JP2001308510A - Method and device for manufacturing bump parts mounting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deformation of a wiring board by the heat applied to a conductive adhesive or solder for heating the adhesive or solder at the time of flip-chip mounting bumps on the wiring board. SOLUTION: The bumps 104 mounted on a wiring board 102 put on a supporting substrate 101 are covered with a flexible partition 106. The bumps 104 are pressed against the wiring board 102 by applying different pressures to both sides of the partition 106. When the conductive adhesive or solder is heated in this state, the bumps 104 are connected to the wiring board 102 with the adhesive or solder.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a bump component mounted body capable of mounting a bump component such as a flip chip or a CSP (chip size package) on a wiring board with high yield.

[0002]

2. Description of the Related Art Recently, a flip chip mounting method has attracted attention as a semiconductor chip mounting method. In this method, a projection (bump) of an electric conductor is formed on a pad (electrode terminal) of a bare semiconductor chip, and the bump and an electrode on a wiring board are electrically connected. Conventional QFP (Quad F
In recent years, this technology has been remarkably developed because it can be mounted smaller than a package with leads, such as a lat package, and is suitable for high-speed operation because of shorter wiring. Among flip-chip mounting technologies, mounting by stud bump bonding (Stud Bump Bonding) is highly reliable and practical use has begun. Also, a method of directly attaching a bare semiconductor on a wiring board by using a solder ball has been known for a long time.

The method of stud bump bonding is described in the literature.
Yoshihiro Tomura et. Al "Advanced Flip Chip Bondin
g Technique For MCM-L ", 1996 Proceedings of First
PanPacific Microelectronics Symposium, p125-131 (1
996).

In addition, a conventional QFP (Quad Flat Packag)
CSP and BG because they can be significantly smaller than e)
A (Ball Grid array) is also often used. These also have bumps (solder balls) arranged in a plane, and needless to say, they are the bump parts referred to in the present invention.

[0005]

Although the above method is widely used, it has significant problems.

There is no problem if the wiring board is always flat and does not deform when mounting bump components. However, a general circuit board consisting of a composite material such as a resin and copper foil with a reinforced core material such as glass fiber or aramid fiber is often used to melt and bond solder balls when mounting bump components, or to use underfill. It is deformed by the heat inevitably applied for curing, and it is difficult to maintain flatness. In particular, it can be said that it is almost impossible with a thin wiring board such as a flexible wiring board.

As a method of solving this problem, during heating,
A method of holding down the wiring board with the semiconductor chip (for example, ACF between the semiconductor chip and the wiring board)
(Anisotropic Conductive Film) intervening and heating while pressing), but the processing is inevitably performed for each product, resulting in poor productivity.

The present invention solves the above-mentioned conventional problems,
An object of the present invention is to provide a method and an apparatus for manufacturing a bump component mounted body, which can prevent deformation of a wiring board due to heat applied when mounting a bump component.

[0009]

To achieve the above object, the present invention has the following arrangement.

The first method of manufacturing a bump component mounted body according to the present invention includes a step of pressing the bump component by a pressure difference applied to both sides of a flexible partition provided so as to cover the plurality of bump components mounted on the wiring board. It is characterized by having.

By doing so, the flatness of the wiring substrate can be forcibly maintained during heating or during a process in which deformation is likely to occur, and the yield deterioration due to the deformation of the wiring substrate can be prevented.

Further, according to the second method of manufacturing a bump component mounted body of the present invention, the space inside the partition formed by the flexible partition and the wiring substrate provided so as to cover the bump component mounted on the wiring substrate is decompressed. At least a step of injecting an underfill into the space in the partition wall during or after the pressure reduction is provided. Thereby, the underfill can be filled into the space in the partition wall at high speed without bubbles.

Further, a third method of manufacturing a bump component mounted body according to the present invention includes a step of flip-mounting a plurality of bump components on a wiring board, and covering the plurality of bump components with a flexible partition. Forming a space in the partition wall between the wiring board and the wiring board; and applying a pressure difference to both sides of the partition wall to press the bump component against the wiring board. This makes it possible to always maintain the wiring substrate in a flat state in a subsequent heating step or a step in which deformation may occur,
The mounting yield is improved. In addition, since it is only necessary to apply a pressure difference to both sides of the partition, it can be implemented at low cost.

