in FIG. 1, the first component 21 is an IC chip, and the second component 22 is a chip capacitor. The first component 21 and the second component 22 are arranged at positions adjacent to each other. Here, as shown in FIG. 1, a plurality of first components 21 are arranged between a plurality of second electronic components 22.

次に、本実施形態の電子装置の製造方法について、図２〜図４を参照して述べる。図２は、本製造方法に用いられる板材１００の一面を示す概略平面図、図３はテープ部材２００の貼り付け工程を示す概略断面図、図４は切断工程を示す概略断面図である。   Next, a method for manufacturing the electronic device of this embodiment will be described with reference to FIGS. FIG. 2 is a schematic plan view showing one surface of the plate member 100 used in the manufacturing method, FIG. 3 is a schematic cross-sectional view showing the attaching process of the tape member 200, and FIG. 4 is a schematic cross-sectional view showing the cutting process.

図２に示されるように、板材１００は、プリント基板１０が形成される基板形成領域１１０を一面に複数個有し、各々の基板形成領域１１０の外周に位置する切断部１２０にて切断されるようになっているものである。   As shown in FIG. 2, the plate member 100 has a plurality of substrate forming regions 110 on which the printed circuit board 10 is formed on one surface, and is cut by a cutting unit 120 positioned on the outer periphery of each substrate forming region 110. It is something like that.

更に述べるならば、基板形成領域１１０は、１個のプリント基板１０となる領域であり、個々の基板形成領域１１０は、最終的に切断される部位である切断部１２０によって取り囲まれた領域である。図２では、４×７個の計２８個の長方形をなす基板形成領域１１０が、マトリクス状に配置されており、各基板形成領域１１０の間の部位が切断部１２０とされている。   More specifically, the substrate forming region 110 is a region to be a single printed circuit board 10, and each substrate forming region 110 is a region surrounded by a cutting portion 120 that is a portion to be finally cut. . In FIG. 2, a total of 28 rectangular substrate forming regions 110 of 4 × 7 are arranged in a matrix, and portions between the substrate forming regions 110 are cut portions 120.

このような複数のプリント基板１０が連なった状態の板材１００、いわゆる多連の板材１００は、一般的なプリント基板１０の製造方法により形成される。そして、この板材１００の一面において各々の基板形成領域１１０に電子部品２１、２２を搭載する。   The plate member 100 in a state where a plurality of printed circuit boards 10 are connected, that is, a so-called multiple plate member 100 is formed by a general method for manufacturing the printed circuit board 10. Then, electronic components 21 and 22 are mounted on each substrate forming region 110 on one surface of the plate member 100.

このとき、電子部品２１、２２の搭載工程では、上記図１にも示したように、第１の部品２１と当該搭載後の高さが第１の部品２１よりも高い第２の部品２２とを、互いに隣り合うように、各々の基板形成領域１１０に搭載する。   At this time, in the mounting process of the electronic components 21 and 22, as shown in FIG. 1, the first component 21 and the second component 22 whose height after the mounting is higher than that of the first component 21 Are mounted on each substrate forming region 110 so as to be adjacent to each other.

こうして、板材１００の一面における基板形成領域１１０、すなわち、プリント基板１０の一面となる部位に、電子部品２１、２２が搭載され、この状態の板材１００が図２に示される。本実施形態では、ここまでの状態では、ワイヤボンディングが必要な第１の部品２１については、ワイヤボンディングは行われていない。   In this way, the electronic components 21 and 22 are mounted on the substrate forming region 110 on one surface of the plate material 100, that is, the portion that becomes one surface of the printed circuit board 10, and the plate material 100 in this state is shown in FIG. In the present embodiment, in the state up to this point, the wire bonding is not performed for the first component 21 that requires the wire bonding.

なお、この図２および後述の各概略断面図では、第１の部品２１と第２の部品２２とが接触しているところがあるが、これは、これら両部品２１、２２が当該図中の紙面垂直方向に離れて重なって配置されている状態を概略的に示したものである。   In FIG. 2 and each of the schematic cross-sectional views described later, there are places where the first component 21 and the second component 22 are in contact with each other. FIG. 2 schematically shows a state where they are arranged to be separated from each other in the vertical direction.

次に、本製造方法においては、図３に示されるように、板材１００の一面および当該一面上に搭載された電子部品２１、２２を被覆するように、テープ部材２００を板材１００の一面に貼り付ける。   Next, in this manufacturing method, as shown in FIG. 3, the tape member 200 is attached to one surface of the plate material 100 so as to cover one surface of the plate material 100 and the electronic components 21 and 22 mounted on the one surface. wear.

ここで、テープ部材２００は、この種の製造方法に用いられる一般的なものであり、たとえばバックグラインドテープやダイシングテープなどが挙げられる。これらテープ部材２００の材質は、たとえばオレフィン系樹脂、ＰＥＴ（ポリエチレンテレフタレート）、塩化ビニル樹脂などである。また、テープ部材２００は、板材１００の一面に貼り付けられるが、この貼り付け面には粘着剤が設けられている。   Here, the tape member 200 is a general one used in this type of manufacturing method, and examples thereof include a back grind tape and a dicing tape. The material of these tape members 200 is, for example, an olefin resin, PET (polyethylene terephthalate), vinyl chloride resin, or the like. Moreover, although the tape member 200 is affixed on the one surface of the board | plate material 100, the adhesive is provided in this affixed surface.

そして、テープ部材２００の貼り付け工程では、各基板形成領域１１０の周辺部にて、テープ部材２００を切断部１２０に貼り付ける。具体的には、切断部１２０および当該切断部１２０をまたいで隣り合う基板形成領域１１０の周辺部に貼り付ける。   Then, in the step of attaching the tape member 200, the tape member 200 is attached to the cutting portion 120 at the periphery of each substrate forming region 110. Specifically, the cutting portion 120 and the peripheral portion of the adjacent substrate forming region 110 are pasted across the cutting portion 120.

それにより、テープ部材２００のうち切断部１２０に貼り付いている部位の内周に位置する各々の基板形成領域１１０および各基板形成領域１１０上に搭載されている電子部品２１、２２をテープ部材２００で被覆して封止する。   As a result, each substrate forming region 110 located on the inner periphery of the portion of the tape member 200 attached to the cutting portion 120 and the electronic components 21 and 22 mounted on each substrate forming region 110 are connected to the tape member 200. Cover with and seal.

