JP5056553B2 - 金属箔張り積層板およびプリント配線板 - Google Patents

金属箔張り積層板およびプリント配線板 Download PDF

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Publication number
JP5056553B2
JP5056553B2 JP2008100486A JP2008100486A JP5056553B2 JP 5056553 B2 JP5056553 B2 JP 5056553B2 JP 2008100486 A JP2008100486 A JP 2008100486A JP 2008100486 A JP2008100486 A JP 2008100486A JP 5056553 B2 JP5056553 B2 JP 5056553B2
Authority
JP
Japan
Prior art keywords
metal foil
resin
clad laminate
fiber base
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008100486A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009190387A (ja
JP2009190387A5 (enrdf_load_stackoverflow
Inventor
一雅 竹内
真樹 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008100486A priority Critical patent/JP5056553B2/ja
Publication of JP2009190387A publication Critical patent/JP2009190387A/ja
Publication of JP2009190387A5 publication Critical patent/JP2009190387A5/ja
Application granted granted Critical
Publication of JP5056553B2 publication Critical patent/JP5056553B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2008100486A 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板 Expired - Fee Related JP5056553B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008100486A JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007103784 2007-04-11
JP2007103784 2007-04-11
JP2008006101 2008-01-15
JP2008006101 2008-01-15
JP2008100486A JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Publications (3)

Publication Number Publication Date
JP2009190387A JP2009190387A (ja) 2009-08-27
JP2009190387A5 JP2009190387A5 (enrdf_load_stackoverflow) 2011-03-31
JP5056553B2 true JP5056553B2 (ja) 2012-10-24

Family

ID=39863914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008100486A Expired - Fee Related JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Country Status (3)

Country Link
JP (1) JP5056553B2 (enrdf_load_stackoverflow)
TW (1) TW200908821A (enrdf_load_stackoverflow)
WO (1) WO2008126817A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568587B (zh) * 2011-04-14 2017-02-01 住友電木股份有限公司 積層板，電路基板，半導體封裝及積層板之製造方法
CN104871653A (zh) * 2012-12-05 2015-08-26 住友电木株式会社 带树脂层的金属层、层叠体、电路基板以及半导体装置
JP6269506B2 (ja) * 2012-12-18 2018-01-31 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
JP6735505B2 (ja) 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
CN114845874B (zh) * 2019-12-17 2024-08-23 三菱瓦斯化学株式会社 树脂片和印刷电路板
CN116080157B (zh) * 2022-11-16 2023-08-04 广东威世新材料有限公司 一种印制电路用覆铜箔环氧玻纤布层压板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190347A (ja) * 1984-03-10 1985-09-27 松下電工株式会社 電気用積層板
TW224561B (enrdf_load_stackoverflow) * 1991-06-04 1994-06-01 Akocho Co
JPH0818402B2 (ja) * 1993-06-03 1996-02-28 日本ピラー工業株式会社 積層板および積層板用混合フィルム
JP4455806B2 (ja) * 2001-05-24 2010-04-21 日立化成工業株式会社 プリプレグ及び積層板
JP5241992B2 (ja) * 2004-03-05 2013-07-17 日立化成株式会社 プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板
JP4517749B2 (ja) * 2004-04-12 2010-08-04 日立化成工業株式会社 プリプレグ並びにこれを用いた金属張積層板及び印刷回路板
JP4590982B2 (ja) * 2004-04-21 2010-12-01 日立化成工業株式会社 樹脂付き金属箔

Also Published As

Publication number Publication date
TW200908821A (en) 2009-02-16
WO2008126817A1 (ja) 2008-10-23
JP2009190387A (ja) 2009-08-27

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