JP5054413B2 - アンテナ素子及び半導体装置 - Google Patents

アンテナ素子及び半導体装置 Download PDF

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Publication number
JP5054413B2
JP5054413B2 JP2007102501A JP2007102501A JP5054413B2 JP 5054413 B2 JP5054413 B2 JP 5054413B2 JP 2007102501 A JP2007102501 A JP 2007102501A JP 2007102501 A JP2007102501 A JP 2007102501A JP 5054413 B2 JP5054413 B2 JP 5054413B2
Authority
JP
Japan
Prior art keywords
antenna
silicon substrate
layer
signal input
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007102501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008263263A (ja
JP2008263263A5 (https=
Inventor
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007102501A priority Critical patent/JP5054413B2/ja
Priority to KR1020080032754A priority patent/KR20080092278A/ko
Priority to TW097112859A priority patent/TW200847386A/zh
Priority to US12/099,983 priority patent/US8018392B2/en
Publication of JP2008263263A publication Critical patent/JP2008263263A/ja
Publication of JP2008263263A5 publication Critical patent/JP2008263263A5/ja
Application granted granted Critical
Publication of JP5054413B2 publication Critical patent/JP5054413B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Transceivers (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
JP2007102501A 2007-04-10 2007-04-10 アンテナ素子及び半導体装置 Expired - Fee Related JP5054413B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007102501A JP5054413B2 (ja) 2007-04-10 2007-04-10 アンテナ素子及び半導体装置
KR1020080032754A KR20080092278A (ko) 2007-04-10 2008-04-08 안테나 소자 및 반도체 장치
TW097112859A TW200847386A (en) 2007-04-10 2008-04-09 Antenna element and semiconductor device
US12/099,983 US8018392B2 (en) 2007-04-10 2008-04-09 Antenna element and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007102501A JP5054413B2 (ja) 2007-04-10 2007-04-10 アンテナ素子及び半導体装置

Publications (3)

Publication Number Publication Date
JP2008263263A JP2008263263A (ja) 2008-10-30
JP2008263263A5 JP2008263263A5 (https=) 2010-04-08
JP5054413B2 true JP5054413B2 (ja) 2012-10-24

Family

ID=39985455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007102501A Expired - Fee Related JP5054413B2 (ja) 2007-04-10 2007-04-10 アンテナ素子及び半導体装置

Country Status (4)

Country Link
US (1) US8018392B2 (https=)
JP (1) JP5054413B2 (https=)
KR (1) KR20080092278A (https=)
TW (1) TW200847386A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373508B2 (en) * 2012-06-27 2019-08-06 Intel Corporation Devices, systems, and methods for enriching communications
JP2014170811A (ja) * 2013-03-01 2014-09-18 Sony Corp ＣＳＰ（ＣｈｉｐＳｉｚｅＰａｃｋａｇｅ）
US20150325534A1 (en) * 2014-05-09 2015-11-12 Samsung Electro-Mechanics Co., Ltd. Semiconductor package for radio communication and method of manufacturing the same
WO2016130090A1 (en) * 2015-02-13 2016-08-18 Nanyang Technological University Semiconductor arrangement and method for fabricating thereof
USD913256S1 (en) * 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier
USD926716S1 (en) * 2019-07-31 2021-08-03 Eryn Smith Antenna pattern for a semiconductive substrate carrier
KR20220066536A (ko) 2020-11-16 2022-05-24 삼성전기주식회사 안테나 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3196451B2 (ja) * 1993-10-28 2001-08-06 株式会社村田製作所 マイクロストリップアンテナ
JP3417729B2 (ja) * 1995-06-09 2003-06-16 東光株式会社 平面アンテナ
JP3313045B2 (ja) * 1997-04-17 2002-08-12 松下電器産業株式会社 半導体装置
JP4183218B2 (ja) 1999-10-18 2008-11-19 Ｔｄｋ株式会社 チップアンテナの製造方法
JP4010881B2 (ja) * 2002-06-13 2007-11-21 新光電気工業株式会社 半導体モジュール構造
JP2004327568A (ja) * 2003-04-23 2004-11-18 Japan Science & Technology Agency 半導体装置
US7742000B2 (en) * 2005-05-31 2010-06-22 Tialinx, Inc. Control of an integrated beamforming array using near-field-coupled or far-field-coupled commands
JP4749795B2 (ja) * 2005-08-05 2011-08-17 新光電気工業株式会社 半導体装置
JP4876491B2 (ja) * 2005-09-02 2012-02-15 株式会社村田製作所 誘電体アンテナ
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
EP2002508A1 (en) * 2006-03-17 2008-12-17 Nxp B.V. Antenna device and rf communication equipment
JP5029605B2 (ja) * 2006-04-03 2012-09-19 パナソニック株式会社 アンテナ内蔵半導体メモリモジュール

Also Published As

Publication number Publication date
JP2008263263A (ja) 2008-10-30
US8018392B2 (en) 2011-09-13
US20090009402A1 (en) 2009-01-08
KR20080092278A (ko) 2008-10-15
TW200847386A (en) 2008-12-01

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