このとき、本実施形態では、図３に示されるように、貼り付け用の治具３００を用いてテープ部材２００の貼り付け工程を行う。   At this time, in this embodiment, as shown in FIG. 3, the attaching process of the tape member 200 is performed using the attaching jig 300.

この治具３００は、板材１００の一面にテープ部材２００を押し付けるための治具であって、テープ部材２００を介して当該治具３００と板材１００の一面とを対向させた状態にて板材１００の切断部１２０に対応する位置に突起３１０を有するものである。この治具３００の材質は特に限定されないが、たとえばステンレスなどよりなる。   The jig 300 is a jig for pressing the tape member 200 against one surface of the plate material 100, and the jig 300 and the one surface of the plate material 100 are opposed to each other through the tape member 200. The protrusion 310 is provided at a position corresponding to the cutting part 120. The material of the jig 300 is not particularly limited, but is made of, for example, stainless steel.

ここでは、図３（ａ）に示されるように、まず、治具３００の突起３１０に接触させた状態で、テープ部材２００を治具３００に搭載する。そして、図３（ｂ）に示されるように、治具３００の突起３１０と板材１００の切断部１２０とを位置合わせしつつ、板材１００の一面と治具３００とをテープ部材２００を介して対向させる。   Here, as shown in FIG. 3A, first, the tape member 200 is mounted on the jig 300 while being in contact with the protrusion 310 of the jig 300. Then, as shown in FIG. 3B, one surface of the plate member 100 and the jig 300 are opposed to each other with the tape member 200 while aligning the protrusion 310 of the jig 300 and the cut portion 120 of the plate member 100. Let

このとき、治具３００とテープ部材２００との接触については、テープ部材２００における板材１００への貼り付け面とは反対側の面に対して、治具３００における突起３１０以外の部位を非接触としつつ突起３１０のみを接触させる。   At this time, with respect to the contact between the jig 300 and the tape member 200, the part other than the protrusion 310 in the jig 300 is not in contact with the surface of the tape member 200 opposite to the surface to be attached to the plate member 100. While only the protrusion 310 is brought into contact with it.

また、この治具３００とテープ部材２００との接触状態では、さらに、図３（ｂ）中の矢印に示されるように、テープ部材２００を当該テープ部材２００の平面方向（図３（ｂ）中の左右方向）に弛まないように引っ張った状態とする。ここで、上記平面方向への引っ張りは、たとえばテープ部材２００の端部を治具等で引っ張ることにより、行うことができる。   Further, in the contact state between the jig 300 and the tape member 200, the tape member 200 is further moved in the plane direction of the tape member 200 (in FIG. 3B), as indicated by an arrow in FIG. (Left / Right direction) Here, the pulling in the planar direction can be performed, for example, by pulling the end of the tape member 200 with a jig or the like.

そして、この状態で、テープ部材２００の貼り付け面を、板材１００の一面における切断部１２０および第２の部品２２に接触させつつ、突起３１０にてテープ部材２００を切断部１２０に押し付ける。この押しつけの方向は、図３（ｂ）中の上方から下方に向かう矢印にて示されている。   In this state, the tape member 200 is pressed against the cutting portion 120 by the protrusion 310 while the attachment surface of the tape member 200 is in contact with the cutting portion 120 and the second component 22 on one surface of the plate member 100. This pressing direction is indicated by an arrow from the upper side to the lower side in FIG.

このように押しつけを行うことにより、テープ部材２００は、板材１００の切断部１２０および第２の部品２２に貼り付けられる。このとき、テープ部材２００で被覆されている各々の基板形成領域１１０においては、テープ部材２００は第２の部品２２に貼り付けて第２の部品２２に支持された状態となる。   By performing the pressing in this way, the tape member 200 is attached to the cut portion 120 and the second component 22 of the plate material 100. At this time, in each substrate forming region 110 covered with the tape member 200, the tape member 200 is attached to the second component 22 and supported by the second component 22.

それによって、切断部１２０の内周の基板形成領域１１０のうち第２の部品２２以外の部位、すなわち第２の部品２２の周囲にて、テープ部材２００は弛み無く張られ、テープ部材２００と板材１００の一面とが離れた空間が形成される。そして、第２の部品２２に隣り合う第１の部品２１は、当該空間に位置することになる。   As a result, the tape member 200 is stretched without slacking around the portion other than the second component 22 in the substrate forming region 110 on the inner periphery of the cutting portion 120, that is, around the second component 22. A space away from one surface of 100 is formed. And the 1st component 21 adjacent to the 2nd component 22 will be located in the said space.

この状態を、例えるならば、第２の部品２２を支持部材としてテープ部材２００のテントが張られた状態となり、このテント内の空間に第１の部品２１が位置した状態となる。それにより、第１の部品２１は、テープ部材１００とは非接触の状態でテープ部材２００に被覆されたものとする。   In this state, for example, the tent of the tape member 200 is stretched using the second component 22 as a support member, and the first component 21 is positioned in the space in the tent. Thereby, the first component 21 is assumed to be covered with the tape member 200 in a non-contact state with the tape member 100.

こうして、図３に示されるように、テープ部材２００を板材１００の一面に貼り付け、テープ部材２００により板材１００の一面および電子部品２１、２２を封止して保護した状態が形成される。   Thus, as shown in FIG. 3, the tape member 200 is attached to one surface of the plate member 100, and the one surface of the plate member 100 and the electronic components 21 and 22 are sealed and protected by the tape member 200.

次に、図４に示されるように、この状態のものについて切断工程を行う。具体的には、切断部１２０にて板材１００を、各基板形成領域１１０の単位に切断することにより、個片化されたプリント基板１０を形成する。   Next, as shown in FIG. 4, a cutting process is performed for this state. Specifically, the cut board 120 cuts the plate material 100 into units of each board formation region 110, thereby forming the printed board 10 separated into individual pieces.

このとき、上記テープ部材２００の貼り付け工程では、テープ部材２００が治具３００の突起３１０で板材１００に押し付けられるが、ここでは、この状態のまま、切断工程を行う。つまり、この治具３００を、板材１００を支持する支持部材として用い、図４に示されるように、板材１００を治具３００の突起３１０で支持する。   At this time, in the step of attaching the tape member 200, the tape member 200 is pressed against the plate member 100 by the protrusions 310 of the jig 300. Here, the cutting step is performed in this state. That is, this jig 300 is used as a support member for supporting the plate material 100, and the plate material 100 is supported by the protrusions 310 of the jig 300 as shown in FIG. 4.