In the third manufacturing method, the method may further include a step of applying a conductive adhesive to a bump of the bump component or an electrode of the wiring board before the flip-mounting step. Thereafter, drying, curing, or melting the conductive adhesive in the pressurized state,
The method may further include a step of depressurizing the space in the partition wall, injecting an underfill into the space in the partition wall during or after the pressure reduction, and a step of curing the underfill.
As a result, a flip-chip mounted body by stud bump bonding can be obtained with high yield. Further, after the bump component is covered with the partition, the process can be performed with the partition still covered until the curing of the underfill is completed.

In the third manufacturing method, the bump component may include a solder bump, and after the pressing step, a step of melting the solder bump in the pressed state may be further included. . As a result, a flip-chip mounted body of a bump component having a solder ball can be obtained with a high yield.

Further, in the third manufacturing method, in the flip-mounting step, an adhesive is interposed between the bump component and the wiring board, and after the pressing step, the adhesive is placed in the pressed state. Drying and curing the adhesive,
Alternatively, the method may further include a step of melting. As a result, ACF, ACP (Anisotropic Conductive Paste)
e) A flip-chip mounted body using an adhesive such as NCP (Non-Conductive Paste) can be obtained with high yield.

The third manufacturing method may further include a step of cutting the wiring substrate. Thereby, for example, a large number of small card-type substrates (modules, CSPs, BGAs, etc.) on which bump components are mounted can be manufactured at a time.

In the third manufacturing method, a sheet may be interposed between the bump component and the partition. As a result, the partition walls can be prevented from being stained, or the partition walls can be easily separated from the bump component mounting body. Alternatively, the sheet-like material may be integrated with the obtained flip-chip mounted body and used as an exterior.

Next, the apparatus for manufacturing a bump component mounted body according to the present invention includes a support substrate for mounting a wiring board, a flexible partition, a partition support for holding the partition, the partition and the partition. A closed space (space outside the partition) formed between the support and the support. This makes it possible to easily apply a pressure difference to both sides of the partition. Therefore, the manufacturing method of the present invention can be implemented with a simple configuration and at low cost.

In the above manufacturing apparatus, when the partition support holding the partition and the support substrate are integrated with the wiring substrate interposed therebetween, the space inside the partition sealed by the partition and the wiring substrate is reduced. It is preferably formed. Thus, by applying a pressure difference between the closed space (space outside the partition) and the space inside the partition, the wiring substrate can be pressed against the support substrate, and the deformation of the wiring substrate can be prevented. Further, the space in the partition can be used as a mold for underfill injection.

In the above manufacturing apparatus, it is preferable that a rubber stopper is provided for inserting a pressurizing pipe for pressurizing a closed space formed by the partition and the partition support. This makes it possible to easily pressurize the closed space (space outside the partition wall) by inserting the needle pipe into the rubber stopper, and to maintain the pressurized state even after removing the needle pipe.

In the above-mentioned manufacturing apparatus, it is preferable that a rubber stopper is provided for inserting a pressure reducing pipe for reducing the pressure in the partition wall. Thereby, the space inside the partition can be easily depressurized by inserting the needle pipe into the rubber stopper, and the depressurized state can be maintained even after the needle pipe is pulled out.

In the above-mentioned manufacturing apparatus, it is preferable that a rubber stopper for inserting an injection pipe for injecting an underfill into the space in the partition is provided. Thereby, the underfill can be injected into the space inside the partition wall by inserting the needle pipe into the rubber stopper, and the pressure difference on both sides of the partition wall can be maintained even after the needle pipe is pulled out.

In the above-described manufacturing apparatus, it is preferable that the support substrate holds the wiring substrate by suction. Accordingly, the wiring board can be maintained in a flat state before the partition wall support and the support substrate are integrated.
Further, even when the pressure in the closed space (space outside the partition wall) is insufficient when injecting the underfill, the deformation of the wiring board can be prevented.

