JP5067247B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP5067247B2
JP5067247B2 JP2008102128A JP2008102128A JP5067247B2 JP 5067247 B2 JP5067247 B2 JP 5067247B2 JP 2008102128 A JP2008102128 A JP 2008102128A JP 2008102128 A JP2008102128 A JP 2008102128A JP 5067247 B2 JP5067247 B2 JP 5067247B2
Authority
JP
Japan
Prior art keywords
flexible layer
electrode pad
adhesive
bump
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008102128A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009253182A5 (https=
JP2009253182A (ja
Inventor
昇 朝日
卓哉 西山
敏央 野中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2008102128A priority Critical patent/JP5067247B2/ja
Publication of JP2009253182A publication Critical patent/JP2009253182A/ja
Publication of JP2009253182A5 publication Critical patent/JP2009253182A5/ja
Application granted granted Critical
Publication of JP5067247B2 publication Critical patent/JP5067247B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Wire Bonding (AREA)
JP2008102128A 2008-04-10 2008-04-10 電子装置 Expired - Fee Related JP5067247B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008102128A JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008102128A JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Publications (3)

Publication Number Publication Date
JP2009253182A JP2009253182A (ja) 2009-10-29
JP2009253182A5 JP2009253182A5 (https=) 2011-05-26
JP5067247B2 true JP5067247B2 (ja) 2012-11-07

Family

ID=41313562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008102128A Expired - Fee Related JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Country Status (1)

Country Link
JP (1) JP5067247B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736056B (zh) * 2019-10-29 2025-03-21 浙江荷清柔性电子技术有限公司 柔性芯片封装结构、柔性芯片的封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939849B2 (ja) * 1998-03-10 2007-07-04 日東電工株式会社 半導体装置の製法
JP4525148B2 (ja) * 2004-04-13 2010-08-18 ソニー株式会社 半導体装置およびその製造方法
JP4631742B2 (ja) * 2006-02-27 2011-02-16 エプソンイメージングデバイス株式会社 電気光学装置、実装構造体、電気光学装置の製造方法及び電子機器
JP4920330B2 (ja) * 2006-07-18 2012-04-18 ソニー株式会社 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法

Also Published As

Publication number Publication date
JP2009253182A (ja) 2009-10-29

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