そして、板材１００におけるテープ部材２００が貼り付いている一面とは反対側の他面側から切り込んでいくことにより、板材１００の切断を行う。この切り込みは、ブレードまたはレーザなどによるダイシングによって行えるが、図４では、ブレード４００によるダイシングの例を示している。   And the board | plate material 100 is cut | disconnected by cutting from the other surface side on the opposite side to the one surface to which the tape member 200 in the board | plate material 100 has affixed. This cutting can be performed by dicing with a blade or a laser. FIG. 4 shows an example of dicing with the blade 400.

そして、板材１００の他面から切り込みを入れ、板材１００を切断していくが、切り込みが板材１００の一面まで到達し、板材１００の切断が完了した後には、テープ部材２００は、その厚さ方向の途中まで切断するにとどめ、板材１００を個片化した後も１枚の大きなテープ部材２００としてつながった状態とする。   Then, a cut is made from the other surface of the plate member 100 and the plate member 100 is cut. After the cut reaches one surface of the plate member 100 and the cutting of the plate member 100 is completed, the tape member 200 is moved in its thickness direction. In this case, the sheet material 100 is cut into the middle, and after the plate material 100 is separated into individual pieces, the large tape member 200 is connected.

こうして切断工程が終了した後には、個片化されたプリント基板１０の他面側からプリント基板１０の端部を押し上げることにより、プリント基板１０の端部からテープ部材２００を剥がす。この基板端部の押し上げは電子部品２１、２２が実装されていない未実装部分でもよいし、当該基板端部に位置する第２の部品２２の部分でもよい。   After the cutting process is completed in this manner, the tape member 200 is peeled from the end portion of the printed circuit board 10 by pushing up the end portion of the printed circuit board 10 from the other surface side of the separated printed circuit board 10. This push-up of the substrate end may be an unmounted portion where the electronic components 21 and 22 are not mounted, or may be a portion of the second component 22 located at the substrate end.

ところで、本実施形態によれば、電子部品２１、２２の搭載工程では、第１の部品２１と当該搭載後の高さが第１の部品２１よりも高い第２の部品２２とを、互いに隣り合うように、各基板形成領域１１０に搭載し、テープ部材２００の貼り付け工程では、テープ部材２００を切断部１２０に貼り付けるとともに、第２の部品２２に貼り付けて第２の部品２２に支持させ、第２の部品２２の周囲にて、第１の部品２１がテープ部材２００とは非接触の状態でテープ部材２００に被覆されるようにしている。   By the way, according to the present embodiment, in the mounting process of the electronic components 21 and 22, the first component 21 and the second component 22 whose height after mounting is higher than that of the first component 21 are adjacent to each other. In the step of attaching the tape member 200, the tape member 200 is attached to the cutting part 120 and attached to the second component 22 to be supported by the second component 22 The first component 21 is covered with the tape member 200 in a non-contact state with the tape member 200 around the second component 22.

それによれば、第２の部品２２としては当然、第１の部品２１よりも背が高く且つテープ部材２００と貼り付いても問題ないものを用いることになるが、プリント基板１０となる板材１００の一面に上記従来のような突起を設けることなく、電子部品としての第１の部品２１とテープ部材２００とを離した状態で第１の部品２１をテープ部材２００で被覆し、板材１００の切断を行うことができる。   According to this, naturally, as the second component 22, a component that is taller than the first component 21 and has no problem even if it is attached to the tape member 200 is used. The first component 21 is covered with the tape member 200 in a state where the first component 21 as the electronic component and the tape member 200 are separated from each other without providing the above-described conventional protrusions, and the plate material 100 is cut. It can be carried out.

このように、本実施形態の製造方法は、プリント基板１０の一面に搭載される電子部品が、単一の種類のものでなく異種のものが混合している場合、その搭載後の高さに差が生じること、および、当該高さが高いものは受動素子などのテープ部材の貼り付けが許容されるものが多く、低いものは能動素子やセンサチップなどのテープ部材の貼り付けが禁止されているものが多いことに着目して、成されたものである。   As described above, in the manufacturing method according to the present embodiment, when electronic components mounted on one surface of the printed circuit board 10 are not single types but different types are mixed, the height after the mounting is set. There are many differences between them, and those with a high height often allow the attachment of tape members such as passive elements, while those with a low height prohibit the attachment of tape elements such as active elements and sensor chips. It was made by paying attention to the fact that there are many.

また、本実施形態の切断工程では、上述のように、板材１００をテープ部材２００とは反対側の面から切り込んでいくが、もし、板材１００をテープ部材２００側から切り込んでいった場合、切断部１２０にて先にテープ部材２００が切断され、その後、板材１００の切断へ移行することになる。   Further, in the cutting process of the present embodiment, as described above, the plate member 100 is cut from the surface opposite to the tape member 200. However, if the plate member 100 is cut from the tape member 200 side, the cutting is performed. The tape member 200 is first cut at the portion 120, and then the cutting of the plate material 100 is started.

そのため、この場合、板材１００の切断完了前に、切断部１２０に貼り付いているテープ部材２００の部分が剥がれ、そこから水分等が侵入する可能性がある。しかし、本実施形態のように、板材１００の切断を、板材１００におけるテープ部材２００が貼り付いている一面とは反対側の他面側から行えば、そのような問題を回避でき、信頼性に優れた切断が実現できる。   Therefore, in this case, before the cutting of the plate member 100 is completed, the portion of the tape member 200 attached to the cutting part 120 may be peeled off, and moisture or the like may enter from there. However, if the cutting of the plate member 100 is performed from the other side of the plate member 100 opposite to the one surface to which the tape member 200 is attached as in this embodiment, such a problem can be avoided and the reliability can be improved. Excellent cutting can be realized.

また、本実施形態のテープ部材２００の貼り付け工程では、上記したような突起３１０を有する治具３００を用いて、テープ部材２００をその平面方向に弛まないように引っ張りながら、治具３００の突起３１０にて切断部１２０に押し付け、当該切断部１２０および第２の部品２２に貼り付けるようにしている。   Further, in the attaching process of the tape member 200 according to the present embodiment, the jig 300 having the protrusion 310 as described above is used to pull the tape member 200 so as not to loosen in the plane direction, and the protrusion of the jig 300. At 310, it is pressed against the cutting part 120 and is attached to the cutting part 120 and the second component 22.