Further, in the above manufacturing apparatus, when the partition support holding the partition and the support substrate are integrated with the wiring substrate interposed therebetween, a part of the wiring of the wiring substrate may be exposed. preferable. Thus, the electrical inspection can be performed using the exposed wiring without removing the partition support.

[0026]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 shows a principle diagram of the present invention. In FIG. 1, a wiring substrate 102 having electrodes 103 is placed on a rigid, flat upper surface of a support substrate 101, and a plurality of bump components 104 having bumps 105 are mounted thereon. Shows a state in which a flexible partition 106 is provided so as to cover. As the wiring board 102, a normal double-sided wiring board or a multilayer wiring board can be used as a matter of course. In the present invention, a flexible wiring board which cannot be used in a normal mounting method is also used in the present invention. Can be. There is no particular limitation on the material of the wiring substrate 102, and a resin substrate, a substrate made of an organic film, a ceramic substrate, or the like can be used. For example, a normal glass epoxy substrate may be used, or a substrate based on a polyimide film may be used. Or a ceramic substrate containing alumina as a main component. .

In FIG. 1, the inner space 1 between the partition 106 and the wiring board 102, that is, the space 1 between the partition 106 and the wiring board 102.
07 and the space 108 outside the partition wall are pressed to press the bump component 104. The mounting process is performed while maintaining this pressure difference. The specific method will be described later.

In order to hold the bump component 104 with a pressure difference, the pressure in the inner space 107 of the partition should be lower than the pressure in the outer space 108 of the partition. For example, in FIG. 1, the internal space 107 of the partition wall is depressurized to 1 atm (101.3 kPa) or less,
The space 108 outside the partition wall is pressurized to 2 atm (202.6 kPa). As a result, the bump component 104 is set at 1 atm (101.3
kPa) or more. Of course, at this time, it is not always necessary to pressurize the partition outer space 108. Even if the pressure is 1 atm (101.3 kPa) without pressurizing, the pressure in the partition wall space 107 is reduced to 1 atm (10
Although it is less than 1.3 kPa), it goes without saying that a pressing force can be generated. Alternatively, the space 108 outside the partition wall may be pressurized without depressurizing the space 107 inside the partition wall. When the space 107 in the partition is at least 1 atm (101.3 kPa), the space 108 outside the partition may be further pressurized.

When an underfill is required between the bump component 104 and the wiring board 102, the space 107 in the partition is evacuated (10 mmHg (1.3 kPa) or less) and the underfill is injected at 1 atm (101.3 kPa). Just do it. When the degree of vacuum is high, the space 107 in the partition wall can be filled with the underfill at high speed with almost no bubbles. In this state, heating may be performed to cure the underfill. When the viscosity of the underfill is high and the injection speed is low, the injection speed can be increased by increasing the injection pressure while increasing the air pressure in the partition outer space 108 to apply a pressing force to the bump component 104.

In the present invention, the term “bump component” means an electronic component provided with a bump electrode (bump). For example, a flip chip, a bare chip, a CSP, a BGA, etc., as well as a chip capacitor with a bump electrode, a bump electrode Includes attached chip resistors.

(Embodiment 2) A method for specifically realizing the above description will be described with reference to FIG.

Support substrate 101, wiring substrate 102, electrode 1
03, the bump component 104 and the bump 105 are shown in FIG.
Is the same as

The partition 202 is slightly different in shape from the partition 106 shown in FIG. The partition wall 202 is held by a partition wall support 201. As shown in FIG. 2, the space 107 inside the partition and the space 108 outside the partition are each formed airtight. That is,
The partition wall space 107 is formed around the partition wall 202 by the partition wall support 20.
1 is formed by closely adhering to the upper surface of the wiring board 102. On the other hand, the partition outer space 108 is formed between the partition 202 and the partition support 201. The partition wall support 201 is made of a rigid body to support the entire force. For example, a metal such as stainless steel. Although not shown in the drawing, the partition wall support 201 is fixed to the support substrate 101 by some means. The fixing means may be screwed, but when mass production is considered, a one-touch attachment / detachment mechanism is preferable for eliminating the trouble of assembly and disassembly or for mechanization.

