JP2009253182A5 - - Google Patents

Download PDF

Info

Publication number
JP2009253182A5
JP2009253182A5 JP2008102128A JP2008102128A JP2009253182A5 JP 2009253182 A5 JP2009253182 A5 JP 2009253182A5 JP 2008102128 A JP2008102128 A JP 2008102128A JP 2008102128 A JP2008102128 A JP 2008102128A JP 2009253182 A5 JP2009253182 A5 JP 2009253182A5
Authority
JP
Japan
Prior art keywords
electronic device
island
electrode pad
flexible layer
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008102128A
Other languages
English (en)
Japanese (ja)
Other versions
JP5067247B2 (ja
JP2009253182A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008102128A priority Critical patent/JP5067247B2/ja
Priority claimed from JP2008102128A external-priority patent/JP5067247B2/ja
Publication of JP2009253182A publication Critical patent/JP2009253182A/ja
Publication of JP2009253182A5 publication Critical patent/JP2009253182A5/ja
Application granted granted Critical
Publication of JP5067247B2 publication Critical patent/JP5067247B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008102128A 2008-04-10 2008-04-10 電子装置 Expired - Fee Related JP5067247B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008102128A JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008102128A JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Publications (3)

Publication Number Publication Date
JP2009253182A JP2009253182A (ja) 2009-10-29
JP2009253182A5 true JP2009253182A5 (https=) 2011-05-26
JP5067247B2 JP5067247B2 (ja) 2012-11-07

Family

ID=41313562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008102128A Expired - Fee Related JP5067247B2 (ja) 2008-04-10 2008-04-10 電子装置

Country Status (1)

Country Link
JP (1) JP5067247B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736056B (zh) * 2019-10-29 2025-03-21 浙江荷清柔性电子技术有限公司 柔性芯片封装结构、柔性芯片的封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939849B2 (ja) * 1998-03-10 2007-07-04 日東電工株式会社 半導体装置の製法
JP4525148B2 (ja) * 2004-04-13 2010-08-18 ソニー株式会社 半導体装置およびその製造方法
JP4631742B2 (ja) * 2006-02-27 2011-02-16 エプソンイメージングデバイス株式会社 電気光学装置、実装構造体、電気光学装置の製造方法及び電子機器
JP4920330B2 (ja) * 2006-07-18 2012-04-18 ソニー株式会社 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法

Similar Documents

Publication Publication Date Title
JP2009117703A5 (https=)
JP2010272681A5 (https=)
JP2007059916A5 (https=)
JP2017531323A5 (https=)
JP2014515187A5 (https=)
JP2008016519A5 (https=)
JP2008217776A5 (https=)
JP2010245455A5 (ja) 基板
GB2476840B (en) Electronic paper panel and method of manufacturing the same and electronic paper display device having the same
JP2016072493A5 (https=)
JP2008294014A5 (https=)
JP2009283902A5 (https=)
JP2009110983A5 (https=)
JP2014165238A5 (https=)
CN103596352B (zh) 软性电路板装置及相机模组
JP2020522117A5 (https=)
TW200620502A (en) Semiconductor device, circuit board, electro-optic device, electronic device
EP2017883A3 (en) Electronic device manufacturing method and electronic device
JP2016510513A5 (https=)
JP2011003764A5 (ja) 半導体装置
CN203691751U (zh) 印刷电路板和显示装置
JP2009253182A5 (https=)
JP2014112694A5 (https=)
TW201606947A (zh) 晶片之正、背面間電性連接結構及其製造方法
JP2006073805A5 (https=)