そのため、切断部１２０の内周の基板形成領域１１０のうち第２の部品２２以外の部位にて、テープ部材２００は弛み無く張られ、テープ部材２００と板材１００の一面とが離れた空間が適切に形成される。そして、当該空間に第１の部品２１を位置させることで、第１の部品２１とテープ部材２００との接触を回避できる。   Therefore, the tape member 200 is stretched without any slack in the portion other than the second component 22 in the substrate forming region 110 on the inner periphery of the cutting part 120, and a space in which the tape member 200 and one surface of the plate member 100 are separated from each other is appropriate. Formed. And the contact with the 1st component 21 and the tape member 200 can be avoided by positioning the 1st component 21 in the said space.

また、上述したように、テープ部材２００の貼り付け後に板材１００の切断を行うときに、この治具３００を、板材１００を支持する支持部材として用いることができるので、切断工程において別途、支持部材を用意することが不要となり、工程の簡略化等の利点がある。   Further, as described above, when the plate member 100 is cut after the tape member 200 is pasted, the jig 300 can be used as a support member for supporting the plate member 100. Therefore, a separate support member is used in the cutting step. There is no need to prepare the process, and there are advantages such as simplification of the process.

図５は、本実施形態の製造方法におけるテープ部材２００の貼り付け方法の他の例を示す概略断面図である。上記図３では、テープ部材２００における貼り付け面とは反対側の面を、治具３００の突起３１０に接触させ、この状態でテープ部材２００を治具３００に支持させた後、板材１００との貼り付けを行った。   FIG. 5 is a schematic cross-sectional view showing another example of a method for attaching the tape member 200 in the manufacturing method of the present embodiment. In FIG. 3, the surface of the tape member 200 opposite to the surface to be attached is brought into contact with the protrusion 310 of the jig 300, and the tape member 200 is supported by the jig 300 in this state, Pasted.

それに対して、図５に示されるように、テープ部材２００を先に板材１００の一面上に搭載されている第２の部品２２に貼り付けてもよい。この場合、図５に示されるように、たとえば軟らかいゴムなどよりなるローラ５００により、テープ部材２００を第２の部品２２に押し付けてやればよい。その後は、上記図３と同様に、突起３１０を有する治具３００により、テープ部材２００を切断部１２０に押し付けて貼り付けてやればよい。   On the other hand, as shown in FIG. 5, the tape member 200 may be attached to the second component 22 that is first mounted on one surface of the plate member 100. In this case, as shown in FIG. 5, the tape member 200 may be pressed against the second component 22 by a roller 500 made of, for example, soft rubber. Thereafter, as in FIG. 3, the tape member 200 may be pressed and pasted to the cutting portion 120 with the jig 300 having the protrusions 310.

（第２実施形態）
図６は、本発明の第２実施形態に係るテープ部材２００が貼り付けられた板材１００の種々の例を示す概略断面図である。本実施形態は、上記第１実施形態に比べて、電子部品２１〜２５を板材１００の両面に搭載したことが相違するものであり、ここでは、その相違点を中心に述べることとする。 (Second Embodiment)
FIG. 6 is a schematic cross-sectional view showing various examples of the plate member 100 to which the tape member 200 according to the second embodiment of the present invention is attached. This embodiment is different from the first embodiment in that the electronic components 21 to 25 are mounted on both surfaces of the plate member 100, and here, the difference will be mainly described.

図６の各例に示されるように、本実施形態では、板材１００の一面に電子部品２１、２２を搭載するだけでなく、当該一面とは反対側の他面にも、電子部品２３、２４、２５を搭載している。   As shown in each example of FIG. 6, in this embodiment, not only the electronic components 21 and 22 are mounted on one surface of the plate member 100 but also the electronic components 23 and 24 on the other surface opposite to the one surface. , 25.

図６（ａ）に示される第１の例では、板材１００の他面に電子部品としてのチップコンデンサ２３を搭載している。図６（ｂ）に示される第２の例では、板材１００の他面に電子部品としてのモールド部材２４を搭載している。このモールド部材２４は、たとえばＩＣチップなどをモールド樹脂で封止してなるものである。   In the first example shown in FIG. 6A, a chip capacitor 23 as an electronic component is mounted on the other surface of the plate material 100. In the second example shown in FIG. 6B, a mold member 24 as an electronic component is mounted on the other surface of the plate material 100. The mold member 24 is formed, for example, by sealing an IC chip or the like with a mold resin.

また、図６（ｃ）に示される第３の例では、板材１００の他面に電子部品としてのフリップチップ２５を搭載している。このフリップチップ２５はアンダーフィルにより能動面が保護されている。   In the third example shown in FIG. 6C, the flip chip 25 as an electronic component is mounted on the other surface of the plate member 100. The flip chip 25 has an active surface protected by underfill.

これら各例においても、板材１００の一面では、上記実施形態と同様に、第１の部品２１と第２の部品２２とが搭載され、これをテープ部材２００で保護する。そして、上記同様に、切断工程を行うことで、個片化されたプリント基板１０よりなる電子装置ができあがる。こうして、最終的にできあがった電子装置は、各例ともプリント基板１０の両板面に電子部品２１〜２５が搭載されてなる両面搭載構造のものとなる。   In each of these examples, the first component 21 and the second component 22 are mounted on one surface of the plate member 100 and protected by the tape member 200 as in the above embodiment. In the same manner as described above, by performing the cutting process, an electronic device including the printed board 10 separated into pieces is completed. Thus, the electronic device finally completed has a double-sided mounting structure in which the electronic components 21 to 25 are mounted on both plate surfaces of the printed circuit board 10 in each example.

（第３実施形態）
図７は、本発明の第３実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は切断により個片化されたプリント基板１０、つまり本実施形態の電子装置の概略平面図、（ｂ）はテープ部材２００が貼り付けられた板材１００を示す概略断面図である。 (Third embodiment)
FIG. 7 is a diagram showing a main part of the method for manufacturing an electronic device according to the third embodiment of the present invention. FIG. 7A shows the printed circuit board 10 separated by cutting, that is, the electronic device of the present embodiment. A schematic plan view, (b) is a schematic cross-sectional view showing a plate member 100 to which a tape member 200 is attached.