The partition wall 202 is flexible. In the case of this embodiment, a resin having heat resistance and releasability, for example, a silicone resin is preferable. The partition 202 having a shape as shown in the figure can be easily formed by molding using a mold. Bump component 10
4 is the same as that described with reference to FIG.

In the present embodiment, the space 107 in the partition is depressurized by the depressurizing pipe 204 with some contrivance. The pressurizing pipe 205 pressurizes the partition outer space 108. The bump component 104 is pressed against the wiring board 102 by the pressure difference between the inside and outside of the partition. In this state, the underfill can be injected from the injection pipe 203 into the space 107 in the partition. At this time, it is better to pressurize the partition outer space 108. In the case where a flexible wiring board is used as the wiring board 102, if the partition outside space 108
Is performed without applying pressure, the force for pressing the partition wall 202, the bump component 104, and the wiring board 102 is lost, so that deformation is allowed, and the yield decreases.

When the depressurizing pipe 204 is depressurizing the space 107 in the partition, the injection pipe 2 is used to maintain airtightness.
03 is preferably closed. Further, it is preferable that the entirety including the support substrate 101 and the partition wall support 201 (hereinafter, referred to as a jig) is independent of the decompression pipe 204, the pressurization pipe 205, and the injection pipe 203.

That is, as can be easily read from the figure, the present embodiment is devised and uses a rubber stopper and a needle pipe. The tips of the pipes 203, 204, 205 are formed to be sharp by cutting diagonally, and this is inserted into and removed from rubber. For the pressurizing pipe 205, a rubber stopper 206 is provided at the opening of the partition wall support 201. For the injection pipe 203 and the pressure reducing pipe 204, a hole 207 through which the pipe can pass is provided in the partition wall support 201, and a thick portion of the partition wall 202 below the hole 207 is used as a rubber stopper. Depressurization, pressurization and injection can be performed by inserting a needle pipe through the rubber stopper, and airtightness inside and outside the partition can be maintained by removing the needle pipe. Therefore, the entire jig can be separated from a pipe or the like and put into a furnace to cure the adhesive, solder, underfill and the like. This is important in simplifying mass production equipment.

The steps in the case where the above-described mounting method by stud bump bonding is executed using the present invention will be described. The tip of the bump of the bumped semiconductor chip (the bump component in the present invention) is brought into contact with a conductive adhesive thinly spread on a flat plate, and the conductive adhesive is supplied onto the bump. Then, with the bumps facing down, they are positioned and mounted on the electrodes 103 on the wiring board 102 placed on the support substrate 101 in FIG.

Next, a partition support 201 (hereinafter referred to as an upper jig) including the partition 202 shown in FIG. 2 is covered, a pressurizing pipe 205 is inserted, and pressurized air is sent into the partition outer space 108. Pull out the pipe 205. Rubber stopper 20
6, the pressing force is maintained even after that, and the semiconductor chip 1
04 is pressed down, the wiring board 102 becomes flat, and uniform connection is maintained. In this state, the conductive adhesive is put into a heating furnace to be dried, cured, or melted. Naturally, it may be a batch furnace or an inline belt furnace.

Next, the pressure inside the partition wall space 107 is reduced by inserting the pressure reducing pipe 204,
And inject the underfill. Partition wall space 1
If 07 is filled with the underfill, the injection is stopped, and the decompression pipe 204 and the injection pipe 203 are pulled out and put into a heating furnace for underfill hardening, thereby completing the mounting process. The partition 202 is made of a material (for example, silicone resin or the like) to which the underfill does not adhere, so that the upper jig can be easily removed. This is also important for the mass production process. The obtained bump component mounted body may be cut and separated as necessary.

If the partition wall support 201 and the partition wall 202 are made of a transparent material, the bump component 104 is heated by irradiating light instead of being put into a heating furnace, and the heat is applied to the conductive adhesive or underfill. Curing can take place.

