JP5057824B2 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
- Publication number
- JP5057824B2 JP5057824B2 JP2007098046A JP2007098046A JP5057824B2 JP 5057824 B2 JP5057824 B2 JP 5057824B2 JP 2007098046 A JP2007098046 A JP 2007098046A JP 2007098046 A JP2007098046 A JP 2007098046A JP 5057824 B2 JP5057824 B2 JP 5057824B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- manufacturing
- semiconductor
- electronic component
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 68
- 230000005291 magnetic effect Effects 0.000 claims description 145
- 239000004065 semiconductor Substances 0.000 claims description 112
- 239000000463 material Substances 0.000 claims description 74
- 238000000034 method Methods 0.000 claims description 57
- 239000000696 magnetic material Substances 0.000 claims description 25
- 238000005498 polishing Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 13
- 238000005304 joining Methods 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000000638 solvent extraction Methods 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910000976 Electrical steel Inorganic materials 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004839 Moisture curing adhesive Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007098046A JP5057824B2 (ja) | 2007-04-04 | 2007-04-04 | 電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007098046A JP5057824B2 (ja) | 2007-04-04 | 2007-04-04 | 電子部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008257420A JP2008257420A (ja) | 2008-10-23 |
| JP2008257420A5 JP2008257420A5 (https=) | 2010-05-20 |
| JP5057824B2 true JP5057824B2 (ja) | 2012-10-24 |
Family
ID=39980946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007098046A Active JP5057824B2 (ja) | 2007-04-04 | 2007-04-04 | 電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5057824B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020074054A (ja) * | 2017-02-01 | 2020-05-14 | 株式会社村田製作所 | Ｒｆｉｄタグの製造方法、ｒｆｉｄタグの製造装置、及び転写シートの製造方法 |
| TW202046382A (zh) * | 2017-11-27 | 2020-12-16 | 日商尼康股份有限公司 | 發光元件與顯示裝置及其製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4082031B2 (ja) * | 2002-01-17 | 2008-04-30 | ソニー株式会社 | 素子の配列方法、及び表示装置 |
| JP2006139394A (ja) * | 2004-11-10 | 2006-06-01 | Osaka Sealing Printing Co Ltd | 微小構造体付きシートの製造装置及び微小構造体付きシートの製造方法 |
-
2007
- 2007-04-04 JP JP2007098046A patent/JP5057824B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008257420A (ja) | 2008-10-23 |
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