本実施形態は、上記第１実施形態に比べて、１個の基板形成領域１１０において第２の部品２２が複数個ではなく１個であることが相違するものであり、ここでは、その相違点を中心に述べることとする。なお、本実施形態は、上記第２実施形態と組み合わせて適用できることはもちろんである。   The present embodiment is different from the first embodiment in that the number of the second components 22 is not one, but one, in one substrate forming region 110. Here, the difference is the same. Will be described mainly. Of course, this embodiment can be applied in combination with the second embodiment.

上記第１実施形態では、上記図１等に示したように、２個以上の第２の部品２２の間にテープ部材２００を張ることにより、当該２個以上の部品２２の間に位置する第１の部品２１とテープ部材２００とを非接触としていた。   In the first embodiment, the tape member 200 is stretched between two or more second parts 22 as shown in FIG. 1 part 21 and the tape member 200 were not contacted.

それに対して、図７に示されるように、本実施形態では、プリント基板１０の中心部、すなわち基板形成領域１１０の中心部に高背部品である第２の部品２２を１個配置し、その周辺に低背部品である第１の部品２１を配置している。   On the other hand, as shown in FIG. 7, in the present embodiment, one second component 22, which is a high-profile component, is arranged at the center of the printed circuit board 10, that is, the center of the substrate formation region 110. A first component 21 that is a low-profile component is disposed around the periphery.

この場合、第２の部品２２に貼り付いている部分を頂点とし、切断部１２０に向かって裾野が広がる山型に、テープ部材２００が張られた形となる。そして、その内部にて第１の部品２１がテープ部材２００とは非接触の状態で被覆されたものとなる。   In this case, the tape member 200 is stretched in a mountain shape with the portion attached to the second component 22 as the apex and the base extending toward the cutting portion 120. And the 1st component 21 will be coat | covered in the non-contact state with the tape member 200 in the inside.

（第４実施形態）
図８は、本発明の第４実施形態に係る切断により個片化されたプリント基板１０、つまり本実施形態の電子装置の種々の例を示す概略平面図である。 (Fourth embodiment)
FIG. 8 is a schematic plan view showing various examples of the printed circuit board 10 separated by cutting according to the fourth embodiment of the present invention, that is, the electronic device of the present embodiment.

本実施形態は、第１の部品２１がワイヤボンド実装されるものである場合に、そのワイヤボンディング方向を考慮した例を示すものである。そして、本実施形態は上記各実施形態と組み合わせて適用できるものであり、以下、本実施形態独自の部分を中心に述べることとする。   The present embodiment shows an example in which the wire bonding direction is taken into consideration when the first component 21 is mounted by wire bonding. The present embodiment can be applied in combination with each of the above-described embodiments, and the following description will focus on the parts unique to the present embodiment.

図８に示されるように、本実施形態では、第１の部品２１はワイヤボンディングにより基板形成領域１１０に接続される。この場合、ボンディングワイヤ３０は、一般的なアルミニウムや金などよりなるものであり、ワイヤボンディングは、切断工程後に、個片化された各プリント基板１０上の第１の部品２１に対して行う。   As shown in FIG. 8, in the present embodiment, the first component 21 is connected to the substrate forming region 110 by wire bonding. In this case, the bonding wire 30 is made of general aluminum, gold, or the like, and the wire bonding is performed on the first component 21 on each printed board 10 separated after the cutting process.

本実施形態では、電子部品２１、２２の搭載工程において、第１の部品２１と第２の部品２２とを、基板形成領域１１０におけるワイヤボンディングされる部位を挟んで隣り合うように搭載する。ここで、図示しないが、基板形成領域１１０におけるワイヤボンディングされる部位には、たとえばワイヤボンディング用のパッドが設けられており、このパッドを挟んで、第１の部品２１と第２の部品２２とが隣り合って配置される。   In the present embodiment, in the mounting process of the electronic components 21 and 22, the first component 21 and the second component 22 are mounted so as to be adjacent to each other with the portion to be wire-bonded in the substrate forming region 110. Here, although not shown in the figure, a wire bonding pad is provided in a portion where wire bonding is performed in the substrate forming region 110, and the first component 21 and the second component 22 are sandwiched between the pads. Are arranged next to each other.

図８（ａ）の例では、矩形板状をなす第１の部品２１の四方にてワイヤボンディングが行われるので、第２の部品２２は第１の部品２１の四方に隣り合って設けられている。また、図８（ｂ）の例、図８（ｃ）の例では、それぞれ矩形板状をなす第１の部品２１の対向する二辺にてワイヤボンディングが行われるので、第２の部品２２は第１の部品２１の当該二辺に隣り合って設けられている。   In the example of FIG. 8A, since wire bonding is performed on the four sides of the first component 21 having a rectangular plate shape, the second component 22 is provided adjacent to the four sides of the first component 21. Yes. In the example of FIG. 8B and the example of FIG. 8C, wire bonding is performed on two opposing sides of the first component 21 having a rectangular plate shape. The first component 21 is provided adjacent to the two sides.

このようにすれば、板材１００の一面および第１の部品２１におけるそれぞれワイヤボンディングされる部位と、テープ部材２００との接触を、確実に回避することができ、好ましい。当該ワイヤボンディングされる部位は、テープ部材２００が貼りつくとテープ部材２００の粘着剤などが付着し、ワイヤボンディング性の低下を引き起こすおそれがあるが、本実施形態によれば、そのような問題が回避される。   This is preferable because it is possible to surely avoid contact between one surface of the plate member 100 and the portion of the first component 21 where wire bonding is performed and the tape member 200. When the tape member 200 adheres to the portion to be wire bonded, the adhesive of the tape member 200 or the like may be adhered to cause a decrease in wire bonding properties. However, according to the present embodiment, such a problem is caused. Avoided.

（第５実施形態）
図９は、本発明の第５実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は切断により個片化された基板１０、つまり本実施形態の電子装置の概略平面図、（ｂ）はテープ部材２００が貼り付けられた板材１００を示す概略断面図である。 (Fifth embodiment)
FIG. 9 is a diagram showing the main part of the manufacturing method of the electronic device according to the fifth embodiment of the present invention, and FIG. 9A is a schematic view of the substrate 10 separated by cutting, that is, the electronic device of this embodiment. FIG. 4B is a schematic cross-sectional view showing the plate member 100 on which the tape member 200 is attached.