FIG. 3 is an enlarged sectional view of the bump portion of the bump component mounted body obtained in this manner. In FIG. 3, reference numeral 104a denotes an electrode of the bump component 104; 105, a bump (stud bump) formed on the electrode 104a;
Numeral 11 denotes a conductive adhesive for connecting the bump 105 and the electrode 103 of the wiring board 102, and numeral 212 denotes an underfill filled between the bump component 104 and the wiring board 102.

In the mounting method described above, the conductive adhesive may be applied not to the bumps of the bump component but to the electrodes of the wiring board. FIG.
5 shows a case where the stud bump 5 is a two-stage stud bump. However, the bump 105 is not limited to the stud bump, and a single-stage bump such as a columnar or spherical shape may be used.

Further, the present invention relates to a method for mounting a bump component having a solder bump such as a CSP or a BGA package on a wiring board 10.
2 is the same. A solder paste is printed on the electrode 103 instead of the conductive adhesive, and after mounting the CSP or BGA, the upper jig is covered. And
After pressurizing the space 108 outside the partition wall, it is heated. The drying and hardening step of the conductive adhesive may be a heat melting (reflow) step. There is no connection instability because the BGA or CSP is pressed from above. If further underfill is required, the same steps as described above may be performed. If cleaning is required after the reflow step, the cleaning liquid may be poured into the partition wall space 107 from one pipe and sucked from the other pipe in the same manner as in the underfill injection step. Since the cleaning liquid is not exposed to the outside, it is also useful for reducing pollution problems.

FIG. 4 is an enlarged sectional view of the bump portion of the bump component mounted body obtained in this manner. In FIG. 4, reference numeral 215 denotes a solder bump, which passes through a reflow process to form the electrode 104a of the bump component 104 and the wiring board 102.
Electrode 103 is connected. 212 is a bump part 1
This is an underfill filled between the wiring substrate 104 and the wiring substrate 102. Since the solder bump 215 has a large mechanical strength, the underfill 212 may not be injected in some cases.

Further, an adhesive such as ACF, ACP, NCP or the like can be used. In this case, the following may be performed.

A mounting method using the ACF will be described with reference to FIGS. First, the wiring substrate 102 is mounted on the support substrate 101 in a manner similar to the mounting method described above. Next, as shown in FIG. 5, the ACF 220 is mounted on the electrode 103 of the wiring board 102. ACF220 is adhesive resin component 2
21 is a self-supporting film in which conductive fine particles 222 are dispersed and contained. Next, bump component 1
04 is positioned and placed on the ACF 220. Next, an upper jig is put on and the space 108 outside the partition wall is pressurized. Then, the ACF 220 is put into a heating furnace to cure or melt the ACF 220. Thereafter, by removing the upper jig, a bump component mounted body is obtained. FIG. 6 is a sectional view of a principal part of the obtained bump component mounted body. Due to the pressure difference applied to both sides of the partition 202,
While the bump 105 is pressed into the ACF 220,
The ACF 220 is pressurized and deformed to fill the gap between the bump component 104 and the wiring board 102 without any gap. At this time,
The conductive fine particles 222 between the bump 105 and the electrode 103 of the wiring board 102 come into contact with each other, and an electrical connection between the bump 105 and the electrode 103 is obtained.

Next, a mounting method using the ACP will be described. ACP is a paste in which conductive fine particles are dispersed and contained in an adhesive resin component similarly to ACF. At first,
ACP is placed on a wiring board 102 placed on a support substrate 101.
At a predetermined location. It may be provided on the bump component 104 side. Next, similarly to the case of the ACF, the bump component 104 is positioned and placed on the wiring board 102. Thereafter, the same steps as in the case of the ACF are performed. In this manner, a bump component mounted body similar to the ACF bump component mounted body shown in FIG. 6 is obtained.

