JP5047923B2 - 化学気相蒸着用ウェーハ及びこれを製造する方法 - Google Patents
化学気相蒸着用ウェーハ及びこれを製造する方法 Download PDFInfo
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- JP5047923B2 JP5047923B2 JP2008269387A JP2008269387A JP5047923B2 JP 5047923 B2 JP5047923 B2 JP 5047923B2 JP 2008269387 A JP2008269387 A JP 2008269387A JP 2008269387 A JP2008269387 A JP 2008269387A JP 5047923 B2 JP5047923 B2 JP 5047923B2
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- 238000005229 chemical vapour deposition Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000151 deposition Methods 0.000 claims description 22
- 238000000926 separation method Methods 0.000 claims description 22
- 230000008021 deposition Effects 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000012495 reaction gas Substances 0.000 claims description 8
- 239000013212 metal-organic material Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
図3は本発明による化学気相蒸着用ウェーハを図示した断面斜視図で、図4は本発明による化学気相蒸着用ウェーハがサセプタに搭載された状態図である。
32 サセプタ
33 ヒータ
100 ウェーハ
101 ウェーハ胴体
102 固定板
104 平面研磨材
105、115 駆動軸
114 曲面研磨材
122 離隔部
Claims (5)
- 反応ガスが供給される高温雰囲気の反応チャンバ内に設けられるサセプタのポケットに搭載され、少なくとも一つ以上の金属有機物が蒸着面に蒸着されるウェーハであって、
前記ポケットに搭載されるウェーハ胴体の下部面には、前記ポケットの底面と接触する外側の縁から前記ウェーハ胴体の中心に向かって前記ポケットの底面との一定の間隔を徐々に増大させるよう傾斜する離隔部を備え、
前記離隔部は、一定大きさの曲率を有する弧形断面状で備えられ、
前記離隔部と前記サセプタの底面との間の最大浮き上り高さは、前記ウェーハ胴体の最大厚さに対して20乃至40%の大きさで備えられ、
前記ウェーハ胴体の外周面と前記ポケットの内周面との間には、一定大きさの間隔が形成され、
前記ウェーハ胴体の外側の縁は、前記サセプタの底面と線接触或いは面接触し、
前記ウェーハ胴体の上部面は、平面状で備えられる
ことを特徴とする化学気相蒸着用ウェーハ。 - 一定厚さのウェーハ胴体を提供する段階と、
前記ウェーハ胴体の一側面を固定板に固定して外部露出されるウェーハ胴体の他側面を平面研磨材により平坦に研磨して蒸着面を形成する段階と、
前記ウェーハ胴体の蒸着面を固定板に固定して外部露出されるウェーハ胴体の一側面を曲面研磨材により一定大きさの曲率を有するよう曲面加工する段階と、を含む化学気相蒸着用ウェーハの製造方法。 - 前記曲面研磨材は、前記ウェーハ胴体の一側面と対応する前面が一定大きさの曲率半径を有する曲面状の円盤で備えられることを特徴とする請求項2に記載の化学気相蒸着用ウェーハの製造方法。
- 前記曲面研磨材は、駆動軸を前記ウェーハの胴体側に加圧する加圧力によって前記ウェーハ胴体の中心側に凸むよう弾性変形される円盤状の弾性板で備えられることを特徴とする請求項2または請求項3に記載の化学気相蒸着用ウェーハの製造方法。
- 前記ウェーハ胴体の一側面に曲面研磨される離隔部と前記ウェーハ胴体が搭載されるサセプタの底面との間の最大浮き上り高さは、前記ウェーハ胴体の最大厚さに対して20乃至40%の大きさで備えられることを特徴とする請求項2から請求項4の何れかに記載の化学気相蒸着用ウェーハの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0136263 | 2007-12-24 | ||
KR1020070136263A KR101038876B1 (ko) | 2007-12-24 | 2007-12-24 | 화학기상증착용 웨이퍼 및 이를 제조하는 방법 |
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JP2009152548A JP2009152548A (ja) | 2009-07-09 |
JP5047923B2 true JP5047923B2 (ja) | 2012-10-10 |
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JP2008269387A Active JP5047923B2 (ja) | 2007-12-24 | 2008-10-20 | 化学気相蒸着用ウェーハ及びこれを製造する方法 |
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JP (1) | JP5047923B2 (ja) |
KR (1) | KR101038876B1 (ja) |
Families Citing this family (4)
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KR101276747B1 (ko) * | 2011-11-14 | 2013-06-19 | 김선국 | 곡면 복원 장치 및 곡면 복원 방법 |
KR102280264B1 (ko) * | 2014-09-15 | 2021-07-22 | 삼성디스플레이 주식회사 | 화학기상증착장치 및 이를 이용한 디스플레이 장치 제조방법 |
KR101876838B1 (ko) * | 2016-11-18 | 2018-08-09 | 일진디스플레이(주) | 사파이어 웨이퍼 및 이를 제조하는 방법 |
EP3957776A1 (de) * | 2020-08-17 | 2022-02-23 | Siltronic AG | Verfahren zum abscheiden einer epitaktischen schicht auf einer substratscheibe |
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JPH065485A (ja) * | 1992-06-19 | 1994-01-14 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPH07249573A (ja) * | 1994-03-14 | 1995-09-26 | Nippon Steel Corp | 半導体基板の製造方法 |
JPH1154437A (ja) * | 1997-07-30 | 1999-02-26 | Kyocera Corp | 化合物半導体膜の形成方法 |
JP2006278523A (ja) * | 2005-03-28 | 2006-10-12 | Dowa Mining Co Ltd | ウェハ及びその製造方法、並びに半導体基板及びその製造方法 |
JP2007214368A (ja) * | 2006-02-09 | 2007-08-23 | Hitachi Cable Ltd | Movpe用化合物半導体ウェハ、その製造方法及びmovpe用化合物半導体エピタキシャルウェハの製造方法 |
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- 2007-12-24 KR KR1020070136263A patent/KR101038876B1/ko active IP Right Grant
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Publication number | Publication date |
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JP2009152548A (ja) | 2009-07-09 |
KR101038876B1 (ko) | 2011-06-02 |
KR20090068586A (ko) | 2009-06-29 |
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