本実施形態は、第１の部品２１よりも背が高い第２の部品２２の中でも、さらに背の高さが異なるものが存在する場合に、これら背の高さの異なる第２の部品２２の配置例を示すものである。   In the present embodiment, the second component 22 having a different height from the second component 22 having a height different from that of the first component 21 is different from the second component 22 having a different height. An arrangement example is shown.

図９に示されるように、本実施形態では、第２の部品２２の中でも背の高いもの、たとえば大型のコンデンサを基板形成領域１１０の中心部に配置し、第２の部品２２の中でも背の低いもの、たとえば小型のコンデンサを基板形成領域１１０の周辺部に配置し、その間に第１の部品２１を配置している。   As shown in FIG. 9, in the present embodiment, a taller one of the second components 22, for example, a large capacitor is arranged at the center of the substrate forming region 110, and the tallest of the second components 22. A low capacitor, for example, a small capacitor, is disposed in the periphery of the substrate formation region 110, and the first component 21 is disposed therebetween.

このように、第２の部品２２の中で背の高さが異なる場合でも、第１の部品２１とテープ部材２００とを離した状態で第１の部品２１をテープ部材２００で適切に被覆することができる。   Thus, even when the height of the second component 22 is different, the first component 21 is appropriately covered with the tape member 200 in a state where the first component 21 and the tape member 200 are separated. be able to.

（第６実施形態）
図１０は、本発明の第６実施形態に係る電子装置の製造方法の要部を示す図であり、（ａ）は切断により個片化された基板１０、つまり本実施形態の電子装置の概略平面図、（ｂ）はテープ部材２００が貼り付けられた板材１００を示す概略断面図である。 (Sixth embodiment)
FIG. 10 is a diagram showing the main part of the manufacturing method of the electronic device according to the sixth embodiment of the present invention, and FIG. 10A is an outline of the substrate 10 cut into pieces, that is, the electronic device of this embodiment. FIG. 4B is a schematic cross-sectional view showing the plate member 100 on which the tape member 200 is attached.

本実施形態は、上記第４実施形態と同様に、第１の部品２１がワイヤボンディングにより基板形成領域１１０に接続されるものであるが、さらに、板材１００を切断する前にワイヤボンディングを実施する必要がある場合に適用されるものである。   In the present embodiment, as in the fourth embodiment, the first component 21 is connected to the substrate forming region 110 by wire bonding, but further, wire bonding is performed before the plate material 100 is cut. Applicable when necessary.

図１０に示されるように、本実施形態では、第２の部品２２として、その搭載後の高さが、第１の部品２１よりも高いことはもちろんであるが、第１の部品２１にワイヤボンディングを行って形成されるワイヤ３０よりも高いものを用いる。ここで、ワイヤ３０は、一般に、板材１００の一面上にループ状に凸となった形状を有するので、当該ワイヤ３０の高さとは、板材１００の一面からワイヤ３０のループの頂部までの高さである。   As shown in FIG. 10, in the present embodiment, as the second component 22, the height after mounting is higher than that of the first component 21. A wire higher than the wire 30 formed by bonding is used. Here, since the wire 30 generally has a shape that is convex in a loop shape on one surface of the plate material 100, the height of the wire 30 is the height from one surface of the plate material 100 to the top of the loop of the wire 30. It is.

そして、電子部品２１、２２の搭載工程では、第１の部品２１および第２の部品２２の搭載を行うとともに、第１の部品２１にワイヤボンディングを行う。このとき、上記第４実施形態と同様に、第１の部品２１と第２の部品２２とを、基板形成領域１１０におけるワイヤボンディングされる部位を挟んで隣り合うように搭載する。   In the mounting process of the electronic components 21 and 22, the first component 21 and the second component 22 are mounted, and wire bonding is performed on the first component 21. At this time, similarly to the fourth embodiment, the first component 21 and the second component 22 are mounted so as to be adjacent to each other with the portion to be wire-bonded in the substrate forming region 110 interposed therebetween.

その後、上記同様に、テープ部材２００の貼り付け工程によって、テープ部材２００を切断部１２０および第２の部品２２に貼り付ける。これにより、本実施形態では、第１の部品２１およびワイヤ３０がテープ部材２００とは非接触の状態でテープ部材２００に被覆される。そして、この状態で切断工程を行えば、ボンディングワイヤ３０に影響を与えることなく、板材１００の切断が行える。   Thereafter, in the same manner as described above, the tape member 200 is attached to the cutting part 120 and the second component 22 by the attaching process of the tape member 200. Thereby, in this embodiment, the 1st component 21 and the wire 30 are coat | covered by the tape member 200 in a non-contact state with the tape member 200. FIG. If the cutting process is performed in this state, the plate material 100 can be cut without affecting the bonding wire 30.

ここで、図１１は、本第６実施形態に係る製造方法の他の例の要部を示す図であり、（ａ）は切断により個片化された基板１０、つまり本例の電子装置の概略平面図、（ｂ）はテープ部材２００が貼り付けられた板材１００を示す概略断面図である。   Here, FIG. 11 is a diagram showing a main part of another example of the manufacturing method according to the sixth embodiment, and FIG. 11A shows the substrate 10 separated by cutting, that is, the electronic device of this example. A schematic plan view, (b) is a schematic cross-sectional view showing a plate member 100 to which a tape member 200 is attached.

この図１１の例は、上記第３実施形態（図７参照）と同様に、１個の基板形成領域１１０において第２の部品２２を１個としたものであり、この場合でも、本実施形態を適用することができる。   In the example of FIG. 11, as in the third embodiment (see FIG. 7), one second component 22 is provided in one substrate forming region 110. Even in this case, this embodiment Can be applied.

（第７実施形態）
図１２は、本発明の第７実施形態に係る電子装置の製造方法における切断工程を示す概略断面図であり、（ｂ）は（ａ）中の丸で囲まれたＡ部の拡大図である。本実施形態では、テープ部材２００の貼り付け工程を、一部変形したものであり、ここでは、その変形部分を中心に述べる。 (Seventh embodiment)
FIG. 12: is a schematic sectional drawing which shows the cutting process in the manufacturing method of the electronic device which concerns on 7th Embodiment of this invention, (b) is an enlarged view of the A section enclosed with the circle in (a). . In this embodiment, the attaching process of the tape member 200 is partially modified, and here, the deformed portion will be mainly described.