Next, a mounting method using the NCP will be described with reference to FIGS. NCP is a paste made of an adhesive resin having insulating properties, and does not contain conductive fine particles unlike ACP. First, the wiring substrate 102 is placed on the support substrate 101. Next, as shown in FIG.
P225 is applied to a predetermined portion of the wiring board 102. It may be provided on the bump component 104 side. Next, the ACP
As in the case of (1), the bump component 104 is positioned and placed on the wiring board 102. Thereafter, the same steps as in the case of the ACF are performed. FIG. 8 is a sectional view of a main part of the obtained bump component mounted body. The bumps 105 are pressed into the NCP 225 by the pressure difference applied to both sides of the partition wall 202, and the NCP 225 is pressed and deformed to fill the gap between the bump component 104 and the wiring board 102 without any gap. Unlike the case of the ACF or the ACP shown in FIG. 6, an electrical connection is obtained by the bump 105 being in direct contact with the electrode 103.

When the above-mentioned ACF, ACP, and NCP are used, they also serve as an underfill, so that the step of injecting the underfill is unnecessary.

An excellent point of the present invention is that there is no unstable state due to the distortion of the wiring board 102 caused during the heating process or the handling after the mounting of the bump component 104.

In the description of the above embodiment, before mounting the upper jig, for example, when the bump component 104 is mounted on the wiring board 102, no force is exerted on the wiring board 102 to enforce flatness. If a forcing force is required at this time, the supporting substrate 101 may be made of a gas-permeable substrate, and the forcible force may be applied by adsorbing the wiring substrate 102 under reduced pressure. Even when the space 107 in the partition wall is depressurized and the underfill is injected, the wiring substrate 102 may be adsorbed under reduced pressure to prevent the warpage of the wiring substrate 102 at the time of injection.

If the wiring board 102 is drawn out of the upper jig, an electrical inspection of the circuit can be performed before the underfill is injected. If a connection failure is found, it can be easily repaired by removing the upper jig.

Although the present invention has been described using a jig as shown in FIG. 2 as a means for carrying out the present invention, many modifications of the jig and other realization methods are conceivable. For example, it is conceivable that the partition wall 202 is made of a thin film, and the partition wall 202 is brought into close contact with (or close to) the wiring board 102 between the adjacent bump components 104 by a pressure difference between both sides of the partition wall 202. Or,
As shown in FIG. 9, ribs 232 may be formed on the partition walls 202 so as to partition between the bump components 104. In FIG. 9, reference numeral 233 denotes a groove provided on the rib 232 for eliminating a pressure difference between adjacent spaces partitioned by the rib 232 or for injecting an underfill. As described above, almost no underfill is formed in a portion where the partition wall 202 is in close contact with (or close to) the wiring substrate 102 or in a portion where the rib 232 is provided. This part
When a bump component is mounted and then cut and separated for each bump component, it can be used as a cut for facilitating separation. Of course, such a configuration does not depart from the present invention.

FIG. 2 illustrates a jig into which one injection pipe 203, one pressure reduction pipe 204, and one pressure pipe 205 can be inserted.
The numbers and insertion positions of 04 and 205 are not limited to the configuration of FIG. In particular, the injection pipe 203 is disposed in the center or in a plurality of different places in consideration of the shape of the space 107 in the partition wall and the arrangement of the bump parts 104, so that the injection speed of the underfill is reduced. In some cases, effects can be obtained for improving the quality and preventing the occurrence of unfilled portions.

The bump component 104 is connected to the wiring board 102.
After placing it on the top jig, place the bump component 1
A sheet may be interposed between the partition 04 and the partition 202. Thereby, for example, it is possible to prevent the underfill from adhering to the partition wall 202. Alternatively, the upper jig can be easily separated. Alternatively, by printing or the like on the sheet-like material and integrating it with the underfill, the sheet-like material can be finally obtained as an exterior film of the bump component mounting body. As such a sheet-like material, a resin film such as a polyester film or a polyimide film can be used according to the purpose or use, and the surface may be subjected to a surface treatment such as a release treatment.

The pressure difference on both sides of the partition wall 202 applied to press the bump component 104 against the wiring board 102 is appropriately set according to the connection method between the bump component 104 and the wiring board 102. For example, when connecting via a conductive adhesive, the pressure difference is set so that a force of 0.01 to 0.2 N per bump is applied. In the case of connection via the ACF, a large force is required because the ACF needs to be deformed. For example, the pressure difference is set so that a force of about 1 N is applied per bump.

