TW200908821A - Metallic foil-clad laminate plate and printed wiring board - Google Patents
Metallic foil-clad laminate plate and printed wiring board Download PDFInfo
- Publication number
- TW200908821A TW200908821A TW97112863A TW97112863A TW200908821A TW 200908821 A TW200908821 A TW 200908821A TW 97112863 A TW97112863 A TW 97112863A TW 97112863 A TW97112863 A TW 97112863A TW 200908821 A TW200908821 A TW 200908821A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- metal foil
- clad laminate
- substrate
- resin composition
- Prior art date
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- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007103784 | 2007-04-11 | ||
| JP2008006101 | 2008-01-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200908821A true TW200908821A (en) | 2009-02-16 |
Family
ID=39863914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97112863A TW200908821A (en) | 2007-04-11 | 2008-04-09 | Metallic foil-clad laminate plate and printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5056553B2 (enrdf_load_stackoverflow) |
| TW (1) | TW200908821A (enrdf_load_stackoverflow) |
| WO (1) | WO2008126817A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI568587B (zh) * | 2011-04-14 | 2017-02-01 | 住友電木股份有限公司 | 積層板，電路基板，半導體封裝及積層板之製造方法 |
| CN104871653A (zh) * | 2012-12-05 | 2015-08-26 | 住友电木株式会社 | 带树脂层的金属层、层叠体、电路基板以及半导体装置 |
| JP6269506B2 (ja) * | 2012-12-18 | 2018-01-31 | 日立化成株式会社 | 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法 |
| JP6735505B2 (ja) | 2016-09-06 | 2020-08-05 | パナソニックＩｐマネジメント株式会社 | プリント配線板、プリント回路板、プリプレグ |
| CN114845874B (zh) * | 2019-12-17 | 2024-08-23 | 三菱瓦斯化学株式会社 | 树脂片和印刷电路板 |
| CN116080157B (zh) * | 2022-11-16 | 2023-08-04 | 广东威世新材料有限公司 | 一种印制电路用覆铜箔环氧玻纤布层压板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190347A (ja) * | 1984-03-10 | 1985-09-27 | 松下電工株式会社 | 電気用積層板 |
| TW224561B (enrdf_load_stackoverflow) * | 1991-06-04 | 1994-06-01 | Akocho Co | |
| JPH0818402B2 (ja) * | 1993-06-03 | 1996-02-28 | 日本ピラー工業株式会社 | 積層板および積層板用混合フィルム |
| JP4455806B2 (ja) * | 2001-05-24 | 2010-04-21 | 日立化成工業株式会社 | プリプレグ及び積層板 |
| JP5241992B2 (ja) * | 2004-03-05 | 2013-07-17 | 日立化成株式会社 | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 |
| JP4517749B2 (ja) * | 2004-04-12 | 2010-08-04 | 日立化成工業株式会社 | プリプレグ並びにこれを用いた金属張積層板及び印刷回路板 |
| JP4590982B2 (ja) * | 2004-04-21 | 2010-12-01 | 日立化成工業株式会社 | 樹脂付き金属箔 |
-
2008
- 2008-04-07 WO PCT/JP2008/056852 patent/WO2008126817A1/ja active Application Filing
- 2008-04-08 JP JP2008100486A patent/JP5056553B2/ja not_active Expired - Fee Related
- 2008-04-09 TW TW97112863A patent/TW200908821A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008126817A1 (ja) | 2008-10-23 |
| JP2009190387A (ja) | 2009-08-27 |
| JP5056553B2 (ja) | 2012-10-24 |
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