図１２に示されるように、本実施形態においても、貼り付け工程では、上記突起３１０を有する治具３００を用いてテープ部材２００の貼り付けを行う。ここで、本実施形態では、板材１００の他面のうち切断部１２０およびその周辺部を、エッチングや切削などによって凹ませた凹部とし、治具３００の突起３１０の先端面に、当該凹部に対応した凸部を設ける。   As shown in FIG. 12, also in the present embodiment, in the attaching step, the tape member 200 is attached using the jig 300 having the protrusion 310. Here, in the present embodiment, the cut portion 120 and its peripheral portion of the other surface of the plate material 100 are recessed portions that are recessed by etching or cutting, and the tip surface of the protrusion 310 of the jig 300 corresponds to the recessed portion. Protruding parts are provided.

これにより、テープ部材２００を突起３１０で切断部１２０に押し付けて貼り付けるときに、この凹部および凸部の形状にテープ部材２００が変形するため、テープ部材２００と板材１００との密着性が向上する。その結果、板材１００の切断時にテープ部材２００が剥がれにくくなり、保護機能の向上が期待できる。   Thereby, when the tape member 200 is pressed and pasted to the cutting part 120 with the protrusion 310, the tape member 200 is deformed into the shape of the concave part and the convex part, so that the adhesion between the tape member 200 and the plate member 100 is improved. . As a result, the tape member 200 becomes difficult to peel off when the plate member 100 is cut, and an improvement in the protection function can be expected.

（第８実施形態）
図１３は、本発明の第８実施形態に係る電子装置の製造方法における切断工程を示す概略断面図である。本実施形態では、テープ部材２００の貼り付け工程を、一部変形したものであり、ここでは、その変形部分を中心に述べる。 (Eighth embodiment)
FIG. 13: is a schematic sectional drawing which shows the cutting process in the manufacturing method of the electronic device which concerns on 8th Embodiment of this invention. In this embodiment, the attaching process of the tape member 200 is partially modified, and here, the deformed portion will be mainly described.

図１３に示されるように、本実施形態においても、貼り付け工程では、上記突起３１０を有する治具３００を用いてテープ部材２００の貼り付けを行う。ここで、本実施形態では、治具３００における突起３１０以外の部位に、テープ部材２００を板材１００の他面とは反対方向に吸引するための吸引穴３２０が設けられている。   As shown in FIG. 13, also in the present embodiment, in the attaching process, the tape member 200 is attached using the jig 300 having the protrusions 310. Here, in the present embodiment, a suction hole 320 for sucking the tape member 200 in a direction opposite to the other surface of the plate member 100 is provided in a part other than the protrusion 310 in the jig 300.

そして、テープ部材２００を板材１００の他面に貼り付けるときには、図示しない真空ポンプなどにより、この吸引穴３２０からテープ部材２００を引っ張りながら当該貼り付けを行う。なお、ここでは、治具３００は、その突起３１０以外にも、吸引穴３２０が設けられている面でもテープ部材２００と接触して、テープ部材２００の貼り付けを行うものである。   When the tape member 200 is attached to the other surface of the plate member 100, the attachment is performed while pulling the tape member 200 from the suction hole 320 by a vacuum pump (not shown) or the like. Here, in addition to the protrusion 310, the jig 300 contacts the tape member 200 on the surface where the suction hole 320 is provided and attaches the tape member 200 thereto.

上記第１実施形態では、上記図３に示したように、テープ部材２００をその平面方向に弛まないように引っ張りながら貼り付けたが、本実施形態では、上記吸引力によりテープ部材２００のたわみが取り除かれるため、テープ部材２００の貼り付け時に、当該平面方向への引っ張り動作が不要となる。   In the first embodiment, as shown in FIG. 3, the tape member 200 is attached while being pulled so as not to loosen in the plane direction. However, in the present embodiment, the tape member 200 is bent by the suction force. Therefore, when the tape member 200 is attached, the pulling operation in the plane direction is not necessary.

（他の実施形態）
なお、上記各実施形態では、基板１０が形成される基板形成領域１１０を一面に複数個有し、切断部１２０にて個々の基板形成領域１１０単位に切断されるようになっている板材１００を用い、電子部品２１、２２の搭載後、板材１００の一面のみにテープ部材２００を貼り付けた状態で、切断を行った。しかし、上記各実施形態においては、更に板材１００の一面とは反対側の他面にも、当該他面を保護する等の目的でテープ部材２００を貼り付け、この状態で切断を行ってもよい。 (Other embodiments)
In each of the above embodiments, the plate material 100 having a plurality of substrate forming regions 110 on which the substrate 10 is formed on one surface and being cut into individual substrate forming region 110 units by the cutting unit 120 is provided. Used, after mounting the electronic components 21 and 22, cutting was performed with the tape member 200 attached to only one surface of the plate member 100. However, in each of the above embodiments, the tape member 200 may be attached to the other surface opposite to the one surface of the plate member 100 for the purpose of protecting the other surface, and the cutting may be performed in this state. .

また、基板１０としては、電子部品２１、２２を搭載するとともに多連の板材１００を切断して個片化することにより形成されるものであればよく、上記したプリント基板１０以外にも、たとえばアルミナなどよりなるセラミック基板や、たとえばシリコン半導体などよりなる半導体基板などであってもよい。   Moreover, as the board | substrate 10, what is necessary is just to be formed by cut | disconnecting the board | plate material 100 which cut | disconnects the multiple board | plate material 100 while mounting the electronic components 21 and 22, for example, It may be a ceramic substrate made of alumina or the like, or a semiconductor substrate made of silicon semiconductor, for example.

１０ 基板としてのプリント基板
２１ 電子部品としての第１の部品
２２ 電子部品としての第２の部品
３０ ワイヤ
１００ 板材
１１０ 基板形成領域
１２０ 切断部
２００ テープ部材
３００ 治具
３１０ 突起部 DESCRIPTION OF SYMBOLS 10 Printed circuit board as a board | substrate 21 1st component as an electronic component 22 2nd component as an electronic component 30 Wire 100 Board | plate material 110 Substrate formation area 120 Cutting part 200 Tape member 300 Jig 310 Protrusion part

Claims (4)