In the above description, the case where bump components having the same height are mounted has been described. However, the present invention can be applied to the case where bump components having different heights are mounted. Further, the present invention can be applied to a case where a chip capacitor, a chip resistor, or the like, which is a general surface mount electronic component having no bump, is mounted together with the bump component.

FIG. 10 shows bump components 10 having different heights.
It is the schematic sectional drawing which showed the manufacturing method of the mounted body when mounting 4,104 'together. FIG. 11 is a schematic cross-sectional view showing a method of manufacturing a mounted body when the bump component 104 and general electronic components for surface mounting 241, 242, 243 such as chip capacitors and chip resistors are mounted together. . As shown in FIGS. 10 and 11, even when components having different heights are mixed, the partition wall 106 is flexibly deformed according to the height of the components. it can.

The surface of the partition wall on the space side in the partition wall may be processed (formed) in advance according to the height of the upper surface of the component. For example, as shown in FIG. 12A, the concave portion 25 is provided on one surface of the partition wall 250 at a position corresponding to a mounting position of a high component.
1 is formed in advance. In this way, as shown in FIG. 12B, a pressing force can be applied to the low bump component 104 arranged close to the high electronic component 245. FIG.
Unlike A, a protrusion that can press the component may be formed at a position corresponding to the mounting position of the component with a low partition.

Further, as is apparent from FIGS. 11 and 12B, the underfill is formed into the fillet shape around the high parts 241, 242, 243, and 245 by injecting the underfill into the space 107 inside the partition wall. be able to. Thereby, the mounting strength of these components can be reinforced.

FIG. 10, FIG. 11, and FIG. 12B conceptually show only the basic structure of the embodiment of the method of manufacturing a package according to the present invention, and the partitions shown in these figures are shown in FIG. Needless to say, the support may be held by the partition wall support as shown.

In the present invention, the partition is “flexible”
Is to be interpreted in a broad sense as is clear from the above description, and means that it has enough flexibility to be able to press the bump component in the space in the partition wall with the pressure difference between both sides. I do. Further, it is preferable that the wiring board has such a flexibility as to be pressed against the wiring board so as to be in close contact with the wiring board and to form an airtight partition space.

[0065]

As described above, according to the present invention,
There is no unstable state caused by the heat process after the mounting of the bump component, so that the mounting yield can be increased and a mounting method with lower cost can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating the principle of a method for manufacturing a bump component mounted body according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a more specific method of manufacturing a bump component mounted body according to an embodiment of the present invention.

FIG. 3 is a sectional view of a main part of a bump component mounted body of the present invention by stud bump bonding.

FIG. 4 is a sectional view of a main part of a mounting body according to the present invention of a bump component having a solder bump.

FIG. 5 is a cross-sectional view of a main part showing one step of a method of manufacturing a package according to the present invention using an ACF.

FIG. 6 is a sectional view of a main part of a bump component mounted body of the present invention using an ACF.

FIG. 7 is an essential part cross sectional view showing one step of a method of manufacturing a package of the present invention using NCP.

FIG. 8 is a sectional view of a main part of a bump component mounted body of the present invention using an NCP.

FIG. 9 is a cross-sectional view illustrating a method of manufacturing a bump component package according to another embodiment of the present invention.

FIG. 10 is a sectional view showing a basic configuration of another embodiment of the method for manufacturing a bump component mounted body of the present invention.

FIG. 11 is a sectional view showing a basic configuration of still another embodiment of the method for manufacturing a bump component mounted body of the present invention.

FIG. 12A is a cross-sectional view illustrating a partition used in still another embodiment of the method for manufacturing a bump component mounted body of the present invention, and FIG. 12B is a diagram illustrating a method for manufacturing a bump component mounted body using the partition. Sectional view showing basic configuration

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Support substrate 102 Wiring board 103 Electrode 104, 104 'Bump component 104a Electrode 105 Bump 106 Flexible partition 107 Internal space in partition 108 External space in partition 201 Partition support 202 Partition 203 Injecting pipe 204 Depressurizing pipe 205 Pressurizing pipe 206 Rubber Plug 207 Hole 211 Conductive Adhesive 212 Underfill 215 Solder Bump 220 ACF 221 Adhesive Resin Component 222 Conductive Fine Particle 225 NCP 232 Rib 233 Groove 241, 242, 243, 245 Surface Mount Electronic Component 250 Partition 251 Depression

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Claims (22)

[Claims] 1. A method of manufacturing a bump component mounted body, comprising: at least a step of pressing a bump component by a pressure difference applied to both sides of a flexible partition wall provided so as to cover a plurality of bump components mounted on a wiring board. Method. 2. The method according to claim 1, further comprising a step of heating the bump component while pressing the bump component by a pressure difference. 3. The method according to claim 1, further comprising the step of cutting the wiring board. 4. The method according to claim 1, wherein at least one of the plurality of bump components has a different height from other bump components. 5. The method according to claim 1, further comprising mounting an electronic component other than the bump component together with the bump component on the wiring board. 6. A space in a partition formed by a flexible partition and a wiring board provided so as to cover a bump component mounted on a wiring board, and a pressure in a partition inside space is reduced, and an underfill is injected into the space in the partition during or after the pressure reduction. A method for manufacturing a bump component mounted body, comprising at least a step. 7. A step of flip-mounting a plurality of bump components on a wiring board, a step of covering the plurality of bump components with a flexible partition, and forming a space in the partition between the partition and the wiring board. Applying a pressure difference to both sides of the partition wall to press the bump component against the wiring board. 8. The method according to claim 8, further comprising: applying a conductive adhesive to the bump of the bump component or the electrode of the wiring board before the flip-mounting step. Drying, curing, or melting the conductive adhesive in a state; depressurizing the space in the partition wall; injecting an underfill into the space in the partition wall during or after decompression; and curing the underfill. The method according to claim 7, further comprising the steps of: 9. The method for manufacturing a bump component mounted body according to claim 8, wherein in the step of injecting the underfill, a space of the partition wall opposite to the space in the partition wall is pressurized. 10. The method of manufacturing a bump component mounted body according to claim 7, wherein the bump component includes a solder bump, and further comprising, after the pressing step, a step of melting the solder bump in the pressed state. . 11. The flip mounting step,
8. The method according to claim 7, further comprising: interposing an adhesive between the bump component and the wiring board; and, after the pressing, drying, curing, or melting the adhesive in the pressed state. 9. Of manufacturing a bump component mounted body. 12. The method according to claim 7, further comprising the step of cutting the wiring board. 13. The method according to claim 7, wherein a sheet-like material is interposed between the bump component and the partition. 14. The method according to claim 7, wherein at least one of the plurality of bump components has a different height from other bump components. 15. The method according to claim 7, further comprising a step of mounting an electronic component other than the bump component on the wiring board before the step of forming the space in the partition. . 16. A support substrate for mounting a wiring board, a flexible partition, a partition support for holding the partition, and a sealed space formed between the partition and the partition support. An apparatus for manufacturing a bump component mounted body, comprising: 17. When the partition support holding the partition and the support substrate are integrated with the wiring substrate interposed therebetween,
17. The manufacturing apparatus for a bump component mounted body according to claim 16, wherein a space inside the partition wall is hermetically sealed by the partition wall and the wiring board. 18. The apparatus for manufacturing a bump component mounted body according to claim 16, further comprising a rubber stopper for inserting a pressurizing pipe for pressurizing a closed space formed by the partition and the partition support. 19. The apparatus for manufacturing a bump component mounted body according to claim 17, further comprising a rubber stopper for inserting a decompression pipe for decompressing the space in the partition wall. 20. The apparatus for manufacturing a bump component mounted body according to claim 17, further comprising a rubber stopper for inserting an injection pipe for injecting an underfill into the space in the partition. 21. The apparatus according to claim 16, wherein the support substrate holds the wiring substrate by suction. 22. When a partition support holding the partition and the support substrate are integrated with the wiring substrate interposed therebetween,
17. The apparatus for manufacturing a bump component mounted body according to claim 16, wherein a part of the wiring of the wiring board is exposed.