基板（１０）の両板面の一面に電子部品（２１、２２）を搭載してなる電子装置を製造する製造方法であって、
前記基板（１０）が形成される基板形成領域（１１０）を一面に複数個有し、各々の前記基板形成領域（１１０）の外周に位置する切断部（１２０）にて切断されるようになっている板材（１００）を用意し、
各々の前記基板形成領域（１１０）に電子部品（２１、２２）を搭載した後、前記板材（１００）の一面および前記電子部品（２１、２２）を被覆するようにテープ部材（２００）を前記板材（１００）の一面に貼り付けた状態で、前記切断部（１２０）にて前記板材（１００）を切断することにより、個片化された前記基板（１０）を形成する電子装置の製造方法において、
前記電子部品（２１、２２）の搭載工程では、前記電子部品として第１の部品（２１）と当該搭載後の高さが前記第１の部品（２１）よりも高い第２の部品（２２）とを、互いに隣り合うように、各々の前記基板形成領域（１１０）について搭載し、
前記テープ部材（２００）の貼り付け工程では、前記テープ部材（２００）を前記切断部（１２０）に貼り付けて、前記テープ部材（２００）のうち前記切断部（１２０）に貼り付いている部位の内周に位置する各々の前記基板形成領域（１１０）および前記電子部品（２１、２２）を前記テープ部材（２００）で被覆して封止するとともに、
前記テープ部材（２００）で被覆されている各々の前記基板形成領域（１１０）においては、さらに前記テープ部材（２００）を前記第２の部品（２２）に貼り付けて前記第２の部品（２２）に支持させ、前記第２の部品（２２）の周囲にて前記テープ部材（２００）と前記板材（１００）の一面とが離れた空間を形成することにより、前記第２の部品（２２）に隣り合う前記第１の部品（２１）を当該空間に位置させて、当該第１の部品（２１）が前記テープ部材（２００）とは非接触の状態で前記テープ部材（２００）に被覆されるようにし、
前記板材（１００）の切断は、前記板材（１００）における前記テープ部材（２００）が貼り付いている一面とは反対側の他面側から切り込んでいくことにより行うことを特徴とする電子装置の製造方法。 A manufacturing method for manufacturing an electronic device in which electronic components (21, 22) are mounted on one surface of both plate surfaces of a substrate (10),
A plurality of substrate forming regions (110) on which the substrate (10) is formed are provided on one side, and are cut at a cutting portion (120) located on the outer periphery of each of the substrate forming regions (110). Prepared plate material (100),
After mounting the electronic components (21, 22) on each of the substrate forming regions (110), the tape member (200) is attached to cover the one surface of the plate (100) and the electronic components (21, 22). A method of manufacturing an electronic device that forms the separated substrate (10) by cutting the plate (100) at the cutting portion (120) in a state of being attached to one surface of the plate (100). In
In the mounting step of the electronic components (21, 22), the first component (21) as the electronic component and the second component (22) whose height after mounting is higher than the first component (21). For each of the substrate formation regions (110) so as to be adjacent to each other,
In the step of attaching the tape member (200), the tape member (200) is attached to the cut portion (120), and the portion of the tape member (200) attached to the cut portion (120) Each of the substrate forming region (110) and the electronic component (21, 22) located on the inner periphery of the substrate is covered with the tape member (200) and sealed,
In each of the substrate forming regions (110) covered with the tape member (200), the tape member (200) is further attached to the second component (22) to form the second component (22). ) To form a space in which the tape member (200) and one surface of the plate member (100) are separated from each other around the second component (22), thereby the second component (22). The first component (21) adjacent to the tape member (21) is positioned in the space, and the first component (21) is covered with the tape member (200) in a non-contact state with the tape member (200). And
The cutting of the plate (100) is performed by cutting from the other side of the plate (100) opposite to the one side to which the tape member (200) is attached. Production method. 前記第１の部品（２１）はワイヤボンディングにより前記基板形成領域（１１０）に接続されるものであり、
前記第１の部品（２１）と前記第２の部品（２２）とを、前記基板形成領域（１１０）における前記ワイヤボンディングされる部位を挟んで隣り合うように搭載することを特徴とする請求項１に記載の電子装置の製造方法。 The first component (21) is connected to the substrate formation region (110) by wire bonding,
The first component (21) and the second component (22) are mounted so as to be adjacent to each other with the portion to be wire-bonded in the substrate forming region (110) interposed therebetween. 2. A method for manufacturing an electronic device according to 1. 前記第２の部品（２２）として、前記搭載後の高さが、前記第１の部品（２１）に前記ワイヤボンディングを行って形成されるワイヤ（３０）よりも高いものを用い、
前記電子部品（２１、２２）の搭載工程では、前記第１の部品（２１）および前記第２の部品（２２）の搭載を行うとともに、前記第１の部品（２１）に前記ワイヤボンディングを行うことを特徴とする請求項２に記載の電子装置の製造方法。 As the second component (22), a height after the mounting is higher than the wire (30) formed by performing the wire bonding on the first component (21),
In the mounting process of the electronic components (21, 22), the first component (21) and the second component (22) are mounted and the wire bonding is performed on the first component (21). The method of manufacturing an electronic device according to claim 2. 前記テープ部材（２００）の貼り付け工程では、前記切断部（１２０）に対応する位置に突起（３１０）を有する治具（３００）を用い、
前記突起（３１０）と前記切断部（１２０）とを位置合わせしつつ、前記板材（１００）の一面と前記治具（３００）とを前記テープ部材（２００）を介して対向させ、
前記テープ部材（２００）を当該テープ部材（２００）の平面方向に弛まないように引っ張りながら、前記テープ部材（２００）に対して、前記治具（３００）における前記突起（３１０）以外の部位を非接触としつつ前記突起（３１０）を接触させた状態で、前記突起（３１０）にて前記テープ部材（２００）を前記切断部（１２０）に押し付けることにより、前記テープ部材（２００）を、前記切断部（１２０）および前記第２の部品（２２）に貼り付けることを特徴とする請求項１ないし３のいずれか１つに記載の電子装置の製造方法。 In the step of attaching the tape member (200), a jig (300) having a protrusion (310) at a position corresponding to the cutting part (120) is used.
While aligning the protrusion (310) and the cutting part (120), one surface of the plate (100) and the jig (300) are opposed to each other via the tape member (200),
While pulling the tape member (200) so as not to sag in the plane direction of the tape member (200), a portion other than the protrusion (310) in the jig (300) is placed on the tape member (200). By pressing the tape member (200) against the cutting part (120) with the protrusion (310) in a state where the protrusion (310) is in contact with the tape member (200), the tape member (200) is The method for manufacturing an electronic device according to claim 1, wherein the electronic device is attached to a cutting part (120) and the second part (22).
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